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    • 23. 发明申请
    • OPTICAL COMPONENT, MANUFACTURING METHOD OF THE SAME AND BACKLIGHT MODULE
    • 光学元件,其制造方法和背光模块
    • US20100259950A1
    • 2010-10-14
    • US12421816
    • 2009-04-10
    • Yan-Zuo ChenWen-Feng ChengChih-Wei HuangChun-Wei WangCheng Lin
    • Yan-Zuo ChenWen-Feng ChengChih-Wei HuangChun-Wei WangCheng Lin
    • F21V13/02G02B27/10G03F7/20
    • G02B5/045F21V5/002F21V13/04G02F2001/133607
    • The present invention provides an optical component, a manufacturing method of the same and a backlight module including the foregoing optical component. The optical component includes a plurality of microstructures and reflecting members. The microstructure is extended along a first direction and arranged along a second direction on a light exit surface, and a distance between the first curve and the second curve in the second direction is not equal and not parallel, and a distance between the second curve and another first curve in the second direction being not equal and not parallel. Each reflecting member is extended along the first direction and arranged along the second direction on a light entrance surface and the position of each reflecting member is among two microstructures. Each of the reflecting members to the light entrance surface has a thickness t, a length of the microstructure in the second direction is a width P, the optical component has a refractive index n, and t, P and n satisfy a formula of tan−1(P/(10t))>sin−1(1/n). When the design of the optical component satisfies the foregoing formula, it will achieve better optical performance.
    • 本发明提供一种光学部件及其制造方法以及包括上述光学部件的背光模块。 光学部件包括多个微结构和反射部件。 微结构沿着第一方向延伸并且沿着第二方向在光出射表面上布置,并且第一曲线和第二曲线之间的距离在第二方向上不相等且不平行,并且第二曲线与 第二方向上的另一第一曲线不相等而不平行。 每个反射构件沿第一方向延伸并且沿着第二方向在光入射表面上布置,并且每个反射构件的位置在两个微结构之间。 每个到光入射表面的反射部件具有厚度t,第二方向上的微结构的长度是宽度P,光学部件具有折射率n,并且t,P和n满足tan- 1(P /(10t))> sin-1(1 / n)。 当光学部件的设计满足上述公式时,将获得更好的光学性能。
    • 26. 发明申请
    • SYSTEM AND METHOD FOR DETECTING DEFECTS IN CAMERA MODULES
    • 用于检测摄像机模块中的缺陷的系统和方法
    • US20080247634A1
    • 2008-10-09
    • US11875123
    • 2007-10-19
    • CHIH-WEI HUANG
    • CHIH-WEI HUANG
    • G06K9/00
    • H04N17/002H04N5/2257
    • A method for detecting defects in camera modules is provided. The method includes the following: an image is acquired from the camera module; a comparison formula and a standard value of defect luminance are set; the image is divided into many test regions; the corresponding reference regions are then plotted out; a test region is selected, and a reference region is confirmed correspondingly; averages of gray scale values of the selected test region and the confirmed reference region are calculated; a defect luminance of the selected test region is calculated; the calculated defect luminance is compared with the standard value for confirming whether the camera module is of satisfactory quality. A related system is also disclosed.
    • 提供了一种用于检测相机模块中的缺陷的方法。 该方法包括:从相机模块获取图像; 设定比较公式和缺陷亮度的标准值; 图像分为许多测试区域; 然后绘出对应的参考区域; 选择测试区域,并相应地确认参考区域; 计算所选测试区域和确认的参考区域的灰度值的平均值; 计算所选择的测试区域的缺陷亮度; 将计算的缺陷亮度与用于确认相机模块是否具有令人满意的质量的标准值进行比较。 还公开了相关系统。
    • 27. 发明授权
    • Method and system for smart vehicle route selection
    • 智能车辆路线选择方法与系统
    • US07356378B1
    • 2008-04-08
    • US11695988
    • 2007-04-03
    • Chih-Wei HuangHui-Yi ChenRen-Chyi YuChuh-Yuan Yu
    • Chih-Wei HuangHui-Yi ChenRen-Chyi YuChuh-Yuan Yu
    • G06F7/00
    • G05B19/41895G05B2219/31002G05B2219/31276G05B2219/45031G06Q10/047Y02P90/12Y02P90/20Y02P90/285Y02P90/60
    • In one aspect a factory automation system for a wafer fab is provided. The factory automation system comprises: a manufacturing execution system (“MES”) for providing lot information; a material control system (“MCS”) for providing dynamic traffic information; an automated material handling system (“AMHS”) for providing static route information; and a real-time dispatching (“RTD”) system to select a destination and a route for a wafer carrier in response to a transfer request. In another aspect a method of transferring a wafer lot within a wafer fabrication facility (“fab”) using a factory automation system is provided. The method comprises: receiving a transfer request to move the wafer lot from a first position to a second position within the fab; obtaining lot information, dynamic traffic information, and static traffic information; using the information to select a route between the first position and the second position; and executing the transfer using the selected route.
    • 在一个方面,提供了用于晶圆厂的工厂自动化系统。 工厂自动化系统包括:用于提供批量信息的制造执行系统(“MES”); 用于提供动态交通信息的物料控制系统(“MCS”); 用于提供静态路线信息的自动化材料处理系统(“AMHS”); 以及实时调度(“RTD”)系统,以响应于转移请求来选择晶片载体的目的地和路线。 在另一方面,提供了使用工厂自动化系统在晶片制造设备(“fab”)内转移晶片块的方法。 该方法包括:接收转移请求以将晶片批次从第一位置移动到晶圆厂内的第二位置; 获取批量信息,动态交通信息和静态交通信息; 使用所述信息来选择所述第一位置和所述第二位置之间的路线; 并使用所选择的路线执行传送。