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21. 发明申请

US20130037891A1 MEMS DEVICE AND METHOD OF FORMATION THEREOF 有权
标题翻译： MEMS器件及其形成方法
公开(公告)号：US20130037891A1
公开(公告)日：2013-02-14
申请号：US13206014
申请日：2011-08-09
申请人： Hsin-Ting Huang , Jung-Huei Peng , Shang-Ying Tsai , Yao-Te Huang , Ming-Tung Wu , Ping-Yin Liu , Xin-Hua Huang , Yuan-Chih Hsieh
发明人： Hsin-Ting Huang , Jung-Huei Peng , Shang-Ying Tsai , Yao-Te Huang , Ming-Tung Wu , Ping-Yin Liu , Xin-Hua Huang , Yuan-Chih Hsieh
IPC分类号： H01L29/84 , H01L21/02
CPC分类号： B81C1/00777 , B81B2207/07 , B81C1/00896 , H01L24/03 , H01L24/05 , H01L24/48 , H01L2224/03001 , H01L2224/03009 , H01L2224/04042 , H01L2224/05571 , H01L2224/48091 , H01L2224/48463 , H01L2224/83805 , H01L2224/85375 , H01L2924/00014 , H01L2924/01322 , H01L2924/10253 , H01L2924/1305 , H01L2924/13091 , H01L2924/1461 , H01L2924/16235 , H01L2924/00 , H01L2224/45099 , H01L2224/05552
摘要： The present disclosure provides a method including providing a first substrate; and forming a microelectromechanical system (MEMS) device on a first surface of the first substrate. A bond pad is formed on at least one bonding site on the first surface of the first substrate. The bonding site is recessed from the first surface. Thus, a top surface of the bond pad may lie below the plane of the top surface of the substrate. A device with recessed connective element(s) (e.g., bond pad) is also described. In further embodiments, a protective layer is formed on the recessed connective element during dicing of a substrate.
摘要翻译：本公开提供了一种方法，包括提供第一基板; 以及在所述第一基板的第一表面上形成微机电系统（MEMS）装置。在第一基板的第一表面上的至少一个结合部位上形成接合焊盘。接合部位从第一表面凹陷。因此，接合焊盘的顶表面可以位于衬底的顶表面的平面之下。还描述了具有凹入的连接元件（例如，接合焊盘）的器件。在另外的实施例中，在衬底切割期间，在凹入的连接元件上形成保护层。

22. 发明授权

US5986436A Electric power recovering system 失效
标题翻译：电力回收系统
公开(公告)号：US5986436A
公开(公告)日：1999-11-16
申请号：US947499
申请日：1997-10-10
申请人： Ping Yin Liu
发明人： Ping Yin Liu
IPC分类号： H02J7/00 , H02M1/34 , H02M3/00 , H02M3/155
CPC分类号： H02J7/0065 , H02J7/0093 , H02M1/34 , H02M3/155 , H02M2001/346 , H02M2003/1555 , Y02B40/90 , Y02B70/1491
摘要： An electric power recovering system includes a switch disposed between a battery and a coil, and two diodes coupled between the coil and the battery. A capacitor is coupled between the diodes and is grounded. The switch is alternatively actuated either manually or by an alternatively actuating device for allowing the coil to generate a high voltage and for allowing the coil to charge the battery. A DC/DC converter is further coupled between the battery and the switch for providing an increased electric power.
摘要翻译：电力回收系统包括设置在电池和线圈之间的开关，以及耦合在线圈和电池之间的两个二极管。电容器耦合在二极管之间并接地。开关交替地手动地或通过替代致动装置致动，以允许线圈产生高电压并且允许线圈对电池充电。 DC / DC转换器进一步耦合在电池和开关之间以提供增加的电力。

23. 发明授权

US09412725B2 Method and apparatus for image sensor packaging 有权
标题翻译：图像传感器封装的方法和装置
公开(公告)号：US09412725B2
公开(公告)日：2016-08-09
申请号：US13457637
申请日：2012-04-27
申请人： Szu-Ying Chen , Ping-Yin Liu , Calvin Yi-Ping Chao , Tzu-Jui Wang , Jen-Cheng Liu , Dun-Nian Yaung , Lan-Lin Chao
发明人： Szu-Ying Chen , Ping-Yin Liu , Calvin Yi-Ping Chao , Tzu-Jui Wang , Jen-Cheng Liu , Dun-Nian Yaung , Lan-Lin Chao
IPC分类号： H01L27/00 , H01L25/16 , H01L27/146
CPC分类号： H01L27/1469 , H01L25/16 , H01L27/14618 , H01L27/14621 , H01L27/14627 , H01L27/14632 , H01L27/14634 , H01L27/14636 , H01L27/1464 , H01L27/14643 , H01L27/14683 , H01L2924/0002 , H01L2924/00
摘要： Methods and apparatus for packaging a backside illuminated (BSI) image sensor or a sensor device with an application specific integrated circuit (ASIC) are disclosed. According to an embodiment, a sensor device may be bonded together face-to-face with an ASIC without using a carrier wafer, where corresponding bond pads of the sensor are aligned with bond pads of the ASIC and bonded together, in a one-to-one fashion. A column of pixels of the sensor may share a bond bad connected by a shared inter-metal line. The bond pads may be of different sizes and configured in different rows to be disjoint from each other. Additional dummy pads may be added to increase the bonding between the sensor and the ASIC.
摘要翻译：公开了用于封装具有专用集成电路（ASIC）的背面照明（BSI）图像传感器或传感器装置的方法和装置。根据实施例，传感器装置可以与ASIC面对面地结合在一起，而不使用载体晶片，其中传感器的相应接合焊盘与ASIC的接合焊盘对准并且结合在一起，以一对一一个时尚。传感器的像素列可以共享由共享的金属间线路连接不良的键。接合焊盘可以具有不同的尺寸并且被配置成不同的行以彼此不相交。可以添加附加的虚拟焊盘以增加传感器和ASIC之间的接合。

24. 发明授权

US08905293B2 Self-removal anti-stiction coating for bonding process 有权
标题翻译：用于粘合工艺的自去除防粘涂层
公开(公告)号：US08905293B2
公开(公告)日：2014-12-09
申请号：US12964347
申请日：2010-12-09
申请人： Ping-Yin Liu , Li-Cheng Chu , Hung-Hua Lin , Shang-Ying Tsai , Yuan-Chih Hsieh , Jung-Huei Peng , Lan-Lin Chao , Chia-Shiung Tsai , Chun-Wen Cheng
发明人： Ping-Yin Liu , Li-Cheng Chu , Hung-Hua Lin , Shang-Ying Tsai , Yuan-Chih Hsieh , Jung-Huei Peng , Lan-Lin Chao , Chia-Shiung Tsai , Chun-Wen Cheng
IPC分类号： B23K1/20 , B32B15/04 , B81C1/00
CPC分类号： B81C1/00269 , B32B7/12 , B32B15/043 , B32B15/20 , B32B2255/24 , B32B2307/746 , B32B2457/00 , B81B3/0005 , B81C2201/112 , Y10T428/12674 , Y10T428/12708 , Y10T428/12736 , Y10T428/12986
摘要： A bond free of an anti-stiction layer and bonding method is disclosed. An exemplary method includes forming a first bonding layer; forming an interlayer over the first bonding layer; forming an anti-stiction layer over the interlayer; and forming a liquid from the first bonding layer and interlayer, such that the anti-stiction layer floats over the first bonding layer. A second bonding layer can be bonded to the first bonding layer while the anti-stiction layer floats over the first bonding layer, such that a bond between the first and second bonding layers is free of the anti-stiction layer.
摘要翻译：公开了没有抗静电层和粘合方法的键。一种示例性方法包括形成第一粘合层; 在所述第一接合层上形成中间层; 在中间层上形成抗静电层; 以及从所述第一接合层和中间层形成液体，使得所述抗静电层浮在所述第一接合层上。第二接合层可以结合到第一接合层，同时抗静电层漂浮在第一接合层上，使得第一和第二接合层之间的接合没有抗静电层。

25. 发明授权

US08728845B2 Method and apparatus for selectively removing anti-stiction coating 有权
标题翻译：用于选择性去除抗静电涂层的方法和装置
公开(公告)号：US08728845B2
公开(公告)日：2014-05-20
申请号：US13071334
申请日：2011-03-24
申请人： Shih-Wei Lin , Ping-Yin Liu , Lan-Lin Chao , Jung-Huei Peng , Chia-Shiung Tsai
发明人： Shih-Wei Lin , Ping-Yin Liu , Lan-Lin Chao , Jung-Huei Peng , Chia-Shiung Tsai
IPC分类号： H01L21/56
CPC分类号： B81B3/0005 , B81C1/00269
摘要： The present disclosure provides various methods for removing an anti-stiction layer. An exemplary method includes forming an anti-stiction layer over a substrate, including over a first substrate region of a first material and a second substrate region of a second material, wherein the second material is different than the first material; and selectively removing the anti-stiction layer from the second substrate region of the second material without using a mask.
摘要翻译：本公开提供了用于去除抗静电层的各种方法。一种示例性方法包括在衬底上形成抗静电层，包括在第一材料的第一衬底区域和第二材料的第二衬底区域上，其中第二材料不同于第一材料; 并且不使用掩模，从第二材料的第二基板区域选择性地去除抗静电层。

26. 发明申请

US20130334638A1 Apparatus and Method for Backside Illuminated Image Sensors 有权
标题翻译：背面照明图像传感器的装置和方法
公开(公告)号：US20130334638A1
公开(公告)日：2013-12-19
申请号：US13524757
申请日：2012-06-15
申请人： Szu-Ying Chen , Tzu-Jui Wang , Jen-Cheng Liu , Dun-Nian Yaung , Ping-Yin Liu , Lan-Lin Chao
发明人： Szu-Ying Chen , Tzu-Jui Wang , Jen-Cheng Liu , Dun-Nian Yaung , Ping-Yin Liu , Lan-Lin Chao
IPC分类号： H01L31/0232 , H01L31/02
CPC分类号： H01L27/14634 , H01L27/14621 , H01L27/14627 , H01L27/14636 , H01L27/1464 , H01L27/1469
摘要： A backside illuminated image sensor comprises a photodiode and a first transistor located in a first substrate, wherein the first transistor is electrically coupled to the photodiode. The backside illuminated image sensor further comprises a plurality of logic circuits formed in a second substrate, wherein the second substrate is stacked on the first substrate and the logic circuit are coupled to the first transistor through a plurality of bonding pads.
摘要翻译：背面照明图像传感器包括光电二极管和位于第一衬底中的第一晶体管，其中第一晶体管电耦合到光电二极管。背面照明图像传感器还包括形成在第二基板中的多个逻辑电路，其中第二基板堆叠在第一基板上，并且逻辑电路通过多个接合焊盘耦合到第一晶体管。

27. 发明申请

US20120244677A1 METHOD AND APPARATUS FOR SELECTIVELY REMOVING ANTI-STICTION COATING 有权
标题翻译：用于选择性去除防粘涂层的方法和装置
公开(公告)号：US20120244677A1
公开(公告)日：2012-09-27
申请号：US13071334
申请日：2011-03-24
申请人： Shih-Wei Lin , Ping-Yin Liu , Lan-Lin Chao , Jung-Huei Peng , Chia-Shiung Tsai
发明人： Shih-Wei Lin , Ping-Yin Liu , Lan-Lin Chao , Jung-Huei Peng , Chia-Shiung Tsai
IPC分类号： H01L21/762
CPC分类号： B81B3/0005 , B81C1/00269
摘要： The present disclosure provides various methods for removing an anti-stiction layer. An exemplary method includes forming an anti-stiction layer over a substrate, including over a first substrate region of a first material and a second substrate region of a second material, wherein the second material is different than the first material; and selectively removing the anti-stiction layer from the second substrate region of the second material without using a mask.
摘要翻译：本公开提供了用于去除抗静电层的各种方法。一种示例性方法包括在衬底上形成抗静电层，包括在第一材料的第一衬底区域和第二材料的第二衬底区域上，其中第二材料不同于第一材料; 并且不使用掩模，从第二材料的第二基板区域选择性地去除抗静电层。

28. 发明申请

US20120148870A1 SELF-REMOVAL ANTI-STICTION COATING FOR BONDING PROCESS 有权
标题翻译：用于粘接工艺的自拆式防粘涂料
公开(公告)号：US20120148870A1
公开(公告)日：2012-06-14
申请号：US12964347
申请日：2010-12-09
申请人： Ping-Yin Liu , Li-Cheng Chu , Hung-Hua Lin , Shang-Ying Tsai , Yuan-Chih Hsieh , Jung-Huei Peng , Lan-Lin Chao , Chia-Shiung Tsai , Chun-Wen Cheng
发明人： Ping-Yin Liu , Li-Cheng Chu , Hung-Hua Lin , Shang-Ying Tsai , Yuan-Chih Hsieh , Jung-Huei Peng , Lan-Lin Chao , Chia-Shiung Tsai , Chun-Wen Cheng
IPC分类号： B32B15/01 , B23K1/20 , B32B15/04
CPC分类号： B81C1/00269 , B32B7/12 , B32B15/043 , B32B15/20 , B32B2255/24 , B32B2307/746 , B32B2457/00 , B81B3/0005 , B81C2201/112 , Y10T428/12674 , Y10T428/12708 , Y10T428/12736 , Y10T428/12986
摘要： A bond free of an anti-stiction layer and bonding method is disclosed. An exemplary method includes forming a first bonding layer; forming an interlayer over the first bonding layer; forming an anti-stiction layer over the interlayer; and forming a liquid from the first bonding layer and interlayer, such that the anti-stiction layer floats over the first bonding layer. A second bonding layer can be bonded to the first bonding layer while the anti-stiction layer floats over the first bonding layer, such that a bond between the first and second bonding layers is free of the anti-stiction layer.
摘要翻译：公开了没有抗静电层和粘合方法的键。一种示例性方法包括形成第一粘合层; 在所述第一接合层上形成中间层; 在中间层上形成抗静电层; 以及从所述第一接合层和中间层形成液体，使得所述抗静电层浮在所述第一接合层上。第二接合层可以结合到第一接合层，同时抗静电层漂浮在第一接合层上，使得第一和第二接合层之间的接合没有抗静电层。

29. 发明申请

US20060032447A1 Processing chamber with wave reflector 审中-公开
标题翻译：带反射镜的加工室
公开(公告)号：US20060032447A1
公开(公告)日：2006-02-16
申请号：US11074632
申请日：2005-03-09
申请人： Ping-Yin Liu , Ming-Fong Chen , Hung-Yin Tsai
发明人： Ping-Yin Liu , Ming-Fong Chen , Hung-Yin Tsai
IPC分类号： C23C16/00
CPC分类号： C23C16/274 , C23C16/482 , C23C16/511 , C23C16/52
摘要： The processing chamber comprises an energy wave source and a curved spherical surface, wherein the curved spherical surface of the chamber is composed of at least a Fresnel reflector for reflecting the energy wave discharged from the energy wave source and projecting the same onto a platform as the energy wave source is operating in coordination with the curved spherical surface. In addition, the energy wave source can be a microwave source or a light source. It is noted that the curved spherical surface can be a Fresnel reflector, a wave spherical surface with a portion thereof being replaced by a Fresnel reflector, a curved spherical surface with a portion therof being replaced by at least two Fresnel reflectors, and a surface entirely formed of a plurality of Fresnel reflectors. The processing chamber disclosed in the present invention significantly increases energy density, area, and energy uniformity of the projection region so as to diminish required space of equipment and costs of equipment and manufacture.
摘要翻译：所述处理室包括能量波源和弯曲球形表面，其中所述腔室的弯曲球形表面由至少一个菲涅尔反射器组成，用于反射从能量波源放出的能量波，并将其投射到平台上作为能量波源与曲面球面协调工作。此外，能量波源可以是微波源或光源。要注意的是，弯曲的球面可以是菲涅耳反射器，波面球形表面的一部分被菲涅耳反射器代替，弯曲的球形表面具有由至少两个菲涅尔反射器代替的部分，并且完全表面的表面由多个菲涅耳反射器形成。本发明公开的处理室显着地增加了投影区域的能量密度，面积和能量均匀性，从而减少了设备所需的空间和设备和制造成本。

30. 发明授权

US08629524B2 Apparatus for vertically integrated backside illuminated image sensors 有权
标题翻译：用于垂直集成的背面照明图像传感器的装置
公开(公告)号：US08629524B2
公开(公告)日：2014-01-14
申请号：US13458812
申请日：2012-04-27
申请人： Tzu-Jui Wang , Szu-Ying Chen , Jen-Cheng Liu , Dun-Nian Yaung , Ping-Yin Liu , Lan-Lin Chao
发明人： Tzu-Jui Wang , Szu-Ying Chen , Jen-Cheng Liu , Dun-Nian Yaung , Ping-Yin Liu , Lan-Lin Chao
IPC分类号： H01L31/0232
CPC分类号： H01L27/14683 , H01L27/14618 , H01L27/14634 , H01L27/1469 , H01L2924/0002 , H01L2924/00
摘要： A backside illuminated image sensor comprises a photodiode and a first transistor located in a first chip, wherein the first transistor is electrically coupled to the photodiode. The backside illuminated image sensor further comprises a second transistor formed in a second chip and a plurality of logic circuits formed in a third chip, wherein the second chip is stacked on the first chip and the third chip is stacked on the second chip. The logic circuit, the second transistor and the first transistor are coupled to each other through a plurality of boding pads and through vias.
摘要翻译：背面照明图像传感器包括光电二极管和位于第一芯片中的第一晶体管，其中第一晶体管电耦合到光电二极管。背面照明图像传感器还包括形成在第二芯片中的第二晶体管和形成在第三芯片中的多个逻辑电路，其中第二芯片堆叠在第一芯片上，第三芯片堆叠在第二芯片上。逻辑电路，第二晶体管和第一晶体管通过多个焊盘和通孔彼此耦合。

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