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21. 发明授权

US5365113A Semiconductor device 无效
标题翻译：半导体器件
公开(公告)号：US5365113A
公开(公告)日：1994-11-15
申请号：US125
申请日：1993-01-04
申请人： Toshiyuki Sakuta , Kazuyuki Miyazawa , Satoshi Oguchi , Aizo Kaneda , Masao Mitani , Shozo Nakamura , Kunihiko Nishi , Gen Murakami
发明人： Toshiyuki Sakuta , Kazuyuki Miyazawa , Satoshi Oguchi , Aizo Kaneda , Masao Mitani , Shozo Nakamura , Kunihiko Nishi , Gen Murakami
IPC分类号： H01L23/29 , H01L23/495 , H01L23/48 , H01L23/02 , H01L23/28 , H01L29/46
CPC分类号： H01L23/4951 , H01L23/293 , H01L2224/05599 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48599 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01014 , H01L2924/01057 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/14
摘要： A semiconductor device is provided in connection with a semiconductor chip which has a plurality of bonding pads at a part corresponding to a centrally located area of the front or first main surface thereof, an organic insulator film which overlies the semiconductor chip and which has an opening in correspondence with the bonding pads, a plurality of leads which overly the organic insulator film, and a molding resin with which these constituents are sealed or packaged.
摘要翻译：半导体器件与半导体芯片相连，该半导体芯片在与其前表面或第一主表面的中心位置相对应的部分处具有多个接合焊盘;半导体芯片，覆盖在半导体芯片上并具有开口与接合焊盘相对应，多个有机绝缘膜上的引线，以及密封或封装这些成分的成型树脂。

22. 发明授权

US4463073A Method and apparatus for redressing defective photomask 失效
标题翻译：用于纠正有缺陷的光掩模的方法和装置
公开(公告)号：US4463073A
公开(公告)日：1984-07-31
申请号：US394642
申请日：1982-07-01
申请人： Tateoki Miyauchi , Katsuro Mizukoshi , Mikio Hongo , Masao Mitani , Masaaki Okunaka , Takao Kawanabe , Isao Tanabe
发明人： Tateoki Miyauchi , Katsuro Mizukoshi , Mikio Hongo , Masao Mitani , Masaaki Okunaka , Takao Kawanabe , Isao Tanabe
IPC分类号： G03F1/00 , G03F1/72 , H01L21/027 , H01L21/30 , G03F9/00
CPC分类号： G03F1/72 , H01L21/30 , Y10S430/139 , Y10S430/146
摘要： A method and apparatus for repairing defect portions of a photomask. A complex material from which a light shading material can be deposited is applied over the photomask. A white (blank) defect region is irradiated with a continuous wave laser light beam projected in a slit-like light image to thereby convert the complex material into the shading material. After washing, a half-deposited portion formed in a peripheral portion of the light shading region is further deposited by a post-baking process. Those portions of the light shading film which depart from the desired mask pattern are removed together with black (solid) defect portion originally present in the photomask through irradiation with a pulse laser light beam. The pulse laser is constituted by a Dye-laser, while the continuous wave laser is constituted by an Ar-laser. A specific half-mirror which transmits therethrough Ar-laser light while reflecting Dye-laser light is displaceable provided. The white and the black defects are selectively centered on a same optical axis of an optical projection system including a slit and a condenser lens, whereby the white and the black defect portions are each removed through irradiation with the associated laser light projected thereto in a slit-like light image through the same optical projection system.
摘要翻译：一种用于修复光掩模的缺陷部分的方法和装置。将光阴影材料沉积的复合材料施加在光掩模上。用投影在狭缝状光图像中的连续波激光束照射白色（空白）缺陷区域，从而将复合材料转换成遮光材料。洗涤后，通过后烘烤处理进一步沉积形成在遮光区域的周边部分中的半沉积部分。通过照射脉冲激光，与原来存在于光掩模中的黑色（实心）缺陷部分一起除去遮光膜的偏离所需掩模图案的那些部分。脉冲激光由染料激光器构成，而连续波激光由Ar激光器构成。通过反射染料激光而透过其的Ar激光的特定半反射镜是可置换的。白色和黑色缺陷选择性地集中在包括狭缝和聚光透镜的光学投影系统的相同光轴上，由此白色和黑色缺陷部分通过照射投射到狭缝中的相关激光而被去除类似的光图像通过相同的光学投影系统。

23. 发明授权

US07043837B2 Method of manufacture of inkjet printer head 有权
公开(公告)号：US07043837B2
公开(公告)日：2006-05-16
申请号：US10277837
申请日：2002-10-23
申请人： Ryoichi Yamamoto , Masao Mitani
发明人： Ryoichi Yamamoto , Masao Mitani
IPC分类号： B23P17/00 , B41J2/165
CPC分类号： B41J2/14016 , B41J2/1603 , B41J2/1623 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1635 , B41J2/1642 , B41J2/1643 , B41J2/1645 , B41J2/1646 , B41J2202/03 , Y10T29/49401 , Y10T29/49812
摘要： The inkjet recording head includes a head body and a metallic film is provided at least on a part of at least one side of the head body. The head body includes a plurality of orifices, an ink ejection unit arranged so as to correspond to each of the orifices, an independent ink flow path for supplying ink to each of the orifices and a common ink flow path for supplying ink to the independent ink flow path. The manufacturing method of the inkjet recording head forms the metallic film at least on a part of an opposite surface of a substrate to the individual ink flow paths, before adhering the orifice plate in which the orifices are formed. The inkjet printer uses the inkjet recording head.

24. 发明授权

US06403476B2 Semiconductor chip, semiconductor wafer, semiconductor device and method of manufacturing the semiconductor device 失效
标题翻译：半导体芯片，半导体晶片，半导体器件及半导体器件的制造方法
公开(公告)号：US06403476B2
公开(公告)日：2002-06-11
申请号：US09917208
申请日：2001-07-30
申请人： Jin Murayama , Masao Mitani
发明人： Jin Murayama , Masao Mitani
IPC分类号： H01L2144
CPC分类号： H01L21/481 , B41J2/1603 , B41J2/1631 , B41J2/1632 , Y10S438/945
摘要： An object of the present invention is forming a concave portion (including a penetration hole) in a semiconductor substrate by a sandblast method without causing a defect such as a chip or a crack in processing ends of the concave portion. In order to achieve the object, in a semiconductor wafer in which a plurality of semiconductor chips are formed, a metal film is formed on the semiconductor substrate at least in a region of a predetermined range in an inside and an outside of an circumferential portion except for a central portion and its vicinity of a region in that the concave portion (including the penetration hole) of the respective semiconductor chips is to be formed. Then, the entire surface of the semiconductor wafer including the metal film is masked except for the region in that the concave portion of the respective semiconductor chips is to be formed. With this state, the concave portion is formed in the respective semiconductor chips formed on the semiconductor wafer by the sandblast method.
摘要翻译：本发明的目的是通过喷砂法在半导体衬底中形成凹部（包括穿透孔），而不会在凹部的处理端部引起诸如芯片或裂纹的缺陷。为了实现该目的，在其中形成有多个半导体芯片的半导体晶片中，至少在周向部分的内部和外部的至少一个预定范围的区域中在半导体衬底上形成金属膜，除了对于要形成各个半导体芯片的凹部（包括贯通孔）的区域的中心部分及其附近。然后，除了要形成各个半导体芯片的凹部的区域之外，掩模包括金属膜的半导体晶片的整个表面。在这种状态下，通过喷砂法在凹凸部分形成在半导体晶片上形成的各个半导体芯片中。

25. 发明授权

US5670996A Thermal ink jet recording device and method of cleaning a recording head 失效
标题翻译：热喷墨记录装置和清洁记录头的方法
公开(公告)号：US5670996A
公开(公告)日：1997-09-23
申请号：US414490
申请日：1995-03-31
申请人： Masao Mitani
发明人： Masao Mitani
IPC分类号： B41J2/165 , B41J2/18 , B41J2/185 , B41J11/00
CPC分类号： B41J2/16547 , B41J2/16585 , B41J2/16541 , B41J2002/1742
摘要： In an ink jet recording device of the type wherein ink droplets are ejected from orifices using thermal energy and the heater for supplying the thermal energy is oriented in a direction substantially perpendicular to the orifice surface, a cleaning unit is provided for cleaning the head of the device. The cleaning unit includes an integral wiper and ink pool. In cleaning the head, ink that gathers on the wiper will drip downward by its own weight, resulting in very little spread toward adjacent orifice, thereby minimizing the degree at which different color inks mix on the surface of the head.
摘要翻译：在其中使用热能喷射墨滴的类型的喷墨记录装置中，并且用于供应热能的加热器在基本上垂直于孔表面的方向上定向，提供清洁单元以清洁设备。清洁单元包括一体式刮水器和墨水池。在清洁头部时，聚集在擦拭器上的墨水将以其自身的重量向下滴落，导致相邻孔口的扩散很少，从而使不同颜色的墨水在头部表面上混合的程度最小化。

26. 发明授权

US5514905A Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US5514905A
公开(公告)日：1996-05-07
申请号：US329824
申请日：1994-10-27
申请人： Toshiyuki Sakuta , Kazuyuki Miyazawa , Satoshi Oguchi , Aizo Kaneda , Masao Mitani , Shozo Nakamura , Kunihiko Nishi , Gen Murakami
发明人： Toshiyuki Sakuta , Kazuyuki Miyazawa , Satoshi Oguchi , Aizo Kaneda , Masao Mitani , Shozo Nakamura , Kunihiko Nishi , Gen Murakami
IPC分类号： H01L23/29 , H01L23/495 , H01L23/48 , H01L29/41
CPC分类号： H01L23/4951 , H01L23/293 , H01L2224/05599 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48599 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01014 , H01L2924/01057 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/14
摘要： A semiconductor device is provided in connection with a semiconductor chip which has a plurality of bonding pads at a part corresponding to a centrally located area of the front or first main surface thereof, an organic insulator film which overlies the semiconductor chip and which has an opening in correspondence with the bonding pads, a plurality of leads which overly the organic insulator film, and a molding resin with which these constituents are sealed or packaged.
摘要翻译：半导体器件与半导体芯片相连，该半导体芯片在与其前表面或第一主表面的中心位置相对应的部分处具有多个接合焊盘;半导体芯片，覆盖在半导体芯片上并具有开口与接合焊盘相对应，多个有机绝缘膜上的引线以及密封或封装这些成分的成型树脂。

27. 发明授权

US5499087A Heat fixing device and electrophotographic apparatus incorporating the same having a PTC heating element received in a recess of a holder 失效
标题翻译：具有PTC加热元件的热固定装置和电子照相装置具有容纳在保持器的凹部中的PTC加热元件
公开(公告)号：US5499087A
公开(公告)日：1996-03-12
申请号：US57637
申请日：1993-05-07
申请人： Chikara Hiraoka , Junichi Matsuno , Masao Mitani , Hiroshi Oda , Toshikazu Tsumura
发明人： Chikara Hiraoka , Junichi Matsuno , Masao Mitani , Hiroshi Oda , Toshikazu Tsumura
IPC分类号： G03G15/20
CPC分类号： G03G15/2064 , G03G15/2053 , G03G2215/2016 , G03G2215/2038
摘要： A heat fixing device includes a heating head formed by attaching a radiant plate to the radiant surface of a PTC heating element using an adhesive having an excellent thermal conductivity, and embedding a heating unit, of which surfaces except the radiant surface are shielded with an adiabatic material, in a recess formed in a holder for supporting the heating unit.
摘要翻译：热定影装置包括加热头，该加热头通过使用具有优异导热性的粘合剂将辐射板附接到PTC加热元件的辐射表面，并且包埋加热单元，其中辐射表面之外的表面用绝热屏蔽材料，形成在用于支撑加热单元的保持器中的凹部中。

28. 发明授权

US5386281A Thermal fixing device 失效
标题翻译：热固定装置
公开(公告)号：US5386281A
公开(公告)日：1995-01-31
申请号：US64805
申请日：1993-05-21
申请人： Masao Mitani , Kazuo Shimizu
发明人： Masao Mitani , Kazuo Shimizu
IPC分类号： G03G15/20 , G03G21/00
CPC分类号： G03G15/2064
摘要： A thermal fixing device including a pair of rotating rollers which are press-contacted to each other, a heating section associated with at least one of the rollers and an image supporter having an unfixed toner image which is passed through a gap between the rollers so that the unfixed toner image is thermally (melt) fixed, the heating section having an integral structure type heating and cooling device which includes a cooler and a heater acting as a support, and wherein the fixing device further includes a thin endless metal belt which rotates while contacting the integral structure type device and which has a non-adhesive film on the outer surface of the belt, and a drive roller which drives the endless metal belt for rotation while applying tension to the endless metal belt. The surface temperature at a portion where the endless metal belt is in pressure-contact with the image supporter is first increased to a temperature (Tm) near the melting point of the toner and then cooled so that the image supporter can be stripped prior to the endless metal belt, and so that the temperature is higher than the glass transition point of the toner and lower than the softening point of the toner.
摘要翻译：一种热定影装置，包括彼此压接的一对旋转辊，与至少一个辊相关联的加热部分和具有通过辊之间的间隙的未定影调色剂图像的图像载体，使得未定影的调色剂图像被热（熔融）固定，加热部分具有包括冷却器和作为支撑件的加热器的整体结构型加热和冷却装置，并且其中定影装置还包括薄的环形金属带，其旋转同时接触一体结构型装置，并且在带的外表面上具有非粘性膜;以及驱动辊，其驱动环形金属带旋转同时向环形金属带施加张力。首先将环形金属带与图像载体压力接触的部分的表面温度升高到接近调色剂熔点的温度（Tm），然后冷却，使图像支持体在并且使得温度高于调色剂的玻璃化转变点并低于调色剂的软化点。

29. 发明授权

US5216466A Electrophotographic recording apparatus and system including a dielectric belt and transfer and fixing means 失效
标题翻译：电磁记录装置和系统，包括电介质带和传送和固定装置
公开(公告)号：US5216466A
公开(公告)日：1993-06-01
申请号：US858088
申请日：1992-03-26
申请人： Masao Mitani
发明人： Masao Mitani
IPC分类号： G03G21/16 , G03G15/00 , G03G15/01 , G03G15/05 , G03G15/18 , G03G15/20 , G03G21/00
CPC分类号： G03G15/18 , G03G15/0194 , G03G2215/0119 , G03G2215/0497 , G03G2215/1685
摘要： In the improved electrophotographic recording apparatus, exposure is performed on a photoreceptor drum 7 in response to a signal from an optical head 13 provided in the vicinity of the drum 7, a thin endless metal belt 4 having a dielectric layer on the outer surface being brought into contact with the drum 7 so as to form an electrostatic latent image on the belt 4 and, thereafter, the latent image being developed with a toner 9 to produce a toner image which is then transferred onto a transfer medium 10 and permanently fixed to record the final image. This apparatus is free from deterioration of the photoreceptor and it is only the toner which is one of the consumables that needs maintenance, thereby reducing not only the economic burden on the part of the user but also the number of parts or components. Two or more units of this apparatus may be arranged in series in a geometric pattern to construct a multi-color printing electrophotographic recording system.
摘要翻译：在改进的电子照相记录装置中，响应于来自设置在鼓7附近的光学头13的信号，对感光鼓7进行曝光，在外表面上具有介电层的薄的环形金属带4 与滚筒7接触，以在皮带4上形成静电潜像，然后用调色剂9显影潜像，以产生调色剂图像，然后转印到转印介质10上并永久固定记录最后的形象。该装置没有感光体的劣化，并且仅仅是需要维护的消耗品之一的调色剂，从而不仅减少了使用者的经济负担，而且减少了部件或部件的数量。该装置的两个或多个单元可以以几何图案串联布置以构成多色印刷电子照相记录系统。

30. 发明授权

US4983110A Resin encapsulating apparatus for semiconductor devices 失效
标题翻译：用于半导体器件的树脂封装装置
公开(公告)号：US4983110A
公开(公告)日：1991-01-08
申请号：US323497
申请日：1989-03-13
申请人： Isamu Yoshida , Junichi Saeki , Shigeharu Tsunoda , Kunihiko Nishi , Masao Mitani
发明人： Isamu Yoshida , Junichi Saeki , Shigeharu Tsunoda , Kunihiko Nishi , Masao Mitani
IPC分类号： B29C45/02 , B29C45/14 , H01L21/56
CPC分类号： B29C45/14655 , B29C45/02 , H01L21/565 , H01L24/97 , B29C2045/024 , B29C2045/2712 , H01L2924/181
摘要： A resin encapsulating apparatus for semiconductor devices is characterized by including a rectangular pot constituted by being surrounded with two opposed wall surfaces of short side each having an outwardly projecting curved surface and two opposed wall surfaces of long side which are each substantially in the form of a straight line; a plurality of cavity lines connected respectively through gates to the bottom portion of at least one said long-side wall surface of the pot, the cavity lines each consisting of cavities connected in series; and a plunger to be inserted into the pot.
摘要翻译：一种用于半导体器件的树脂封装装置的特征在于包括矩形盆，该矩形盆由两个相对的短边的相对的壁表面围绕，每个具有向外突出的弯曲表面和两个相对的长边的相对的壁表面基本上呈直线; 多个腔体线分别通过浇口连接到所述罐的至少一个所述长边壁表面的底部，每个空腔线由空腔连接成串联连接; 以及插入锅中的柱塞。

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