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21. 发明授权

US5385661A Acid electrolyte solution and process for the electrodeposition of copper-rich alloys exploiting the phenomenon of underpotential deposition 失效
标题翻译：酸性电解质溶液和电沉积富铜合金的方法，利用欠电位沉积现象
公开(公告)号：US5385661A
公开(公告)日：1995-01-31
申请号：US123623
申请日：1993-09-17
申请人： Panayotis C. Andricacos , I-Chia Chang , Hariklia Deligianni , Wilma J. Horkans
发明人： Panayotis C. Andricacos , I-Chia Chang , Hariklia Deligianni , Wilma J. Horkans
IPC分类号： C25D3/58
CPC分类号： C25D3/58
摘要： An acidic electrolytic solution for use in the electrodeposition of copper-rich alloys on a substrate, the less noble component being incorporated by underpotential deposition. The solution includes a first salt containing copper cations; a second salt containing cations of a metal less noble than copper; and an acid electrolyte (e.g., methane sulfonic acid) such that at typical current densities the potential is in the range of underpotential deposition of the less noble metal on the copper.Also provided is a process for using the acidic electrolytic solution. The process includes the following steps: (1) selecting a copper-rich alloy having, as the minor component, a metal that is less noble than copper and can form an underpotential deposition layer on copper; (2) selecting an acid electrolyte such that at typical current densities the potential is in the range of underpotential deposition of the metal on the copper; (3) providing in the acid solution simple salts of copper and of the less noble metal; and 4) applying a current between a cathode and an anode placed in the plating solution to plate the alloy on the cathode.
摘要翻译：一种酸性电解液，用于在基底上电沉积富含铜的合金，较不贵的组分通过欠电位沉积而结合。该溶液包括含有铜阳离子的第一盐; 含有比铜高贵金属的阳离子的第二盐; 和酸性电解质（例如，甲烷磺酸），使得在典型的电流密度下，电位在铜上较低贵金属的潜在沉积范围内。还提供了使用酸性电解液的方法。该方法包括以下步骤：（1）选择富铜合金，其具有作为次要成分的不如铜高贵金属并且可在铜上形成欠电沉积层的金属; （2）选择酸性电解液使得在典型的电流密度下，电位在金属在铜上的潜在沉积范围内; （3）在酸性溶液中提供铜和较少贵金属的简单盐; 以及4）在放置在镀液中的阴极和阳极之间施加电流以在阴极上镀合金。

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