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21. 发明申请

US20100155939A1 CIRCUIT BOARD AND FABRICATION METHOD THEREOF AND CHIP PACKAGE STRUCTURE 有权
标题翻译：电路板及其制造方法及芯片封装结构
公开(公告)号：US20100155939A1
公开(公告)日：2010-06-24
申请号：US12432367
申请日：2009-04-29
申请人： Wen-Yuan Chang , Wei-Cheng Chen , Yeh-Chi Hsu
发明人： Wen-Yuan Chang , Wei-Cheng Chen , Yeh-Chi Hsu
IPC分类号： H01L23/498 , H05K1/09 , C25D5/02
CPC分类号： H05K3/242 , H01L23/49811 , H01L23/49822 , H01L23/49827 , H01L24/16 , H01L24/81 , H01L2224/05001 , H01L2224/05022 , H01L2224/05572 , H01L2224/056 , H01L2224/13099 , H01L2224/16225 , H01L2224/81193 , H01L2224/81801 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15174 , H01L2924/15311 , H05K3/243 , H05K3/28 , H05K3/4007 , H05K3/4602 , H05K2201/0352 , H05K2201/0367 , H05K2201/09481 , H05K2201/09536 , H05K2201/09627 , H05K2203/054 , H05K2203/0723 , H01L2224/05099
摘要： A fabrication method of a circuit board is provided. A substrate, a top pad, a base pad electrically connecting the top pad, and a top and a base solder resist layers are provided. The top and the base pads are disposed on two opposite surfaces of the substrate, respectively. The top solder resist layer having a first opening partially exposing the top pad and the base solder resist layer having a second opening partially exposing the base pad are disposed on the two surfaces, respectively. A conductive layer covering the base solder resist layer and the base pad is formed. A plating resist layer having a third opening is formed on the conductive layer. A current is applied to the conductive layer through the third opening for electroplating a pre-bump on the top pad. The plating resist layer and the conductive layer are then removed.
摘要翻译：提供了电路板的制造方法。提供了一种衬底，顶部焊盘，电连接顶部焊盘以及顶部和基底阻焊层的基座。顶部和底座分别设置在基板的两个相对的表面上。具有部分露出顶部焊盘的第一开口和具有部分暴露基板的第二开口的基底阻焊层的顶部阻焊层分别设置在两个表面上。形成覆盖基底阻焊层和基座的导体层。在导电层上形成具有第三开口的电镀抗蚀剂层。通过第三开口将电流施加到导电层，用于在顶部焊盘上电镀预凸块。然后除去电镀抗蚀剂层和导电层。

22. 发明申请

US20090255721A1 Circuit board assembly 有权
标题翻译：电路板组装
公开(公告)号：US20090255721A1
公开(公告)日：2009-10-15
申请号：US12081099
申请日：2008-04-10
申请人： Wei-Cheng Chen , Cheng-Chao Liao
发明人： Wei-Cheng Chen , Cheng-Chao Liao
IPC分类号： H05K1/11
CPC分类号： H05K3/306 , H05K3/3405 , H05K3/3447 , H05K2201/09063 , H05K2201/10287 , H05K2201/10598 , H05K2201/10757
摘要： A circuit board assembly includes: a circuit board having opposite first and second surfaces and formed with a first through-hole defined by a hole-defining wall that extends between and that terminates at the first and second surfaces and that cooperates with the first and second surfaces to define first and second turns, respectively, the circuit board further having an abutting wall that extends between and that terminates at the first and second surfaces and that cooperates with the second surface to define a third turn; and an electric wire having a fixed end that is soldered to the circuit board, extending through the first through-hole, and passing over the first, second and third turns of the circuit board so as to form an inflection region between the first and second turns.
摘要翻译：电路板组件包括：具有相对的第一和第二表面的电路板，并形成有由孔限定壁限定的第一通孔，该第一通孔在第一和第二表面之间延伸并终止于第一和第二表面，并且与第一和第二表面配合表面分别限定第一和第二匝，电路板还具有在第一和第二表面之间延伸并且终止于第一和第二表面的邻接壁，并且与第二表面配合以限定第三匝; 以及电线，其固定端焊接到所述电路板，延伸穿过所述第一通孔，并且越过所述电路板的所述第一，第二和第三匝，以在所述第一和第二通孔之间形成拐点区域轮到

23. 发明申请

US20060079299A1 Sliding structure for a mobile device 审中-公开
标题翻译：移动设备的滑动结构
公开(公告)号：US20060079299A1
公开(公告)日：2006-04-13
申请号：US10984768
申请日：2004-11-10
申请人： Wei-Cheng Chen , Luen-Chiu Lin , Shu-Lien Wu
发明人： Wei-Cheng Chen , Luen-Chiu Lin , Shu-Lien Wu
IPC分类号： H04Q7/32
CPC分类号： H04M1/0237 , B60R11/00 , B60R11/02 , B60R2011/0082 , B60R2011/0084 , B60R2011/0092
摘要： The present invention is a sliding structure for a mobile device, which has a main body and a sub body buckled with each other for sliding within a predestined distance, having a cover and a base disposed on the main body and sub body respectively; and at least one elastic member having two ends disposed at the cover and the base respectively, where the extension line traveling through the two ends of the elastomer is never parallel to the sliding directions of the cover or the base so that the cover and the base can relatively sliding over each other within a certain predestined distance.
摘要翻译：本发明是一种用于移动装置的滑动结构，其具有主体和子体彼此弯曲以在预定距离内滑动，分别具有设置在主体和子体上的盖和基座; 以及至少一个弹性构件，其具有分别设置在所述盖和所述底座处的两端，其中延伸线穿过所述弹性体的两端的延伸线从不平行于所述盖或所述基座的滑动方向，使得所述盖和所述基座可以在一定的预定距离内相对滑动。

24. 发明授权

US09610536B2 Recirculated-suspension pre-calciner system 有权
公开(公告)号：US09610536B2
公开(公告)日：2017-04-04
申请号：US13590126
申请日：2012-08-20
申请人： Wei-Cheng Chen , Wan-Hsia Liu , Chin-Ming Huang , Shoung Ouyang , Heng-Wen Hsu
发明人： Wei-Cheng Chen , Wan-Hsia Liu , Chin-Ming Huang , Shoung Ouyang , Heng-Wen Hsu
IPC分类号： C01B13/18 , B01J6/00 , B01J8/14 , C01F11/06 , B01D53/62 , B01J8/00 , C01F5/06 , C01G9/02 , C01G25/02 , C01G45/02 , C01G53/04 , C04B2/10 , B01D53/10 , B01D53/96 , C04B7/43 , C04B111/00
CPC分类号： B01D53/62 , B01D53/10 , B01D53/96 , B01D2251/402 , B01D2251/404 , B01D2251/602 , B01J6/004 , B01J8/0055 , B01J8/14 , C01B13/18 , C01F5/06 , C01F11/06 , C01G9/02 , C01G25/02 , C01G45/02 , C01G53/04 , C04B2/10 , C04B7/434 , C04B2111/00017 , Y02C10/04 , Y02E20/326 , Y02P40/18 , Y02P40/42
摘要： A recirculated-suspension pre-calciner system is disclosed, comprising: a vortex cyclone dust collecting equipment including a plurality of devices, wherein a top device of the vortex cyclone dust collecting equipment is used as a feed system; a vertical combustion kiln; a blower; and a powder purge system, wherein powders in the feed system fall into the vortex cyclone dust collecting equipment and pass through a plurality of the devices to mix and exchange heat with flue gas comprising CO2, generating calcination reaction and releasing CO2 into the flue gas. and the steam is separated and transported to the feed system by the blower and acts as a carrier gas of powders.

25. 发明申请

US20150201570A1 WATERING CONTROL METHOD BY MONITORING SOIL MOISTURE 审中-公开
标题翻译：监测土壤水分的水控制方法
公开(公告)号：US20150201570A1
公开(公告)日：2015-07-23
申请号：US14336032
申请日：2014-07-21
申请人： MOU-LI LIN , TA-CHI LIU , WEI-CHENG CHEN
发明人： MOU-LI LIN , TA-CHI LIU , WEI-CHENG CHEN
IPC分类号： A01G25/16
CPC分类号： A01G25/167 , Y10T137/0318
摘要： The invention provides a method of controlling watering by monitoring soil moisture, including the steps of: determining a control moisture and a measuring frequency; measuring a soil moisture according to the measuring frequency by a moisture sensor; implementing a watering process when the ratio of the soil moisture to the control moisture is lower than a first control value; implementing a waiting process after the watering process; measuring the soil moisture using the moisture sensor after finishing the waiting process; and implementing the step of measuring the soil moisture according to the measuring frequency by the moisture sensor when the ratio of the soil moisture to the control moisture is higher than a second control value, and implementing the watering process and the step of the waiting process when the ratio of the soil moisture to the control moisture is lower than the second control value.
摘要翻译：本发明提供了一种通过监测土壤水分来控制浇水的方法，包括以下步骤：确定控制水分和测量频率; 通过湿度传感器根据测量频率测量土壤水分; 当土壤水分与对照水分的比例低于第一控制值时，实施浇水过程; 在浇水过程后实施等待过程; 完成等待过程后，使用湿度传感器测量土壤水分; 并且当土壤水分与控制水分的比例高于第二控制值时，通过水分传感器实施根据测量频率测量土壤湿度的步骤，并且实施浇水过程和等待过程的步骤土壤水分与对照水分的比例低于第二个控制值。

26. 发明授权

US08796848B2 Circuit board and chip package structure 有权
标题翻译：电路板和芯片封装结构
公开(公告)号：US08796848B2
公开(公告)日：2014-08-05
申请号：US13004242
申请日：2011-01-11
申请人： Wen-Yuan Chang , Wei-Cheng Chen , Yeh-Chi Hsu
发明人： Wen-Yuan Chang , Wei-Cheng Chen , Yeh-Chi Hsu
IPC分类号： H01L23/498 , H05K3/24 , H01L23/00 , H05K3/46 , H05K3/40 , H05K3/28
CPC分类号： H05K3/242 , H01L23/49811 , H01L23/49822 , H01L23/49827 , H01L24/16 , H01L24/81 , H01L2224/05001 , H01L2224/05022 , H01L2224/05572 , H01L2224/056 , H01L2224/13099 , H01L2224/16225 , H01L2224/81193 , H01L2224/81801 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15174 , H01L2924/15311 , H05K3/243 , H05K3/28 , H05K3/4007 , H05K3/4602 , H05K2201/0352 , H05K2201/0367 , H05K2201/09481 , H05K2201/09536 , H05K2201/09627 , H05K2203/054 , H05K2203/0723 , H01L2224/05099
摘要： A circuit board includes a substrate that has a top surface and a base surface opposite to each other, at least a top pad disposed on the top surface, a top solder resist layer disposed on the top surface and covering a portion of the top pad, and a pre-bump disposed on the top pad. The top solder resist layer has a first opening exposing a portion of the top pad. The pre-bump is located in the first opening and has a protrusion protruding from the top solder resist layer. A maximum width of the protrusion is less than or equal to a width of the top pad. A chip package structure having the circuit board is also provided.
摘要翻译：电路板包括具有彼此相对的顶表面和底表面的基底，至少设置在顶表面上的顶垫，设置在顶表面上并覆盖顶垫的一部分的顶部阻焊层，以及设置在顶垫上的预凸块。顶部阻焊层具有暴露顶部焊盘的一部分的第一开口。预凸块位于第一开口中并且具有从顶部阻焊层突出的突起。突起的最大宽度小于或等于顶垫的宽度。还提供了具有电路板的芯片封装结构。

27. 发明申请

US20120017832A1 VAPOR DEPOSITION APPARATUS AND SUSCEPTOR 审中-公开
标题翻译：蒸气沉积装置和SUSCEPTOR
公开(公告)号：US20120017832A1
公开(公告)日：2012-01-26
申请号：US13010598
申请日：2011-01-20
申请人： Wei-Cheng CHEN , Zong-Lin Lee , Kung-Ming Liang , Yung-Hsin Shie
发明人： Wei-Cheng CHEN , Zong-Lin Lee , Kung-Ming Liang , Yung-Hsin Shie
IPC分类号： C23C16/06 , C23C16/511 , C23C16/448
CPC分类号： C23C16/4584
摘要： A vapor deposition apparatus includes a susceptor, a gas supply unit, a heating unit and a rotation unit. The susceptor has a first substrate-holding portion and a second substrate-holding portion. The first substrate-holding portion has a first depth, and the second substrate-holding portion has a second depth that is larger than the first depth. The gas supply unit supplies precursors to the susceptor. The heating unit is used to heat the susceptor. The rotation unit can rotate the susceptor so that the heating unit can uniformly heat the susceptor. Because the second depth is larger than the first depth, the substrate held in the second substrate-holding portion can not directly contact the susceptor with a higher temperature and thus its temperature is lower than the second substrate-holding portion, so as to maintain the uniformity of the properties of the manufactured chips.
摘要翻译：气相沉积设备包括基座，气体供应单元，加热单元和旋转单元。基座具有第一基板保持部和第二基板保持部。第一基板保持部分具有第一深度，并且第二基板保持部分具有大于第一深度的第二深度。气体供应单元向基座提供前体。加热单元用于加热基座。旋转单元可以旋转基座，使得加热单元可以均匀地加热基座。由于第二深度大于第一深度，所以保持在第二基板保持部中的基板不能与较高温度的基座直接接触，因此其温度低于第二基板保持部，以便保持所制造的芯片的性能的均匀性。

28. 发明申请

US20110108984A1 CIRCUIT BOARD AND CHIP PACKAGE STRUCTURE 有权
标题翻译：电路板和芯片包装结构
公开(公告)号：US20110108984A1
公开(公告)日：2011-05-12
申请号：US13004242
申请日：2011-01-11
申请人： Wen-Yuan Chang , Wei-Cheng Chen , Yeh-Chi Hsu
发明人： Wen-Yuan Chang , Wei-Cheng Chen , Yeh-Chi Hsu
IPC分类号： H01L23/498 , H05K1/09
CPC分类号： H05K3/242 , H01L23/49811 , H01L23/49822 , H01L23/49827 , H01L24/16 , H01L24/81 , H01L2224/05001 , H01L2224/05022 , H01L2224/05572 , H01L2224/056 , H01L2224/13099 , H01L2224/16225 , H01L2224/81193 , H01L2224/81801 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15174 , H01L2924/15311 , H05K3/243 , H05K3/28 , H05K3/4007 , H05K3/4602 , H05K2201/0352 , H05K2201/0367 , H05K2201/09481 , H05K2201/09536 , H05K2201/09627 , H05K2203/054 , H05K2203/0723 , H01L2224/05099
摘要： A circuit board includes a substrate that has a top surface and a base surface opposite to each other, at least a top pad disposed on the top surface, a top solder resist layer disposed on the top surface and covering a portion of the top pad, and a pre-bump disposed on the top pad. The top solder resist layer has a first opening exposing a portion of the top pad. The pre-bump is located in the first opening and has a protrusion protruding from the top solder resist layer. A maximum width of the protrusion is less than or equal to a width of the top pad. A chip package structure having the circuit board is also provided.
摘要翻译：电路板包括具有彼此相对的顶表面和底表面的基底，至少设置在顶表面上的顶垫，设置在顶表面上并覆盖顶垫的一部分的顶部阻焊层，以及设置在顶垫上的预凸块。顶部阻焊层具有暴露顶部焊盘的一部分的第一开口。预凸块位于第一开口中并且具有从顶部阻焊层突出的突起。突起的最大宽度小于或等于顶垫的宽度。还提供了具有电路板的芯片封装结构。

29. 发明申请

US20060091750A1 MAGNETIC SUSPENSION BEARING WITH DAMPING SYSTEM 失效
标题翻译：带阻尼系统的磁悬浮轴承
公开(公告)号：US20060091750A1
公开(公告)日：2006-05-04
申请号：US10980871
申请日：2004-11-04
申请人： Chien-chang Wang , Pi-cheng Tung , Ren-bin Xiao , Wei-cheng Chen , Chien-sheng Liu , Yu-hsiu Chang , Der-ray Huang
发明人： Chien-chang Wang , Pi-cheng Tung , Ren-bin Xiao , Wei-cheng Chen , Chien-sheng Liu , Yu-hsiu Chang , Der-ray Huang
IPC分类号： H02K7/09
CPC分类号： F16C39/063 , F16C32/0406 , H02K7/09
摘要： A magnetic suspension bearing with damping system includes a stator having a stator magnetic unit mounted on the internal portion of the stator, and a rotor rotatably located at the stator. A rotor magnetic unit installed on the rotor corresponding to the stator magnetic. The rotor further has a yoke having a magnetic driving unit corresponding to the external portion of the stator. A magnetic damping device located has a magnetic unit and an elastic unit, wherein the magnetic unit corresponding to the magnetic driving unit generates magnetic force between them, and the elastic unit coupled below the magnetic unit uses to reduce the vibration of the magnetic unit for maintaining the rotation of the rotor smooth and steady.
摘要翻译：具有阻尼系统的磁悬浮轴承包括具有安装在定子的内部上的定子磁性单元的定子和可旋转地定位在定子上的转子。转子磁性单元安装在与定子磁铁相对应的转子上。转子还具有具有对应于定子的外部的磁性驱动单元的磁轭。位于磁性阻尼装置的磁性单元和弹性单元，其中对应于磁性驱动单元的磁性单元在它们之间产生磁力，并且耦合在磁性单元下方的弹性单元用于减小磁性单元的振动以维持转子的旋转平稳稳定。

30. 发明授权

US07038341B1 Magnetic suspension bearing with damping system 失效
标题翻译：磁悬浮轴承带阻尼系统
公开(公告)号：US07038341B1
公开(公告)日：2006-05-02
申请号：US10980871
申请日：2004-11-04
申请人： Chien-chang Wang , Pi-cheng Tung , Ren-bin Xiao , Wei-cheng Chen , Chien-sheng Liu , Yu-hsiu Chang , Der-ray Huang
发明人： Chien-chang Wang , Pi-cheng Tung , Ren-bin Xiao , Wei-cheng Chen , Chien-sheng Liu , Yu-hsiu Chang , Der-ray Huang
IPC分类号： H02K7/09
CPC分类号： F16C39/063 , F16C32/0406 , H02K7/09
摘要： A magnetic suspension bearing with damping system includes a stator having a stator magnetic unit mounted on the internal portion of the stator, and a rotor rotatably located at the stator. A rotor magnetic unit installed on the rotor corresponding to the stator magnetic. The rotor further has a yoke having a magnetic driving unit corresponding to the external portion of the stator. A magnetic damping device located has a magnetic unit and an elastic unit, wherein the magnetic unit corresponding to the magnetic driving unit generates magnetic force between them, and the elastic unit coupled below the magnetic unit uses to reduce the vibration of the magnetic unit for maintaining the rotation of the rotor smooth and steady.
摘要翻译：具有阻尼系统的磁悬浮轴承包括具有安装在定子的内部上的定子磁性单元的定子和可旋转地定位在定子上的转子。转子磁性单元安装在与定子磁铁相对应的转子上。转子还具有具有对应于定子的外部的磁性驱动单元的磁轭。位于磁性阻尼装置的磁性单元和弹性单元，其中对应于磁性驱动单元的磁性单元在它们之间产生磁力，并且耦合在磁性单元下方的弹性单元用于减小磁性单元的振动以维持转子的旋转平稳稳定。

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