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11. 发明申请

US20110262697A1 FLEXIBLE SUBSTRATE AND ELECTRONIC DEVICE 审中-公开
标题翻译：柔性基板和电子设备
公开(公告)号：US20110262697A1
公开(公告)日：2011-10-27
申请号：US13142056
申请日：2009-12-22
申请人： Satoru Katsurayama , Kenzou Maejima , Tomoe Fujii
发明人： Satoru Katsurayama , Kenzou Maejima , Tomoe Fujii
IPC分类号： B32B3/10 , B32B38/04 , B32B27/34 , B32B3/00 , B32B27/00
CPC分类号： H05K3/305 , B32B5/142 , B32B27/08 , B32B27/281 , B32B27/286 , B32B27/288 , B32B27/302 , B32B27/304 , B32B27/308 , B32B27/34 , B32B27/36 , B32B27/365 , B32B2307/306 , B32B2307/546 , B32B2307/548 , B32B2307/714 , B32B2307/7246 , B32B2307/732 , B32B2457/00 , H01L21/486 , H01L23/49827 , H01L23/4985 , H01L23/49894 , H01L2924/0002 , H05K1/036 , H05K1/189 , H05K3/0052 , H05K3/3436 , H05K3/3457 , H05K3/3489 , H05K2201/0154 , H05K2201/09481 , H05K2201/09563 , H05K2201/10674 , H05K2203/0195 , H05K2203/1189 , Y02P70/613 , Y10T156/1052 , Y10T428/24273 , Y10T428/24479 , Y10T428/31504 , Y10T428/31721 , Y10T428/31725 , H01L2924/00
摘要： A flexible substrate 10 of the present invention is the flexible substrate comprising a first resin film 1 having flux activity and a second resin film 2 different from the first resin film 1 laminated to said first resin film. The flexible substrate 10 is characterized in that the flexible substrate 10 is used by having a plurality of electronic components mounted on the surface of the first resin film 1, and thereafter having the respective electronic components and the flexible substrate 10 bonded at one time. The gel time of the first resin film 1 at 230° C. is 100 seconds or more and 600 seconds or less.
摘要翻译：本发明的柔性基板10是包含具有助焊剂活性的第一树脂膜1和与第一树脂膜1不同的第二树脂膜2的柔性基板。柔性基板10的特征在于，通过具有安装在第一树脂膜1的表面上的多个电子部件，然后一次接合各个电子部件和柔性基板10，来使用柔性基板10。第一树脂膜1在230℃下的凝胶时间为100秒以上且600秒以下。

12. 发明授权

US07901768B2 Multilayer anisotropic conductive adhesive and connection structure using the same 有权
标题翻译：多层各向异性导电胶和连接结构使用相同
公开(公告)号：US07901768B2
公开(公告)日：2011-03-08
申请号：US10571495
申请日：2004-09-09
申请人： Hiroyuki Kumakura
发明人： Hiroyuki Kumakura
IPC分类号： B32B7/12 , B32B27/38 , B32B27/42
CPC分类号： H05K3/323 , C09J7/10 , C09J9/02 , C09J2201/36 , C09J2203/326 , H01R4/04 , H05K2203/1189 , Y10T428/14 , Y10T428/1471 , Y10T428/1476 , Y10T428/28 , Y10T428/2826 , Y10T428/2848 , Y10T428/287
摘要： A multilayer anisotropic conductive adhesive a plurality of adhesive layers that are laminated, each of which contains an insulating resin and a hardening agent. The conductive particles are contained either in a first plurality of adhesive layers or in a second plurality of adhesive layers, and at least the top or bottom adhesive layer has the DSC (differential scanning calorimetry) exothermic peak temperature of 130° C. or more and 180° C. or less. Also, a connection structure is constructed in which a first electronic component having an electrode and an insulating film on the surface thereof and a second electronic component that has an electrode on the surface thereof are electrically connected through the multilayer anisotropic conductive adhesive.
摘要翻译：多层各向异性导电粘合剂，多层粘合剂层，每层粘合层含有绝缘树脂和硬化剂。导电颗粒包含在第一多个粘合剂层或第二多个粘合剂层中，并且至少顶部或底部粘合剂层具有130℃或更高的DSC（差示扫描量热法）放热峰温度，以及 180℃以下。此外，构造了其表面上具有电极和绝缘膜的第一电子部件和其表面上具有电极的第二电子部件通过多层各向异性导电粘合剂电连接的连接结构。

13. 发明授权

US07879445B2 Adhesive for bonding circuit members, circuit board and process for its production 有权
标题翻译：用于接合电路元件，电路板及其生产工艺的粘合剂
公开(公告)号：US07879445B2
公开(公告)日：2011-02-01
申请号：US11702552
申请日：2007-02-06
申请人： Itsuo Watanabe , Kenzo Takemura , Akira Nagai , Kazuhiro Isaka , Osamu Watanabe , Kazuyoshi Kojima
发明人： Itsuo Watanabe , Kenzo Takemura , Akira Nagai , Kazuhiro Isaka , Osamu Watanabe , Kazuyoshi Kojima
IPC分类号： B32B27/38
CPC分类号： H01L24/83 , C09J9/02 , H01L23/49883 , H01L24/29 , H01L24/90 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/45144 , H01L2224/73204 , H01L2224/83101 , H01L2224/8319 , H01L2224/838 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/12044 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H05K1/0271 , H05K3/323 , H05K2201/0133 , H05K2201/0209 , H05K2201/0379 , H05K2203/1189 , Y10T29/49117 , Y10T156/10 , Y10T156/109 , Y10T428/24942 , Y10T428/24959 , Y10T428/2852 , Y10T428/31511 , Y10T428/31515 , Y10T428/31855 , H01L2924/00
摘要： An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.
摘要翻译：一种用于将半导体芯片接合并固定到电路板并电连接两个电极的粘合剂，并且包含粘合剂树脂组合物和无机填料，其含量为10至200重量份，100重量份的100重量份粘合剂树脂组合物。

14. 发明申请

US20110000700A1 METHOD OF CONNECTING CIRCUIT BOARDS AND CONNECTED STRUCTURE 审中-公开
标题翻译：连接电路板和连接结构的方法
公开(公告)号：US20110000700A1
公开(公告)日：2011-01-06
申请号：US12446518
申请日：2007-10-11
申请人： Yoshiaki Sato , Kohichiro Kawate , Tomihiro Hara , Noriko Kikuchi
发明人： Yoshiaki Sato , Kohichiro Kawate , Tomihiro Hara , Noriko Kikuchi
IPC分类号： H05K1/00 , H05K3/36
CPC分类号： H01R4/04 , H01R12/52 , H01R12/61 , H05K3/305 , H05K3/361 , H05K2201/09245 , H05K2201/09381 , H05K2201/09427 , H05K2201/09709 , H05K2201/10977 , H05K2203/1189 , Y10T29/49126
摘要： A method of connecting circuit boards capable of easily accomplishing the connection maintaining reliability. A method of connection comprising the steps of obtaining a laminated body of a first circuit board, an adhesive sheet and a second circuit board, and accomplishing electric conduction between the first circuit and the second circuit by applying heat and pressure to the laminated body of the first circuit board, the adhesive sheet and the second circuit board, wherein an end of the circuit formed on at least either the first circuit board or the second circuit board is terminated at a position separated away from an end of the substrate, and the adhesive of the adhesive sheet is partly arranged between the end of the substrate of the circuit board and the end of the circuit so as to be adhered to the opposing circuit board.
摘要翻译：一种连接电路板的方法，能够容易地实现连接维护的可靠性。一种连接方法，包括以下步骤：获得第一电路板，粘合片和第二电路板的层压体，并且通过向第一电路和第二电路的叠层体施加热和压力来实现第一电路和第二电路之间的导电第一电路板，粘合片和第二电路板，其中形成在至少第一电路板或第二电路板的电路的端部终止于远离衬底的端部分离的位置，并且粘合剂粘合片部分地布置在电路板的基板的端部和电路的端部之间，以便粘附到相对的电路板。

15. 发明授权

US07851921B2 Device mounting board having multiple circuit substrates, and semiconductor module with the device mounting board 失效
标题翻译：具有多个电路基板的装置安装板以及具有装置安装板的半导体模块
公开(公告)号：US07851921B2
公开(公告)日：2010-12-14
申请号：US11830505
申请日：2007-07-30
申请人： Mayumi Nakasato , Hideki Mizuhara , Takaya Kusabe , Sadamichi Takakusaki
发明人： Mayumi Nakasato , Hideki Mizuhara , Takaya Kusabe , Sadamichi Takakusaki
IPC分类号： H01L23/48
CPC分类号： H05K3/305 , H01L21/4846 , H01L21/4857 , H01L23/49833 , H01L2224/16225 , H01L2224/16227 , H05K1/0262 , H05K1/056 , H05K1/141 , H05K1/183 , H05K3/107 , H05K3/4614 , H05K3/4694 , H05K3/4697 , H05K2201/0195 , H05K2201/0355 , H05K2201/0379 , H05K2201/09472 , H05K2201/09972 , H05K2201/10378 , H05K2201/10545 , H05K2201/10734 , H05K2201/10977 , H05K2203/0278 , H05K2203/1189 , Y02P70/613 , Y10T29/49155
摘要： To reduce connection defects between a circuit substrate provided on a core substrate and a circuit to be mounted thereon, thereby improving reliability as a multilayered device mounting substrate. The device mounting substrate includes: a first circuit substrate composed of a substrate, an insulating layer formed on this substrate, and a first conductive layer (including conductive parts) formed on this insulating layer; and a second circuit substrate mounted on the first circuit substrate, being composed of a base, a second conductive layer (including conductive parts) formed on the bottom of the base, and a third conductive layer (including conductive parts) formed on the top of the base. Here, the first and second circuit substrates are bonded by pressure so that the first and second conductive parts are laminated and embedded together into the insulating layer. The first and second conductive parts form connecting areas in the insulating layer, thereby connecting the first and second circuit substrates electrically.
摘要翻译：为了减少设置在芯基板上的电路基板与要安装在其上的电路之间的连接缺陷，从而提高作为多层器件安装基板的可靠性。装置安装基板包括：由基板，形成在该基板上的绝缘层和形成在该绝缘层上的第一导电层（包括导电部分）构成的第一电路基板; 以及安装在第一电路基板上的第二电路基板，由基底，形成在基底的底部的第二导电层（包括导电部）和形成在基底的顶部的第三导电层的基地。这里，第一和第二电路基板通过压力接合，使得第一和第二导电部件层叠并嵌入到绝缘层中。第一和第二导电部分形成绝缘层中的连接区域，从而电连接第一和第二电路基板。

16. 发明申请

US20100299920A1 METHODS FOR MANUFACTURING DEVICE MOUNTING BOARD AND CIRCUIT SUBSTRATE 失效
标题翻译：制造器件安装板和电路基板的方法
公开(公告)号：US20100299920A1
公开(公告)日：2010-12-02
申请号：US12856168
申请日：2010-08-13
申请人： Mayumi Nakasato , Hideki Mizuhara , Takaya Kusabe , Sadamichi Takakusaki
发明人： Mayumi Nakasato , Hideki Mizuhara , Takaya Kusabe , Sadamichi Takakusaki
IPC分类号： H05K3/10
CPC分类号： H05K3/305 , H01L21/4846 , H01L21/4857 , H01L23/49833 , H01L2224/16225 , H01L2224/16227 , H05K1/0262 , H05K1/056 , H05K1/141 , H05K1/183 , H05K3/107 , H05K3/4614 , H05K3/4694 , H05K3/4697 , H05K2201/0195 , H05K2201/0355 , H05K2201/0379 , H05K2201/09472 , H05K2201/09972 , H05K2201/10378 , H05K2201/10545 , H05K2201/10734 , H05K2201/10977 , H05K2203/0278 , H05K2203/1189 , Y02P70/613 , Y10T29/49155
摘要： To reduce connection defects between a circuit substrate provided on a core substrate and a circuit to be mounted thereon, thereby improving reliability as a multilayered device mounting substrate. The device mounting substrate includes: a first circuit substrate composed of a substrate, an insulating layer formed on this substrate, and a first conductive layer (including conductive parts) formed on this insulating layer; and a second circuit substrate mounted on the first circuit substrate, being composed of a base, a second conductive layer (including conductive parts) formed on the bottom of the base, and a third conductive layer (including conductive parts) formed on the top of the base. Here, the first and second circuit substrates are bonded by pressure so that the first and second conductive parts are laminated and embedded together into the insulating layer. The first and second conductive parts form connecting areas in the insulating layer, thereby connecting the first and second circuit substrates electrically.
摘要翻译：为了减少设置在芯基板上的电路基板与要安装在其上的电路之间的连接缺陷，从而提高作为多层器件安装基板的可靠性。装置安装基板包括：由基板，形成在该基板上的绝缘层和形成在该绝缘层上的第一导电层（包括导电部分）构成的第一电路基板; 以及安装在第一电路基板上的第二电路基板，由基底，形成在基底的底部上的第二导电层（包括导电部）和形成在基底的顶部的第三导电层的基地。这里，第一和第二电路基板通过压力接合，使得第一和第二导电部件层叠并嵌入到绝缘层中。第一和第二导电部分形成绝缘层中的连接区域，从而电连接第一和第二电路基板。

17. 发明申请

US20100262214A1 STITCHED COMPONENTS OF AN ACTIVE IMPLANTABLE MEDICAL DEVICE 有权
标题翻译：活动可植入医疗装置的缝合组件
公开(公告)号：US20100262214A1
公开(公告)日：2010-10-14
申请号：US12549831
申请日：2009-08-28
申请人： David Robinson
发明人： David Robinson
IPC分类号： A61N1/05 , D05B97/00 , H05K3/30
CPC分类号： A61N1/375 , A61B2562/125 , A61N1/0551 , A61N1/3605 , A61N1/37229 , H05K3/103 , H05K2201/0129 , H05K2201/0281 , H05K2201/0308 , H05K2201/10287 , H05K2201/10598 , H05K2203/1189 , Y10T29/4913
摘要： An active implantable medical device (AIMD) comprising an implantable electronics module and a tissue interface. At least one of the electronics module and the tissue interface comprises an electrically non-conductive, biocompatible and needle-piercable base having one or more biocompatible electrically conductive strands of conductive filaments stitched to the base. As used herein, stitching a conductive filament to a base refers to sewing, embroidering or otherwise securing the filament to the base through the use of hand or machine needlework.
摘要翻译：一种包括可植入电子模块和组织界面的主动植入式医疗装置（AIMD）。电子模块和组织界面中的至少一个包括具有一个或多个与基底缝合的导电丝的一个或多个生物相容的导电股线的非导电，生物相容性和针刺的基底。如本文所使用的，将导电丝缝合到基部是指通过使用手或机针刺将缝线，刺绣或以其他方式将灯丝固定到基座。

18. 发明授权

US07710045B2 Illumination assembly with enhanced thermal conductivity 失效
标题翻译：具有增强导热性的照明组件
公开(公告)号：US07710045B2
公开(公告)日：2010-05-04
申请号：US11276901
申请日：2006-03-17
申请人： John C. Schultz , Nelson B. O'Bryan
发明人： John C. Schultz , Nelson B. O'Bryan
IPC分类号： H05B41/16
CPC分类号： H05K1/0204 , F21K9/00 , G02F2001/133628 , H01L2224/48091 , H01L2224/48471 , H01L2224/73265 , H01L2924/00014 , H01L2924/07811 , H01L2924/12044 , H01L2924/3011 , H05K1/0209 , H05K1/0373 , H05K1/189 , H05K3/0061 , H05K2201/0209 , H05K2201/09318 , H05K2201/09363 , H05K2201/10106 , H05K2203/1189 , H01L2924/00 , H01L2224/4554
摘要： Illumination assemblies include a substrate having a first and second electrically conductive layer separated by an electrically insulating layer. The insulating layer includes a polymer material loaded with thermally conductive particles. At least a portion of the thermally conductive particles simultaneously contact both the first and second electrically conductive layers. A plurality of light sources such as LEDs or other miniature light sources are preferably disposed on the first conductive layer.
摘要翻译：照明组件包括具有由电绝缘层分隔开的第一和第二导电层的衬底。绝缘层包括装载有导热颗粒的聚合物材料。至少一部分导热颗粒同时接触第一和第二导电层。诸如LED或其它微型光源的多个光源优选设置在第一导电层上。

19. 发明授权

US07675601B2 Anisotropic conductive flame and flat panel display using the same, and method for manufacturing the same 有权
标题翻译：各向异性导电火焰和使用其的平板显示器及其制造方法
公开(公告)号：US07675601B2
公开(公告)日：2010-03-09
申请号：US11407669
申请日：2006-04-20
申请人： Ho Min Kang , Hee Young Park , Jong Sig Hyun , Yun Hee Kim
发明人： Ho Min Kang , Hee Young Park , Jong Sig Hyun , Yun Hee Kim
IPC分类号： G02F1/1345 , H01L23/48
CPC分类号： H05K3/323 , C09J7/20 , C09J9/02 , C09J2201/134 , C09J2201/36 , C09J2201/40 , C09J2205/102 , G02F1/13452 , H01L24/83 , H01L2224/2929 , H01L2224/293 , H01L2224/83192 , H01L2224/83851 , H01L2924/12044 , H05K3/361 , H05K2201/0379 , H05K2201/10674 , H05K2203/0143 , H05K2203/0156 , H05K2203/1189 , H01L2924/00014 , H01L2924/00
摘要： The present invention relates to an anisotropic conductive film with two or more adhesive resins simultaneously formed thereon, such that the two or more adhesive resins are simultaneously formed on a substrate of a flat panel display so as to connect various kinds of devices and flexible circuit boards thereto, thereby reducing the size of a non-display region of the substrate and reducing the number of steps of a manufacturing process. Moreover, with the use of an anisotropic conductive film with two layers of adhesive resins with different conductive particles, an excellent bonding force thereof enables a device or flexible circuit board to be stably mounted on a narrow area.
摘要翻译：本发明涉及同时形成有两种或更多种粘合剂树脂的各向异性导电膜，使得两个或更多个粘合剂树脂同时形成在平板显示器的基板上，以便连接各种装置和柔性电路板从而减小了基板的非显示区域的尺寸并减少了制造工艺的步骤数量。此外，通过使用具有两层具有不同导电粒子的粘合剂树脂的各向异性导电膜，其优异的结合力能够将器件或柔性电路板稳定地安装在狭窄的区域上。

20. 发明授权

US07665883B2 Power board and plug-in lighting module 有权
标题翻译：电源板和插入式照明模块
公开(公告)号：US07665883B2
公开(公告)日：2010-02-23
申请号：US11485992
申请日：2006-07-14
申请人： George E. Matheson
发明人： George E. Matheson
IPC分类号： H01R33/00
CPC分类号： F21V23/06 , F21V19/001 , F21V21/002 , F21V21/0824 , F21Y2115/10 , G09F13/00 , H01R4/2404 , H01R24/58 , H01R2103/00 , H05K1/0298 , H05K3/308 , H05K3/326 , H05K2201/10106 , H05K2201/1059 , H05K2203/1189
摘要： The present invention provides a modular panel lighting apparatus comprising a multi layer power board and one or more lighting modules. The power board is a compound structure of one or more electrically conductive layers which are separated by one or more electrically insulating layers. The power board is configured to receive one or more lighting modules and can provide electrical, mechanical and thermal function adequate to meet a desired functionality of the lighting apparatus. A lighting module comprises one or more light-emitting elements operatively attached to a connector element that has one or more electrical contact portions. By inserting the connector element into the power board, the lighting module can be mounted anywhere on the face of the power board. When appropriately inserted into the power board, the one or more electrical contact portions of the connector element can establish selective electrical contact with the conductive layers of the power board and can secure the lighting module in place.
摘要翻译：本发明提供一种包括多层电源板和一个或多个照明模块的模块化面板照明装置。电源板是由一个或多个电绝缘层分开的一个或多个导电层的复合结构。电源板被配置为接收一个或多个照明模块并且可以提供足够的电气，机械和热功能以满足照明设备的期望功能。照明模块包括可操作地附接到具有一个或多个电接触部分的连接器元件的一个或多个发光元件。通过将连接器元件插入电源板，照明模块可以安装在电源板表面的任何位置。当适当地插入电源板时，连接器元件的一个或多个电接触部分可以建立与电源板的导电层的选择性电接触，并且可以将照明模块固定就位。

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