会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 23. 发明授权
    • Refrigerating and freezing device
    • US12025362B2
    • 2024-07-02
    • US17431243
    • 2020-02-11
    • QINGDAO HAIER SPECIAL REFRIGERATOR CO., LTDQINGDAO HAIER REFRIGERATOR CO., LTD.HAIER SMART HOME CO., LTD.
    • Haijuan WangKunkun ZhaoSen MuPeng Li
    • F25D11/02F25D23/12H05B6/12
    • F25D11/02F25D23/12H05B6/12
    • A refrigerating and freezing device (1) is provided, which includes: a cabinet body, wherein at least one storage compartment (11) is defined in the cabinet body, and a heating cavity configured to accommodate a to-be-processed object is defined in one of the storage compartments (11); and an electromagnetic heating device, configured to provide electromagnetic waves into the heating cavity to heat the to-be-processed object, wherein the electromagnetic heating device is provided with an electromagnetic generation module (21) configured to generate an electromagnetic wave signal and a power supply module (24) configured to provide a power source to the electromagnetic generation module (21). An accommodation groove (12) with a backward opening is formed in a back of the cabinet body (10), the backward opening of the accommodation groove (12) is covered with a cover body (13) to define an accommodation space (14) between the accommodation groove (12) and the cover body (13), and heat dissipation holes configured to achieve communication between the accommodation space (14) and an external environment where the cabinet body (10) is located are formed in the cover body (13). The power supply module (24) is disposed in the accommodation space (14), and a heat dissipation fan (31) is further disposed in the accommodation space (14) and is configured to drive airflow to flow between the accommodation space (14) and the external environment where the cabinet body (10) is located through the heat dissipation holes, so as to dissipate heat from the power supply module (24), and the heat dissipation efficiency is improved.