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21. 发明授权

US5366906A Wafer level integration and testing 失效
标题翻译：晶圆级集成和测试
公开(公告)号：US5366906A
公开(公告)日：1994-11-22
申请号：US962000
申请日：1992-10-16
申请人： Robert J. Wojnarowski , Constantine A. Neugebauer , Wolfgang Daum , Bernard Gorowitz , Eric J. Wildi , Michael Gdula , Stanton E. Weaver, Jr. , Anthony A. Immorlica, Jr.
发明人： Robert J. Wojnarowski , Constantine A. Neugebauer , Wolfgang Daum , Bernard Gorowitz , Eric J. Wildi , Michael Gdula , Stanton E. Weaver, Jr. , Anthony A. Immorlica, Jr.
IPC分类号： G01R31/3185 , H01L21/301 , H01L21/66 , H01L23/538 , H01L23/58 , G01R31/26
CPC分类号： H01L22/22 , H01L22/32 , H01L23/5389 , H01L24/24 , H01L24/82 , G01R31/318505 , G01R31/318533 , H01L2224/2402 , H01L2224/24137 , H01L2224/24227 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01074 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01L2924/351
摘要： In fabricating wafer scale integrated interconnects, a temporary or permanent dielectric layer and a pattern of electrical conductors are used to provide wafer scale integration or testing and burn-in. A resist can be used to cover the areas of IC pads on the wafer while the remainder of the pattern of electrical conductors is removed to provide for repair of the wafer scale integration structure. The pattern of electrical conductors may be configured so that the conductor lengths between at least some sub-circuits on a plurality of wafers are substantially electrically equal for signal propagation purposes; an additional wafer may be laminated to the wafer using an adhesive; controlled curfs may be cut into the wafer; and the wafer may be interconnected to an interface ring.
摘要翻译：在制造晶片级集成互连件时，使用临时或永久的电介质层和电导体图案来提供晶片级整合或测试和老化。可以使用抗蚀剂来覆盖晶片上的IC焊盘的区域，而去除电导体图案的其余部分以提供晶片级整合结构的修复。电导体的图案可以被配置为使得在多个晶片上的至少一些子电路之间的导体长度对于信号传播目的而基本上是电相等的; 可以使用粘合剂将另外的晶片层压到晶片上; 受控的曲折可以被切入晶片; 并且晶片可以互连到接口环。

22. 发明授权

US5357403A Adaptive lithography in a high density interconnect structure whose signal layers have fixed patterns 失效
标题翻译：高密度互连结构中的自适应光刻，其信号层具有固定的图案
公开(公告)号：US5357403A
公开(公告)日：1994-10-18
申请号：US545793
申请日：1990-06-29
申请人： Theodore R. Haller , Robert J. Wojnarowski
发明人： Theodore R. Haller , Robert J. Wojnarowski
IPC分类号： H01L23/12 , H01L23/538 , H05K1/18 , H05K3/46 , H05K1/11
CPC分类号： H01L23/5383 , H01L23/538 , H01L23/5389 , H01L2924/0002
摘要： Mispositioning of chips in a high density interconnect structure is compensated for by including a layer having alignment conductor in the high density interconnect structure without requiring adaptation of the signal conductor metallization levels of the high density interconnect structure. One level, two levels or more of alignment conductor may be employed. The alignment levels of the high density interconnect structure are preferably a ground plane, and if two layers of alignment conductors are provided, a power plane.
摘要翻译：通过在高密度互连结构中包括具有对准导体的层，而不需要适应高密度互连结构的信号导体金属化水平来补偿高密度互连结构中的芯片的位置偏移。可以采用一级，两级或更多的对准导体。高密度互连结构的取向水平优选为接地面，如果设置两层取向导体，则具有电源面。

23. 发明授权

US5169678A Laser ablatable polymer dielectrics and methods 失效
标题翻译：激光可聚合聚合物电介质和方法
公开(公告)号：US5169678A
公开(公告)日：1992-12-08
申请号：US456421
申请日：1989-12-26
申请人： Herbert S. Cole , Robert J. Wojnarowski
发明人： Herbert S. Cole , Robert J. Wojnarowski
IPC分类号： C08K5/00 , B23K26/00 , B23K26/18 , B23K26/40 , C08J7/00 , C08J7/04 , C08K5/22 , C08L101/00 , C09D201/00 , G03F7/039 , G03F7/20 , H01L21/027 , H01L21/30 , H01L21/311 , H01L23/12 , H01L23/538 , H01L25/04 , H01L25/18
CPC分类号： G03F7/039 , G03F7/2053 , H01L21/31127 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L2224/24227 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01033 , H01L2924/01074 , H01L2924/12042 , H01L2924/14 , Y10S430/146
摘要： The ultraviolet absorption characteristics of a polymer material are modified by the addition of an ultraviolet absorbing dye to render it laser ablatable at a frequency at which the unmodified material is substantially non-laser ablatable.

24. 发明授权

US4894115A Laser beam scanning method for forming via holes in polymer materials 失效
标题翻译：用于在聚合物材料中形成通孔的激光束扫描方法
公开(公告)号：US4894115A
公开(公告)日：1990-01-16
申请号：US310149
申请日：1989-02-14
申请人： Charles W. Eichelberger , Robert J. Wojnarowski , Kenneth B. Welles, II
发明人： Charles W. Eichelberger , Robert J. Wojnarowski , Kenneth B. Welles, II
IPC分类号： B23K26/00 , B23K26/38 , H01L21/302 , H01L21/3065 , H01L21/311 , H01L21/768 , H01L23/522 , H01L23/538 , H01L27/01 , H01S3/00 , H05K3/00
CPC分类号： H05K3/0035 , H01L21/31127 , H01L21/76804 , H01L2224/82039 , H05K2201/09827 , H05K2203/0165 , H05K2203/0207 , H05K2203/095 , H05K3/0008 , H05K3/0041 , H05K3/0055
摘要： The surface of a polymer dielectric layer is scanned repeatedly with a high energy continuous wave laser in a pattern to create via holes of desired size, shape and depth. This is followed by a short plasma etch. The via holes are produced at commercial production rates under direct computer control without use of masks and without damage to conductor material underlying the dielectric layer. A two-step technique usable to form a large hole to a partial depth in the dielectric layer and several smaller diameter holes within the large hole through the remainder of the dielectric layer depth allows formation of a large number of holes in a given area of a thick dielectric layer.

25. 发明授权

US4780177A Excimer laser patterning of a novel resist 失效
标题翻译：新型抗蚀剂的准分子激光图案化
公开(公告)号：US4780177A
公开(公告)日：1988-10-25
申请号：US152510
申请日：1988-02-05
申请人： Robert J. Wojnarowski , Charles W. Eichelberger
发明人： Robert J. Wojnarowski , Charles W. Eichelberger
IPC分类号： G03F7/20 , H01L23/538 , H05K3/00 , H05K3/06 , B44C1/22 , B29C37/00 , C03C15/00 , C23F1/02
CPC分类号： G03F7/2006 , H01L23/5389 , H05K3/0082 , H01L2924/0002 , H05K2203/0505 , H05K2203/0577 , H05K2203/107 , H05K3/0032 , H05K3/064 , Y10T29/49155 , Y10T428/12361 , Y10T428/24322 , Y10T428/31504
摘要： A dual layer resist configuration is employed for photopatterning high resolution conductive patterns on underlying polymeric or ceramic substrates, particularly substrates exhibiting surface roughness and non-planar design features such as channels, bosses and ridges. More particularly, a thin underlayer of ablatable photoabsorptive polymer is disposed on a metal coated substrate, after which a thicker layer of substantially transparent material is disposed over the polymer. A beam of laser energy, such as that produced by an ultraviolet excimer laser, is directed through the upper layer and is absorbed by the lower layer which is ablated and simultaneously removes the thick layer above it. This results in the ability to etch high resolution features on polymeric and other substrates, particularly copper coated polyetherimide circuit boards. The resist system is also applicable to VLSI wafers even though such wafers usually do not exhibit surface roughness on the scale generally considered herein. It is also equally applicable in various high density interconnect systems used for the direct connection of chip devices. A mask for patterning and a method for making it are also seen to be desirable because of the high laser energy densities generally desired for thorough ablation.
摘要翻译：采用双层抗蚀剂构造来在下面的聚合物或陶瓷衬底上，特别是表现出表面粗糙度和非平面设计特征的衬底（如通道，凸台和脊）上的高分辨率导电图案进行光刻图形化。更具体地说，将可消融的光吸收聚合物的薄的底层设置在金属涂覆的基底上，之后在该聚合物上设置较厚的基本上透明的材料层。诸如由紫外准分子激光器产生的激光能量束被引导通过上层，并被被消融的下层吸收并同时去除其上方的厚层。这导致在聚合物和其它基底，特别是铜涂覆的聚醚酰亚胺电路板上蚀刻高分辨率特征的能力。抗蚀剂体系也适用于VLSI晶圆，即使这样的晶片通常在本文通常考虑的刻度上不表现出表面粗糙度。它也同样适用于用于直接连接芯片器件的各种高密度互连系统。由于通常需要彻底消融的高激光能量密度，用于图案的掩模和用于制造掩膜的方法也被认为是期望的。

26. 发明授权

US4646152A Sharpness enhanced equal bandwidth luminance bandwidth compression system 失效
标题翻译：锐度增强等宽带宽亮度带宽压缩系统
公开(公告)号：US4646152A
公开(公告)日：1987-02-24
申请号：US697600
申请日：1985-02-01
申请人： Charles W. Eichelberger , Robert J. Wojnarowski , Theodore G. Mihran
发明人： Charles W. Eichelberger , Robert J. Wojnarowski , Theodore G. Mihran
IPC分类号： H04N5/14 , H04N7/08 , H04N7/084 , H04N5/38
CPC分类号： H04N7/0806 , H04N5/142 , H04N7/084
摘要： Circuitry for enhancing the sharpness of bandwidth compressed television signals provides equalization in only the transmitter with no equalization required in the receiver. The transmitter includes a linear phase delay and edge peaking circuit, a low pass filter and an equalization circuit. The linear phase delay and edge peaking circuit includes a tapped delay line which provides weighted output signals for differential phase delays. The weighted output signals of the tapped delay line are differentially combined to provide a combined output signal. This combined output signal and a signal from the tapped delay line are supplied to a peaking circuit. A clamping circuit is connected to limit the amplitude of high level signals in the combined output signal so that small transitions are peaked to a greater degree than large transitions.
摘要翻译：用于提高带宽压缩电视信号的清晰度的电路仅在发射机中提供均衡，而在接收机中不需要均衡。发射机包括线性相位延迟和边缘峰化电路，低通滤波器和均衡电路。线性相位延迟和边缘峰化电路包括抽头延迟线，其提供用于差分相位延迟的加权输出信号。抽头延迟线的加权输出信号差分组合以提供组合输出信号。该组合输出信号和来自抽头延迟线的信号被提供给峰值电路。连接钳位电路以限制组合输出信号中的高电平信号的幅度，使得小转换比大转换更大程度地达到峰值。

27. 发明授权

US4646149A Alternate field luminance enhancement in a spectrum conserving television system 失效
标题翻译：频谱保存电视系统中的替代场亮度增强
公开(公告)号：US4646149A
公开(公告)日：1987-02-24
申请号：US697560
申请日：1985-02-01
申请人： Robert J. Wojnarowski , Charles W. Eichelberger
发明人： Robert J. Wojnarowski , Charles W. Eichelberger
IPC分类号： H04N7/08 , H04N7/12 , H04N11/10 , H04N7/04 , H04N11/06
CPC分类号： H04N11/10 , H04N7/0806 , H04N7/12
摘要： An improved television bandwidth compression system allows two television programs to simultaneously utilize the bandwidth normally allowed for one television program. The basic bandwidth compression system comprises a transmitter which receives composite video signals from two program sources. The video processing circuitry of the transmitter provides an output signal wherein time-compressed chrominance information for the two program sources is sent on alternate lines during the normal horizontal retrace time and the luminance information for both program sources is sent during the active video time for each line. The receiver synthesizes a composite video signal of a selected program from the output signal transmitted from the transmitter. This basic system is improved by interlacing high and low bandwidth-limited luminance signals for alternating fields of each program in a manner such that when a high bandwidth-limited luminance signal is transmitted for one program, a low bandwidth-limited luminance signal is transmitted for the other program so that the total bandwidth allocated for the luminance signals is not exceeded.
摘要翻译：改进的电视带宽压缩系统允许两个电视节目同时利用通常允许一个电视节目的带宽。基本带宽压缩系统包括从两个节目源接收复合视频信号的发射机。发射机的视频处理电路提供一个输出信号，其中两个节目源的时间压缩色度信息在正常的水平回扫时间期间以交替的线路发送，并且在两个节目源的亮度信息在每个线。接收机根据从发射机发射的输出信号，合成所选节目的复合视频信号。通过以每个程序的交变场交错高和低带宽限制亮度信号的方式来改进该基本系统，使得当为一个程序发送高带宽限制的亮度信号时，发送低带宽限制的亮度信号用于另一个程序使得不超过分配给亮度信号的总带宽。

28. 发明授权

US4528748A Method for fabricating a printed circuit board of desired shape 失效
标题翻译：制造所需形状的印刷电路板的方法
公开(公告)号：US4528748A
公开(公告)日：1985-07-16
申请号：US445127
申请日：1982-11-29
申请人： Charles W. Eichelberger , Robert J. Wojnarowski , Abraham Auerbach
发明人： Charles W. Eichelberger , Robert J. Wojnarowski , Abraham Auerbach
IPC分类号： H05K1/02 , H05K1/05 , H05K1/09 , H05K1/18 , H05K3/00 , H05K3/44 , H05K3/22
CPC分类号： H05K3/44 , H05K3/0014 , H05K1/053 , H05K1/056 , H05K1/095 , H05K1/189 , H05K2201/0347 , H05K2201/057 , H05K2203/0709 , H05K2203/302 , Y10T29/49124 , Y10T29/49135
摘要： A method is described for batch-fabricating flat printed circuit boards and subsequently forming the circuit boards to a particular desired shape. In particular, a conductive substrate is coated with an insulating coating and conductors are fabricated thereon, with integrated circuit and chip resistor/capacitor parts being mounted to the fabricated conductor patterns. After part-mounting, the circuit board is bent to the desired shape.
摘要翻译：描述了用于批量制造平面印刷电路板并且随后将电路板形成为特定期望形状的方法。特别地，导电基板涂覆有绝缘涂层，并且在其上制造导体，其中集成电路和芯片电阻器/电容器部件安装到制造的导体图案。在部件安装之后，电路板弯曲到所需的形状。

29. 发明授权

US4522888A Electrical conductors arranged in multiple layers 失效
标题翻译：电导体多层布置
公开(公告)号：US4522888A
公开(公告)日：1985-06-11
申请号：US497977
申请日：1983-05-25
申请人： Charles W. Eichelberger , Robert J. Wojnarowski
发明人： Charles W. Eichelberger , Robert J. Wojnarowski
IPC分类号： H05K1/09 , H05K3/18 , H05K3/24 , H05K3/46 , C23C3/02 , H05K3/00
CPC分类号： H05K3/246 , H05K3/46 , H05K1/095 , H05K2201/0347 , H05K3/18 , Y10S428/901 , Y10T428/12014
摘要： A low-cost electrical conductor is prepared by applying a mixture of a metallic powder and a polymer on a substrate, curing the polymer, effecting an augmentation replacement reaction to replace some of the metallic powder with a more noble metal in such a way that the total volume of deposited metal at the surface exceeds that of the original metal powder replaced, and thereafter applying a dielectric material to selected areas of the conductor thus formed. Imperfections such as pin holes and screen marks can be eliminated by heating the dielectric material to cause a degree of flow. Multiple layer interconnected conductors can be prepared by reapplying the mixture of metallic powder and polymer such that a portion thereof contacts the first prepared conductor, curing the polymer and effecting an augmentation replacement reaction with a metal which is more noble than the powder metal and the replacement metal of the first conductor.
摘要翻译：通过将金属粉末和聚合物的混合物施加在基材上，固化聚合物，进行增加置换反应以用更贵金属代替一些金属粉末，制备低成本电导体，使得表面上沉积金属的总体积超过原来金属粉末的总体积，然后将电介质材料施加到如此形成的导体的选定区域。可以通过加热介电材料以导致流动程度来消除诸如针孔和丝网痕迹的缺陷。可以通过重新使用金属粉末和聚合物的混合物来制备多层互连导体，使得其一部分接触第一制备的导体，固化聚合物并且利用比粉末金属更高的金属和替换的金属进行增强置换反应第一导体的金属。

30. 发明授权

US4466850A Method for fabricating a one-time electrically activated switch 失效
标题翻译：制造一次电激活开关的方法
公开(公告)号：US4466850A
公开(公告)日：1984-08-21
申请号：US460326
申请日：1983-01-24
申请人： Charles W. Eichelberger , Robert J. Wojnarowski
发明人： Charles W. Eichelberger , Robert J. Wojnarowski
IPC分类号： H01C7/10 , H01C13/00
CPC分类号： H01C7/10
摘要： A one-time electrically-activated switch is composed of a cured polymeric binder which contains a powdered conductive material in an amount sufficient to establish particle-to-particle contact throughout the binder and in which the material powder particles have a non-conductive oxide surface sufficient to resist the flow of electricity below a given threshold. When a sufficiently high voltage is applied to the switch, the break-down voltage of the oxide layer is exceeded and avalanche current is permitted to flow. As a result, the oxide layer on the conductive particles breaks down along the break-down path and forms an irreversible low-impedance connection.
摘要翻译：一次性电激活开关由固化的聚合物粘合剂组成，其包含粉末状导电材料，其量足以在整个粘合剂中建立颗粒与颗粒的接触，并且其中材料粉末颗粒具有非导电氧化物表面足以抵抗低于给定阈值的电流。当对开关施加足够高的电压时，超过氧化物层的击穿电压，允许雪崩电流流动。结果，导电粒子上的氧化物层沿断裂线分解，形成不可逆的低阻抗连接。

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