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    • 24. 发明授权
    • Negative resist composition
    • 负阻抗组成
    • US07432034B2
    • 2008-10-07
    • US10642291
    • 2003-08-18
    • Shoichiro YasunamiKoji Shirakawa
    • Shoichiro YasunamiKoji Shirakawa
    • G03F7/004G03F7/30
    • G03F7/0382Y10S430/106Y10S430/111
    • A negative resist composition of the present invention comprises: (A) an alkali-soluble resin; (B-1) a cross-linking agent capable of cross-linking with the alkali-soluble resin (A) by the action of an acid, in which the cross-linking agent is a phenol compound containing: in the molecule one or more benzene rings; and at least two cross-linking groups bonded to any of the benzene rings, the cross-linking group being a group selected from the group consisting of a hydroxymethyl group, an alkoxymethyl group and an acyloxymethyl group; (B-2) a cross-linking agent capable of cross-linking with the alkali-soluble resin (A) by the action of an acid, in which the cross-linking agent contains at least two specific groups; and (C) a compound capable of generating an acid upon irradiation with an actinic ray or radiation.
    • 本发明的负光刻胶组合物包含:(A)碱溶性树脂; (B-1)能够通过酸的作用与碱溶性树脂(A)交联的交联剂,其中交联剂是酚化合物,其在分子中含有一个或多个 苯环; 和至少两个与任何苯环结合的交联基团,所述交联基团是选自羟甲基,烷氧基甲基和酰氧基甲基的基团; (B-2)能够通过酸的作用与碱溶性树脂(A)交联的交联剂,其中交联剂含有至少两个特定基团; 和(C)能够在用光化射线或辐射照射时能产生酸的化合物。