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11. 发明授权

US3934333A Method of constructing bilateral heater unit 失效
标题翻译：双边加热器组合方法
公开(公告)号：US3934333A
公开(公告)日：1976-01-27
申请号：US527186
申请日：1974-11-26
申请人： John W. Churchill
发明人： John W. Churchill
IPC分类号： H05B3/06 , H05B3/48 , H05B3/52 , H05B3/00
CPC分类号： H05B3/52 , H05B3/06 , H05B3/48 , Y10T29/49083 , Y10T29/49091 , Y10T29/49098
摘要： A heater unit of bilateral construction is formed by forming a resistor assembly of a resistor helix extending between cylindrical terminals and overlapping the same, inserting the assembly in a sheath tube, filling the tube with MgO powder, placing laminated mica end plugs over the terminals and extending into the ends of the tube, bending the tube into a U-shape, pressing the legs of the U together and feeding the pressed unit through swaging dies to deform the tube over the entire length thereof to provide a heater unit of substantially circular cross section and having two legs of substantially semicircular cross section. The resistor helix in the area of the leg portions has a cross-sectional shape corresponding to the cross-sectional shape of the sheath and the terminals and mica plugs within the sheath are flattened to provide a similar cross-sectional shape thereby locking the terminals within the sheath.
摘要翻译：通过在圆柱形端子之间形成电阻螺旋形的电阻器组件，并将其重叠，形成一个双面结构的加热器单元，将组件插入鞘管中，用MgO粉末填充管，将层叠的云母端塞放置在端子上，延伸到管的端部，将管弯曲成U形，将U形腿的一体压在一起，并通过型锻模具将压制单元供给到模具上，使管在其整个长度上变形，从而提供基本圆形交叉的加热器单元并且具有基本上半圆形横截面的两条腿。腿部区域中的电阻螺旋线具有对应于护套的截面形状的横截面形状，并且端子和鞘内的云母塞被平坦化以提供类似的横截面形状，从而将端子锁定在护套。

12. 发明授权

US3478423A Pressing and compressing tubular heaters 失效
标题翻译：压缩和压缩管式加热器
公开(公告)号：US3478423A
公开(公告)日：1969-11-18
申请号：US3478423D
申请日：1965-07-28
申请人： BLECKMANN & CO
发明人： JAGERSBERGER ADOLF
IPC分类号： H05B3/00 , H05B3/52 , H01C17/00
CPC分类号： H05B3/52 , H05B3/00 , Y10T29/49091

13. 发明授权

US3438128A Method of making electric heating elements 失效
标题翻译：制作电加热元件的方法
公开(公告)号：US3438128A
公开(公告)日：1969-04-15
申请号：US3438128D
申请日：1966-02-01
申请人： ASS ELECT IND
发明人： SIMS WILLIAM JOHN
IPC分类号： H05B3/48 , H01C15/04 , H01C17/00
CPC分类号： H05B3/48 , Y10T29/49089 , Y10T29/49091

14. 发明授权

US3123898A figure 失效
公开(公告)号：US3123898A
公开(公告)日：1964-03-10
申请号：US3123898D
IPC分类号： B21D53/02 , H05B3/68
CPC分类号： B21D53/02 , H05B3/688 , Y10T29/49087 , Y10T29/49091

15. 发明授权

US2269195A Electric heater 失效
公开(公告)号：US2269195A
公开(公告)日：1942-01-06
申请号：US37070540
申请日：1940-12-18
申请人： GEN ELECTRIC
发明人： FINLAYSON FRANK E
IPC分类号： H01B7/16
CPC分类号： H01B7/16 , Y10T29/49089 , Y10T29/49091

16. 发明授权

US2139785A Electrical heating element and method of making same 失效
标题翻译：电加热元件及其制造方法
公开(公告)号：US2139785A
公开(公告)日：1938-12-13
申请号：US13764237
申请日：1937-04-19
申请人： WIEGAND EDWIN L
发明人： WIEGAND EDWIN L
IPC分类号： H05B3/30
CPC分类号： H05B3/30 , Y10T29/49091 , Y10T29/49098

17. 发明授权

US1793829A Electrical resistance unit and method of producing the same 失效
标题翻译：电阻单元及其制造方法
公开(公告)号：US1793829A
公开(公告)日：1931-02-24
申请号：US2525
申请日：1925-01-02
申请人： CUTLER HAMMER INC
发明人： RICHARDSON LINWOOD T , SCHMIEL EDGAR M
IPC分类号： H05B3/48
CPC分类号： H05B3/48 , Y10T29/49091

18. 发明授权

US07870664B2 Method of making circuitized substrate with a resistor 失效
标题翻译：用电阻制作电路化基板的方法
公开(公告)号：US07870664B2
公开(公告)日：2011-01-18
申请号：US11797236
申请日：2007-05-02
申请人： Rabindra N. Das , John M. Lauffer , Vova R. Markovich
发明人： Rabindra N. Das , John M. Lauffer , Vova R. Markovich
IPC分类号： H05K3/30
CPC分类号： H05K1/167 , H01G4/206 , H01L2224/16 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/0102 , H01L2924/01025 , H01L2924/01046 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/15311 , H01L2924/16195 , H01L2924/3011 , H05K1/095 , H05K1/162 , H05K3/0023 , H05K2201/0187 , H05K2201/0209 , H05K2201/0215 , H05K2201/0257 , H05K2203/1453 , Y10T29/49082 , Y10T29/49087 , Y10T29/49089 , Y10T29/49091 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165 , H01L2224/0401
摘要： A method of making a circuitized substrate including a resistor comprised of material which includes a polymer resin and a quantity of nano-powders including a mixture of at least one metal component and at least one ceramic component. The ceramic component may be a ferroelectric ceramic and/or a high surface area ceramic and/or a transparent oxide and/or a dope manganite. Alternatively, the material will include the polymer resin and nano-powders, with the nano-powders comprising at least one metal coated ceramic and/or at least one oxide coated metal component. An electrical assembly (substrate and at least one electrical component) and an information handling system (e.g., personal computer) utilizing such a circuitized substrate are also provided.
摘要翻译：一种制造电路化基板的方法，包括由包括聚合物树脂的材料和包括至少一种金属组分和至少一种陶瓷组分的混合物的纳米粉末的量组成的电阻器。陶瓷部件可以是铁电陶瓷和/或高表面积陶瓷和/或透明氧化物和/或掺杂亚锰酸盐。或者，材料将包括聚合物树脂和纳米粉末，其中纳米粉末包含至少一种金属涂覆的陶瓷和/或至少一种氧化物涂覆的金属组分。还提供了使用这种电路化基板的电气组件（基板和至少一个电气部件）以及信息处理系统（例如，个人计算机）。

19. 发明申请

US20080151515A1 Method of making circuitized substrate with resistor including material with metal component and electrical assembly and information handling system utilizing said circuitized substrate 失效
标题翻译：制造具有电阻器的电路化基板的方法，包括具有金属部件的材料和利用所述电路化基板的电气组件和信息处理系统
公开(公告)号：US20080151515A1
公开(公告)日：2008-06-26
申请号：US11797236
申请日：2007-05-02
申请人： Rabindra N. Das , John M. Lauffer , Vova R. Markovich
发明人： Rabindra N. Das , John M. Lauffer , Vova R. Markovich
IPC分类号： H05K1/16 , H05K1/18 , H05K3/10
CPC分类号： H05K1/167 , H01G4/206 , H01L2224/16 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/0102 , H01L2924/01025 , H01L2924/01046 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/15311 , H01L2924/16195 , H01L2924/3011 , H05K1/095 , H05K1/162 , H05K3/0023 , H05K2201/0187 , H05K2201/0209 , H05K2201/0215 , H05K2201/0257 , H05K2203/1453 , Y10T29/49082 , Y10T29/49087 , Y10T29/49089 , Y10T29/49091 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165 , H01L2224/0401
摘要： A method of making a circuitized substrate including a resistor comprised of material which includes a polymer resin and a quantity of nano-powders including a mixture of at least one metal component and at least one ceramic component. The ceramic component may be a ferroelectric ceramic and/or a high surface area ceramic and/or a transparent oxide and/or a dope manganite. Alternatively, the material will include the polymer resin and nano-powders, with the nano-powders comprising at least one metal coated ceramic and/or at least one oxide coated metal component. An electrical assembly (substrate and at least one electrical component) and an information handling system (e.g., personal computer) utilizing such a circuitized substrate are also provided.
摘要翻译：一种制造电路化基板的方法，包括由包括聚合物树脂的材料和包括至少一种金属组分和至少一种陶瓷组分的混合物的纳米粉末的量组成的电阻器。陶瓷部件可以是铁电陶瓷和/或高表面积陶瓷和/或透明氧化物和/或掺杂亚锰酸盐。或者，材料将包括聚合物树脂和纳米粉末，其中纳米粉末包含至少一种金属涂覆的陶瓷和/或至少一种氧化物涂覆的金属组分。还提供了使用这种电路化基板的电气组件（基板和至少一个电气部件）以及信息处理系统（例如，个人计算机）。

20. 发明申请

US20060151202A1 Resistor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said ciruitized substrate, and information handling system utilizing said ciruitized substrate 失效
标题翻译：具有用于电路化基板的金属部件的电阻材料，利用其的电路化基板，制造所述电路化基板的方法和利用所述电路化基板的信息处理系统
公开(公告)号：US20060151202A1
公开(公告)日：2006-07-13
申请号：US11172786
申请日：2005-07-05
申请人： Rabindra Das , John Lauffer , Voya Markovich
发明人： Rabindra Das , John Lauffer , Voya Markovich
IPC分类号： H05K1/03 , H05K1/09 , H05K1/16
CPC分类号： H05K1/167 , H01G4/206 , H01L2224/16 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/0102 , H01L2924/01025 , H01L2924/01046 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/15311 , H01L2924/16195 , H01L2924/3011 , H05K1/095 , H05K1/162 , H05K3/0023 , H05K2201/0187 , H05K2201/0209 , H05K2201/0215 , H05K2201/0257 , H05K2203/1453 , Y10T29/49082 , Y10T29/49087 , Y10T29/49089 , Y10T29/49091 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165 , H01L2224/0401
摘要： A material for use as part of an internal resistor within a circuitized substrate includes a polymer resin and a quantity of nano-powders including a mixture of at least one metal component and at least one ceramic component. The ceramic component may be a ferroelectric ceramic and/or a high surface area ceramic and/or a transparent oxide and/or a dope manganite. Alternatively, the material will include the polymer resin and nano-powders, with the nano-powders comprising at least one metal coated ceramic and/or at least one oxide coated metal component. A circuitized substrate adapted for using such a material and resistor therein and a method of making such a substrate are also provided. An electrical assembly (substrate and at least one electrical component) and an information handling system (e.g., personal computer) are also provided.
摘要翻译：用作电路化衬底内的内部电阻器的一部分的材料包括聚合物树脂和一定量的纳米粉末，其包括至少一种金属组分和至少一种陶瓷组分的混合物。陶瓷部件可以是铁电陶瓷和/或高表面积陶瓷和/或透明氧化物和/或掺杂亚锰酸盐。或者，材料将包括聚合物树脂和纳米粉末，其中纳米粉末包含至少一种金属涂覆的陶瓷和/或至少一种氧化物涂覆的金属组分。还提供了适于在其中使用这种材料和电阻器的电路化基板和制造这种基板的方法。还提供电气组件（基板和至少一个电气部件）和信息处理系统（例如，个人计算机）。

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