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21. 发明授权

US09227841B2 Apparatus integrating microelectromechanical system device with circuit chip and methods for fabricating the same 有权
标题翻译：将微机电系统装置与电路芯片集成的装置及其制造方法
公开(公告)号：US09227841B2
公开(公告)日：2016-01-05
申请号：US14274118
申请日：2014-05-09
申请人： Chao Ta Huang , Shih Ting Lin , Yu Wen Hsu
发明人： Chao Ta Huang , Shih Ting Lin , Yu Wen Hsu
IPC分类号： H01L41/08 , B81C1/00 , B81B7/00 , H01L41/113 , H01L41/09
CPC分类号： B81C1/00134 , B81B7/0064 , B81C1/0023 , B81C2203/00 , B81C2203/0792 , H01L41/0933 , H01L41/1134 , H01L2224/11
摘要： One embodiment discloses an apparatus integrating a microelectromechanical system device with a circuit chip which includes a circuit chip, a microelectromechanical system device, a sealing ring, and a lid. The circuit chip comprises a substrate and a plurality of metal bonding areas. The substrate has an active surface with electrical circuit area, and the metal bonding areas are disposed on the active surface and electrically connected to the electrical circuits. The microelectromechanical system device comprises a plurality of bases and at least one sensing element. The bases are connected to at least one of the metal bonding areas. The at least one sensing element is elastically connected to the bases. The sealing ring surrounds the bases, and is connected to at least one of the metal bonding areas. The lid is opposite to the active surface of the circuit chip, and is connected to the sealing ring to have a hermetic chamber which seals the sensing element and the active surface of the circuit chip.
摘要翻译：一个实施例公开了一种将微机电系统装置与包括电路芯片，微机电系统装置，密封环和盖的电路芯片集成的装置。电路芯片包括基板和多个金属接合区域。基板具有具有电路面积的有源表面，并且金属接合区域设置在有源表面上并电连接到电路。微机电系统装置包括多个基座和至少一个感测元件。基底连接至至少一个金属接合区域。至少一个感测元件弹性地连接到基座。所述密封环围绕所述基部，并且与所述金属接合区域中的至少一个连接。盖与电路芯片的有效表面相对，并连接到密封环，以具有密封感测元件和电路芯片的有效表面的密封室。

22. 发明授权

US09133018B2 Structure and fabrication method of a sensing device 有权
标题翻译：感测装置的结构和制造方法
公开(公告)号：US09133018B2
公开(公告)日：2015-09-15
申请号：US12572277
申请日：2009-10-02
申请人： Lung-Tai Chen , Yu-Wen Hsu , Sheah Chen , Jing-Yuan Lin , Li-Chi Pan , Tzong-Che Ho
发明人： Lung-Tai Chen , Yu-Wen Hsu , Sheah Chen , Jing-Yuan Lin , Li-Chi Pan , Tzong-Che Ho
IPC分类号： B81B7/00
CPC分类号： B81B7/007 , B81B2201/0292 , B81B2207/093 , H01L2224/16225
摘要： A sensing device comprises a substrate having an upper surface, a sensor member, at least an external conductive wire, and a standing-ring member. The sensor member, the external conductive wire and the stand-ring member are on the upper surface. The sensor member is located at the central area on the upper surface, and the standing-ring member surrounds the sensor member. The standing-ring member and the sensor member are electrically connected through the at least an external conductive wire.
摘要翻译：感测装置包括具有上表面的基底，传感器构件，至少外部导电线和驻环构件。传感器构件，外部导电线和支架构件在上表面上。传感器构件位于上表面的中央区域，并且立环构件围绕传感器构件。站立环构件和传感器构件通过至少一个外部导线电连接。

23. 发明授权

US09046367B2 Micro-electro-mechanical-system device with oscillating assembly 有权
标题翻译：具有摆动组件的微机电系统装置
公开(公告)号：US09046367B2
公开(公告)日：2015-06-02
申请号：US13459270
申请日：2012-04-30
申请人： Chung-Yuan Su , Chao-Ta Huang , Shih-Chieh Lin , Yu-Wen Hsu
发明人： Chung-Yuan Su , Chao-Ta Huang , Shih-Chieh Lin , Yu-Wen Hsu
IPC分类号： G01C19/56 , G01C19/5747
CPC分类号： G01C19/5747
摘要： A micro-electro-mechanical-system (MEMS) device comprising two proof masses disposed in the first frame, such that the MEMS device with oscillating assemblies senses the angular velocity in the two axes, respectively. The MEMS device with oscillating assemblies further comprises a lever structure and two oscillating assemblies connecting at two opposite ends of the lever structure, such that the oscillating assemblies move in opposite directions synchronously. The MEMS device with oscillating assemblies further comprises a spring assembly connected between the proof mass and a movable electrode, restricting the proof mass to drive the movable electrode to only move in a specific direction.
摘要翻译：一种微电子机械系统（MEMS）装置，包括设置在第一框架中的两个检验质量块，使得具有振荡组件的MEMS装置分别感测两个轴中的角速度。具有摆动组件的MEMS装置还包括杠杆结构和在杠杆结构的两个相对端处连接的两个摆动组件，使得摆动组件沿相反方向同步地移动。具有振荡组件的MEMS装置还包括连接在检验质量块和可动电极之间的弹簧组件，限制了证明物质以驱动可移动电极仅沿特定方向移动。

24. 发明申请

US20140248731A1 APPARATUS INTEGRATING MICROELECTROMECHANICAL SYSTEM DEVICE WITH CIRCUIT CHIP AND METHODS FOR FABRICATING THE SAME 有权
标题翻译：具有电路芯片的装置集成微电子系统装置及其制造方法
公开(公告)号：US20140248731A1
公开(公告)日：2014-09-04
申请号：US14274118
申请日：2014-05-09
申请人： Chao Ta HUANG , Shih Ting LIN , Yu Wen HSU
发明人： Chao Ta HUANG , Shih Ting LIN , Yu Wen HSU
IPC分类号： B81C1/00
CPC分类号： B81C1/00134 , B81B7/0064 , B81C1/0023 , B81C2203/00 , B81C2203/0792 , H01L41/0933 , H01L41/1134 , H01L2224/11
摘要： One embodiment discloses an apparatus integrating a microelectromechanical system device with a circuit chip which includes a circuit chip, a microelectromechanical system device, a sealing ring, and a lid. The circuit chip comprises a substrate and a plurality of metal bonding areas. The substrate has an active surface with electrical circuit area, and the metal bonding areas are disposed on the active surface and electrically connected to the electrical circuits. The microelectromechanical system device comprises a plurality of bases and at least one sensing element. The bases are connected to at least one of the metal bonding areas. The at least one sensing element is elastically connected to the bases. The sealing ring surrounds the bases, and is connected to at least one of the metal bonding areas. The lid is opposite to the active surface of the circuit chip, and is connected to the sealing ring to have a hermetic chamber which seals the sensing element and the active surface of the circuit chip.
摘要翻译：一个实施例公开了一种将微机电系统装置与包括电路芯片，微机电系统装置，密封环和盖的电路芯片集成的装置。电路芯片包括基板和多个金属接合区域。基板具有具有电路面积的有源表面，并且金属接合区域设置在有源表面上并电连接到电路。微机电系统装置包括多个基座和至少一个感测元件。基底连接至至少一个金属接合区域。至少一个感测元件弹性地连接到基座。所述密封环围绕所述基部，并且与所述金属接合区域中的至少一个连接。盖与电路芯片的有效表面相对，并连接到密封环，以具有密封感测元件和电路芯片的有效表面的密封室。

25. 发明授权

US08643125B2 Structure and process for microelectromechanical system-based sensor 有权
标题翻译：微机电系统传感器的结构与工艺
公开(公告)号：US08643125B2
公开(公告)日：2014-02-04
申请号：US13327681
申请日：2011-12-15
申请人： Lung-Tai Chen , Shih-Chieh Lin , Yu-Wen Hsu
发明人： Lung-Tai Chen , Shih-Chieh Lin , Yu-Wen Hsu
IPC分类号： H01L29/78
CPC分类号： B81B7/007 , B81B2207/097 , H01L2924/0002 , H01L2924/00
摘要： A structure and a process for a microelectromechanical system (MEMS)-based sensor are provided. The structure for a MEMS-based sensor includes a substrate chip. A first insulating layer covers a top surface of the substrate chip. A device layer is disposed on a top surface of the first insulating layer. The device layer includes a periphery region and a sensor component region. The periphery region and a sensor component region have an air trench therebetween. The component region includes an anchor component and a moveable component. A second insulating layer is disposed on a top surface of the device layer, bridging the periphery region and a portion of the anchor component. A conductive pattern is disposed on the second insulating layer, electrically connecting to the anchor component.
摘要翻译：提供了一种用于基于微机电系统（MEMS）的传感器的结构和工艺。基于MEMS的传感器的结构包括衬底芯片。第一绝缘层覆盖衬底芯片的顶表面。器件层设置在第一绝缘层的顶表面上。器件层包括外围区域和传感器部件区域。周边区域和传感器部件区域之间具有空气沟槽。组件区域包括锚构件和可移动构件。第二绝缘层设置在器件层的顶表面上，桥接外围区域和锚固部件的一部分。导电图案设置在第二绝缘层上，与导电组件电连接。

26. 发明申请

US20130167632A1 MICROELECTROMECHANICAL SYSTEM DEVICE WITH ELECTRICAL INTERCONNECTIONS AND METHOD FOR FABRICATING THE SAME 有权
标题翻译：具有电气互连的微电子机电系统装置及其制造方法
公开(公告)号：US20130167632A1
公开(公告)日：2013-07-04
申请号：US13459271
申请日：2012-04-30
申请人： Chao-Ta Huang , Yu-Wen Hsu , Chin-Fu Kuo
发明人： Chao-Ta Huang , Yu-Wen Hsu , Chin-Fu Kuo
IPC分类号： G01P3/42 , H01L21/306
CPC分类号： B81B7/0006 , B81B2201/0271 , B81B2201/042 , B81B2203/0109 , B81B2203/0154 , B81B2203/058 , G01R33/0286
摘要： A microelectromechanical system device including anchors and mass is provided. Electrical interconnections are formed on the mass by using a insulation layer of mass, an electrical insulation trench and conductive through hole. The electrical interconnections replace the cross-line structure without adding additional processing steps, thereby reducing the use of the conductive layer and the electrical insulation layer. A method for fabricating the microelectromechanical system device is also provided.
摘要翻译：提供了包括锚和质量的微机电系统装置。通过使用质量绝缘层，电绝缘沟槽和导电通孔在质量上形成电互连。电互连替代了交叉线结构，而不增加额外的处理步骤，从而减少了导电层和电绝缘层的使用。还提供了一种用于制造微机电系统装置的方法。

27. 发明授权

US08421543B2 Crystal oscillator and method for manufacturing the same 有权
标题翻译：晶体振荡器及其制造方法
公开(公告)号：US08421543B2
公开(公告)日：2013-04-16
申请号：US13115112
申请日：2011-05-25
申请人： Yu-Wen Hsu , Lung-Tai Chen , Tzung-Ching Lee , Chao-Ta Huang
发明人： Yu-Wen Hsu , Lung-Tai Chen , Tzung-Ching Lee , Chao-Ta Huang
IPC分类号： H03B1/00 , H03B5/32 , H01L41/053
CPC分类号： H03H9/0547 , H03H3/02
摘要： A crystal oscillator includes a cover, a crystal blank and an Integrated Circuit (IC) chip. The cover has a surface, a cavity formed in the surface, a plurality of conductive contacts and a conductive sealing ring. The conductive contacts are disposed on the surface, and the conductive sealing ring is disposed on the surface and surrounds the conductive contacts. The IC chip is connected to the conductive contacts and the conductive sealing ring, and forms a hermetic chamber with the cover and the conductive sealing ring. The crystal blank is located in the hermetic chamber, and is electrically connected to the IC chip. Furthermore, a method for manufacturing a crystal oscillator is also provided.
摘要翻译：晶体振荡器包括盖，晶体空白和集成电路（IC）芯片。盖具有表面，形成在表面中的空腔，多个导电触点和导电密封环。导电触点设置在表面上，并且导电密封环设置在表面上并且围绕导电触点。 IC芯片连接到导电触点和导电密封环，并与盖和导电密封环形成密封室。晶体坯料位于密封室中，并与IC芯片电连接。此外，还提供了一种用于制造晶体振荡器的方法。

28. 发明申请

US20120260747A1 SENSING DEVICE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：感应装置及其制造方法
公开(公告)号：US20120260747A1
公开(公告)日：2012-10-18
申请号：US13154426
申请日：2011-06-06
申请人： Lung-Tai Chen , Yu-Wen Hsu , Tzong-Che Ho , Li-Chi Pan
发明人： Lung-Tai Chen , Yu-Wen Hsu , Tzong-Che Ho , Li-Chi Pan
IPC分类号： G01N1/00
CPC分类号： B81C1/00293 , B81C2203/0118 , G01D11/245 , G01L19/0092 , G01L19/147 , G01P1/023 , H01L23/315 , H01L2924/0002 , H01L2924/00
摘要： A sensing device can be provided with sealed and open-type chambers in various conditions for accommodating different types of sensing structural components by stacking multiple substrates, wherein the condition of a sealed chamber depends on condition taken in substrate bonding process. Owing to sealing a channel of the sealed chamber by the substrate, superior sealing performance is achieved as compared to those adopting solder or sealing material, and thus the condition of the sealed chamber can be finely controlled.
摘要翻译：感测装置可以设置有各种条件的密封和开放式室，用于通过堆叠多个基板来容纳不同类型的感测结构部件，其中密封室的状态取决于在基板接合过程中采取的条件。由于通过基板密封密封室的通道，与使用焊料或密封材料的密封室相比，实现了优异的密封性能，因此可以精细地控制密封室的状态。

29. 发明授权

US08205498B2 Multi-axis capacitive accelerometer 有权
标题翻译：多轴电容式加速度计
公开(公告)号：US08205498B2
公开(公告)日：2012-06-26
申请号：US12618791
申请日：2009-11-16
申请人： Yu-Wen Hsu , Sheah Chen , Hsin-Tang Chien
发明人： Yu-Wen Hsu , Sheah Chen , Hsin-Tang Chien
IPC分类号： G01P15/125
CPC分类号： G01P15/125 , G01P15/18 , G01P2015/0814 , G01P2015/082 , G01P2015/0831
摘要： A multi-axis accelerometer is consisted of a substrate with sensing electrodes and a structure layer. The structure layer includes anchor bases fixed on the substrate. A first proof mass is disposed over the substrate and has a first opening and a second opening symmetric to each other. The first proof mass is suspended to the anchor bases. Fixed sensing blocks are disposed on the substrate, and capacitors are formed between each fixed sensing block and the first proof mass for sensing acceleration along two in-plane directions. A second proof mass and a third proof mass are disposed in the first opening and the second opening and are asymmetrically suspended. Separate electrodes are disposed on the substrate and form two differential capacitors with the second proof mass and the third proof mass for sensing the out-of-plane acceleration.
摘要翻译：多轴加速度计由具有感测电极和结构层的基板组成。结构层包括固定在基底上的锚定基底。第一检测质量体设置在基板上方并且具有彼此对称的第一开口和第二开口。第一个质量悬浮在锚基上。固定感测块设置在基板上，并且电容器形成在每个固定感测块和第一检测质量块之间，用于沿着两个面内方向感测加速度。在第一开口和第二开口中设置第二检测质量块和第三检验质量块，并且不对称地悬挂。单独的电极设置在基板上并形成具有第二检测质量的两个差分电容器和用于感测平面外加速度的第三检测质量块。

30. 发明申请

US20120001276A1 APPARATUS INTEGRATING MICROELECTROMECHANICAL SYSTEM DEVICE WITH CIRCUIT CHIP AND METHODS FOR FABRICATING THE SAME 有权
标题翻译：具有电路芯片的装置集成微电子系统装置及其制造方法
公开(公告)号：US20120001276A1
公开(公告)日：2012-01-05
申请号：US13173119
申请日：2011-06-30
申请人： Chao Ta HUANG , Shih Ting Lin , Yu Wen Hsu
发明人： Chao Ta HUANG , Shih Ting Lin , Yu Wen Hsu
IPC分类号： H01L29/84 , H01L21/02
CPC分类号： B81C1/00134 , B81B7/0064 , B81C1/0023 , B81C2203/00 , B81C2203/0792 , H01L41/0933 , H01L41/1134 , H01L2224/11
摘要： One embodiment discloses an apparatus integrating a microelectromechanical system device with a circuit chip which comprises a circuit chip, a microelectromechanical system device, a sealing ring, and a lid. The circuit chip comprises a substrate and a plurality of metal bonding areas. The substrate has an active surface with electrical circuit area, and the metal bonding areas are disposed on the active surface and electrically connected to the electrical circuits. The microelectromechanical system device comprises a plurality of bases and at least one sensing element. The bases are connected to at least one of the metal bonding areas. The at least one sensing element is elastically connected to the bases. The sealing ring surrounds the bases, and is connected to at least one of the metal bonding areas. The lid is opposite to the active surface of the circuit chip, and is connected to the sealing ring to have a hermetic chamber which seals the sensing element and the active surface of the circuit chip.
摘要翻译：一个实施例公开了一种将微机电系统装置与包括电路芯片，微机电系统装置，密封环和盖子的电路芯片集成的装置。电路芯片包括基板和多个金属接合区域。基板具有具有电路面积的有源表面，并且金属接合区域设置在有源表面上并电连接到电路。微机电系统装置包括多个基座和至少一个感测元件。基底连接至至少一个金属接合区域。至少一个感测元件弹性地连接到基座。所述密封环围绕所述基部，并且与所述金属接合区域中的至少一个连接。盖与电路芯片的有效表面相对，并连接到密封环，以具有密封感测元件和电路芯片的有效表面的密封室。

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