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11. 发明申请

US20160172730A1 WAVEGUIDE DEVICE, COMMUNICATION MODULE, METHOD OF PRODUCING WAVEGUIDE DEVICE, AND ELECTRONIC DEVICE 有权
标题翻译：波导装置，通信模块，制造波导装置的方法和电子装置
公开(公告)号：US20160172730A1
公开(公告)日：2016-06-16
申请号：US14974513
申请日：2015-12-18
申请人： Sony Corporation
发明人： Sho Ohashi , Kenji Komori , Takahiro Takeda
IPC分类号： H01P1/04 , H01P5/02 , H01P5/12
CPC分类号： H01P1/047 , H01P5/00 , H01P5/02 , H01P5/107 , H01P11/001 , Y10T29/49016
摘要： An electronic device includes a central control unit and a waveguide device. The waveguide device includes a high-frequency signal waveguide for transmitting a high-frequency signal emitted from a communication module having a communication function, and an attachment/detachment unit capable of attaching/detaching the communication module so that coupling between the high-frequency signal waveguide and the high-frequency signal is possible. The communication module includes a communication device and a transfer structure configured to cause the high-frequency signal emitted from the communication device to be transferred to the high-frequency signal waveguide of the waveguide device.
摘要翻译：电子设备包括中央控制单元和波导设备。波导装置包括用于发送从具有通信功能的通信模块发出的高频信号的高频信号波导和能够附接/分离通信模块的附接/拆卸单元，使得高频信号波导和高频信号是可能的。通信模块包括通信装置和传输结构，其被配置为使得从通信装置发射的高频信号被传送到波导装置的高频信号波导。

12. 发明授权

US09300025B2 Interface between an integrated circuit and a dielectric waveguide using a carrier substrate with a dipole antenna and a reflector 有权
标题翻译：使用具有偶极天线和反射器的载体衬底的集成电路和介质波导之间的接口
公开(公告)号：US09300025B2
公开(公告)日：2016-03-29
申请号：US13854958
申请日：2013-04-02
申请人： Texas Instruments Incorporated
发明人： Juan Alejandro Herbsommer , Gerd Schuppener , Robert Floyd Payne
IPC分类号： H01P5/107 , H01P3/16 , H01P5/08 , G02B6/44 , H01P11/00 , H01P5/00 , H01Q1/50 , H01Q19/10 , H04B1/40 , H01Q19/30 , H01P3/12
CPC分类号： H01P3/16 , G02B6/4416 , H01L2223/6677 , H01L2224/16227 , H01L2224/73204 , H01L2924/15192 , H01L2924/15311 , H01P3/121 , H01P3/165 , H01P5/00 , H01P5/087 , H01P5/107 , H01P5/184 , H01P11/001 , H01P11/002 , H01Q1/50 , H01Q19/108 , H01Q19/30 , H04B1/40 , Y10T29/49016 , Y10T29/49826
摘要： A system includes an integrated circuit that has a substrate with a top surface and a bottom surface. Semiconductor circuitry is including a radio frequency (RF) amplifier configured to produce an RF signal or an RF receiver configured to receive an RF signal is formed on the top surface of the substrate. A through-substrate via is coupled to an output of the RF amplifier. A metalized antenna formed on the bottom surface of the substrate is coupled to the through-substrate via. The metalized antenna is configured to launch an electromagnet wave representative of the RF signal into a dielectric waveguide (DWG) when the DWG is coupled to the bottom side of the substrate.
摘要翻译：一种系统包括具有顶表面和底表面的基底的集成电路。半导体电路包括被配置为产生RF信号的射频（RF）放大器或被配置为接收RF信号的RF接收器，该RF接收器被形成在衬底的顶表面上。穿通基板通孔耦合到RF放大器的输出端。形成在基板的底表面上的金属化天线与穿通基板通孔相连。当DWG耦合到衬底的底侧时，金属化天线被配置为将代表RF信号的电磁波发射到电介质波导（DWG）中。

13. 发明授权

US09300024B2 Interface between an integrated circuit and a dielectric waveguide using a dipole antenna, a reflector and a plurality of director elements 有权
标题翻译：使用偶极子天线，反射器和多个导向器元件的集成电路和电介质波导之间的接口
公开(公告)号：US09300024B2
公开(公告)日：2016-03-29
申请号：US13854957
申请日：2013-04-02
申请人： Texas Instruments Incorporated
发明人： Gerd Schuppener , Juan Alejandro Herbsommer , Robert Floyd Payne
IPC分类号： H01P5/107 , H01P3/16 , H01P5/08 , G02B6/44 , H01P11/00 , H01P5/00 , H01Q1/50 , H01Q19/10 , H04B1/40 , H01Q19/30 , H01P3/12
CPC分类号： H01P3/16 , G02B6/4416 , H01L2223/6677 , H01L2224/16227 , H01L2224/73204 , H01L2924/15192 , H01L2924/15311 , H01P3/121 , H01P3/165 , H01P5/00 , H01P5/087 , H01P5/107 , H01P5/184 , H01P11/001 , H01P11/002 , H01Q1/50 , H01Q19/108 , H01Q19/30 , H04B1/40 , Y10T29/49016 , Y10T29/49826
摘要： A system includes an electronic device coupled to a mating end of a dielectric wave guide (DWG). The electronic device has a multilayer substrate that has an interface surface configured for interfacing to the mating end of the DWG. A conductive layer is etched to form a dipole antenna disposed adjacent the interface surface. A reflector structure is formed in the substrate adjacent the dipole antenna opposite from the interface surface. A set of director elements is embedded in the mating end of the DWG. Specific spacing is maintained between the dipole antenna and the set of director elements.
摘要翻译：一种系统包括耦合到电介质波导（DWG）的配合端的电子装置。电子设备具有多层基板，该多层基板具有被配置为与DWG的配合端对接的界面。蚀刻导电层以形成邻近界面表面设置的偶极天线。反射器结构形成在与界面表面相对的偶极子天线附近的衬底中。一组指导元素嵌入在DWG的配对端。在偶极天线和导向器元件组之间保持特定的间隔。

14. 发明申请

US20160079768A1 CHEMICALLY ENHANCED ISOLATED CAPACITANCE 有权
标题翻译：化学增强隔离电容
公开(公告)号：US20160079768A1
公开(公告)日：2016-03-17
申请号：US14847390
申请日：2015-09-08
申请人： CPG Technologies, LLC
发明人： James F. Corum , Kenneth L. Corum , James D. Lilly
IPC分类号： H02J5/00 , H01P5/00
CPC分类号： H02J5/005 , H01P5/00 , H02J17/00 , H02J50/10 , H02J50/40 , H02J50/80 , H04B3/00 , H04B3/52 , H04B5/0012 , H04B5/0075
摘要： Disclosed are various embodiments for transmitting energy conveyed in the form of a guided surface waveguide mode along the surface of a lossy conducting medium such as, e.g., a terrestrial medium by exciting a guided surface waveguide probe. In one embodiment, compensation is provided to elevate isolated capacitance of a terminal of the waveguide probe in the form of mounted charge devices.
摘要翻译：公开了各种实施例，用于通过激励被引导的表面波导探针来沿着诸如地面介质的有损传导介质的表面传输以导向波导模式的形式传送的能量。在一个实施例中，提供补偿以提升安装的充电装置形式的波导探针的端子的隔离电容。

15. 发明授权

US09112253B2 Dielectric waveguide combined with electrical cable 有权
标题翻译：介质波导结合电缆
公开(公告)号：US09112253B2
公开(公告)日：2015-08-18
申请号：US13854956
申请日：2013-04-01
申请人： Texas Instruments Incorporated
发明人： Robert Floyd Payne , Juan Alejandro Herbsommer , Gerd Schuppener
IPC分类号： H01P11/00 , H01P3/16 , H01P5/08 , G02B6/44 , H01P5/00 , H01Q1/50 , H01Q19/10 , H04B1/40 , H01Q19/30 , H01P3/12 , H01P5/107
CPC分类号： H01P3/16 , G02B6/4416 , H01L2223/6677 , H01L2224/16227 , H01L2224/73204 , H01L2924/15192 , H01L2924/15311 , H01P3/121 , H01P3/165 , H01P5/00 , H01P5/087 , H01P5/107 , H01P5/184 , H01P11/001 , H01P11/002 , H01Q1/50 , H01Q19/108 , H01Q19/30 , H04B1/40 , Y10T29/49016 , Y10T29/49826
摘要： A communication cable includes one or more conductive elements surrounded by a dielectric sheath. The sheath member has a first dielectric constant value. A dielectric core member is placed longitudinally adjacent to and in contact with an outer surface of the sheath member. The core member has a second dielectric constant value that is higher than the first dielectric constant value. A cladding surrounds the sheath member and the dielectric core member. The cladding has a third dielectric constant value that is lower than the second dielectric constant value. A dielectric wave guide is formed by the dielectric core member surrounded by the sheath and the cladding.
摘要翻译：通信电缆包括由电介质护套包围的一个或多个导电元件。护套构件具有第一介电常数值。电介质芯构件被纵向地邻近鞘构件的外表面并与其接触。芯构件具有比第一介电常数值高的第二介电常数值。包层围绕护套构件和电介质芯构件。包层具有低于第二介电常数值的第三介电常数值。电介质波导由被护套和包层包围的介质芯构件形成。

16. 发明申请

US20150207199A1 COMBINER 有权
标题翻译：组合者
公开(公告)号：US20150207199A1
公开(公告)日：2015-07-23
申请号：US14425610
申请日：2013-08-06
申请人： KABUSHIKI KAISHA TOSHIBA
发明人： Shunya Otsuki , Hiromu Itagaki
IPC分类号： H01P5/00 , H05K1/18
CPC分类号： H01P5/00 , H01P5/187 , H05K1/18
摘要： The combiner includes a printed board, first and second conductor plates, and first and second conductor parts. The printed board includes a hole passing from a first surface to a second surface opposite to the first surface. The first conductor plate is made of a copper plate and mounted on the first surface of the printed board to close the hole. The second conductor plate is made of a copper plate and mounted on the second surface of the printed board to close the hole. The first conductor part is opposed to the first conductor plate with a predetermined space between the first conductor part and the first conductor plate. The second conductor part is opposed to the second conductor plate with a predetermined space between the second conductor part and the second conductor plate.
摘要翻译：组合器包括印刷电路板，第一和第二导体板以及第一和第二导体部件。印刷板包括从第一表面延伸到与第一表面相对的第二表面的孔。第一导体板由铜板制成并安装在印刷板的第一表面上以封闭该孔。第二导体板由铜板制成并安装在印刷电路板的第二表面上以封闭该孔。第一导体部分与第一导体板相对，在第一导体部分和第一导体板之间具有预定的间隔。第二导体部分与第二导体板相对，在第二导体部分和第二导体板之间具有预定的空间。

17. 发明申请

US20150008994A1 INTERFACE APPARATUS 审中-公开
标题翻译：界面装置
公开(公告)号：US20150008994A1
公开(公告)日：2015-01-08
申请号：US14371519
申请日：2012-11-26
申请人： NEC Corporation
发明人： Naoki Kobayashi , Tsuneo Tsukagoshi , Koichiro Nakase , Hiroshi Fukuda
IPC分类号： H01P5/00
CPC分类号： H01P5/00 , H01P3/122
摘要： An object of the present invention is to provide an interface apparatus which can suppress leakage of electromagnetic waves and supply electromagnetic waves efficiently without limiting applications or mounting positions. An interface apparatus (200) is provided that supplies electromagnetic waves to a sheet-shaped electromagnetic wave transmission medium for propagating electromagnetic waves and includes a first conductor surface, a second conductor surface disposed in an opposed state to and substantially parallel with the first conductor surface, electromagnetic wave supplying means (230) configured to supply electromagnetic waves to a gap between the first and second conductor surfaces, a first structure (240), and a second structure (250). The first and second structure (240 and 250) are respectively disposed on the first and second conductor surface and configured to reflect electromagnetic waves supplied by the electromagnetic wave supplying means with an end of the electromagnetic wave transmission medium inserted in the gap.
摘要翻译：本发明的目的是提供一种可以抑制电磁波的泄漏并且有效地提供电磁波而不限制应用或安装位置的接口装置。提供一种接口装置（200），其向用于传播电磁波的片状电磁波传输介质提供电磁波，并且包括第一导体表面，以与第一导体表面相对并基本平行的方式设置的第二导体表面，电磁波供给装置（230），被配置为向所述第一和第二导体表面之间的间隙提供电磁波，第一结构（240）和第二结构（250）。第一和第二结构（240和250）分别设置在第一和第二导体表面上，并且被配置为反射由电磁波提供装置提供的电磁波，其中电磁波传输介质的一端插入间隙。

18. 发明授权

US08923776B1 Short loop connection method 有权
标题翻译：短路连接方式
公开(公告)号：US08923776B1
公开(公告)日：2014-12-30
申请号：US13471530
申请日：2012-05-15
申请人： Eric G. Nelson
发明人： Eric G. Nelson
IPC分类号： H04B1/38
CPC分类号： H01P5/00 , H01P5/085
摘要： A system and method for connecting an external RF connector on an electrical module housing to a PCB within an electronic module is presented. The electronic module is configured to operate within a Department of Defense Joint Tactical Radio System in altitudes up to 15000 feet, at operating temperatures between −40 to +55 degrees Celsius, in driving rain and dust storms, in a corrosive salt-sea atmosphere and to withstand indirect shock. The electronic module comprises a module housing, a housing connector on an external wall of the housing, a PCB within the housing, a PCB connector for a coaxial cable mounted on the PCB and a coaxial cable with first and second ends that is looped 360 degrees between the housing connector and the PCB connector. The first end of the cable is connected to the housing connector and the second end is connected to the PCB connector.
摘要翻译：提出了一种用于将电气模块外壳上的外部RF连接器连接到电子模块内的PCB的系统和方法。电子模块被配置为在海拔高达15000英尺的高度，在-40至+55摄氏度的工作温度下，在具有腐蚀性盐海气候的雨中和沙尘暴中，在国防部联合战术无线电系统内运行，承受间接冲击。电子模块包括模块外壳，壳体外壁上的外壳连接器，外壳内的PCB，用于安装在PCB上的同轴电缆的PCB连接器以及具有环形360度的第一和第二端的同轴电缆在外壳连接器和PCB连接器之间。电缆的第一端连接到外壳连接器，第二端连接到PCB连接器。

19. 发明申请

US20140312995A1 COUPLER AND ELECTRONIC APPARATUS 审中-公开
标题翻译：联轴器和电子设备
公开(公告)号：US20140312995A1
公开(公告)日：2014-10-23
申请号：US14318509
申请日：2014-06-27
申请人： Kabushiki Kaisha Toshiba
发明人： Hiroshi Shimasaki , Takashi Minemura
IPC分类号： H01P5/00
CPC分类号： H01P5/00 , H01Q1/2266 , H01Q5/371 , H01Q9/42 , H04B5/0037
摘要： According to one embodiment, a coupler for wireless transfer includes a coupling element including a first open end and a second open end. The coupler further includes a feeding element electrically connecting a feed point and an intermediate portion of the coupling element between the first open end and the second open end. The coupler further includes a short circuiting element electrically connecting the intermediate portion and a ground plane. An electrical distance from the feed point to each of the first open end and the second open end is ¼ of a wavelength corresponding to a central frequency used for the wireless transfer.
摘要翻译：根据一个实施例，用于无线传送的耦合器包括耦合元件，其包括第一开放端和第二开放端。联接器还包括馈电元件，电连接第一开口端和第二开口端之间的馈电点和耦合元件的中间部分。耦合器还包括电连接中间部分和接地平面的短路元件。从进料点到第一开口端和第二开口端中的每一个的电距离为对应于用于无线传送的中心频率的波长的1/4。

20. 发明申请

US20140287703A1 Integrated Circuit with Antenna for Dielectric Waveguide 有权
标题翻译：集成电路与天线用于介质波导
公开(公告)号：US20140287703A1
公开(公告)日：2014-09-25
申请号：US13854958
申请日：2013-04-02
申请人： Texas Instruments Incorporated
发明人： Juan Alejandro Herbsommer , Gerd Schuppener , Robert Floyd Payne
IPC分类号： H01P5/08 , H04B1/40
CPC分类号： H01P3/16 , G02B6/4416 , H01L2223/6677 , H01L2224/16227 , H01L2224/73204 , H01L2924/15192 , H01L2924/15311 , H01P3/121 , H01P3/165 , H01P5/00 , H01P5/087 , H01P5/107 , H01P5/184 , H01P11/001 , H01P11/002 , H01Q1/50 , H01Q19/108 , H01Q19/30 , H04B1/40 , Y10T29/49016 , Y10T29/49826
摘要： A system includes an integrated circuit that has a substrate with a top surface and a bottom surface. Semiconductor circuitry is including a radio frequency (RF) amplifier configured to produce an RF signal or an RF receiver configured to receive an RF signal is formed on the top surface of the substrate. A through-substrate via is coupled to an output of the RF amplifier. A metalized antenna formed on the bottom surface of the substrate is coupled to the through-substrate via. The metalized antenna is configured to launch an electromagnet wave representative of the RF signal into a dielectric waveguide (DWG) when the DWG is coupled to the bottom side of the substrate.
摘要翻译：一种系统包括具有顶表面和底表面的基底的集成电路。半导体电路包括被配置为产生RF信号的射频（RF）放大器或被配置为接收RF信号的RF接收器，该RF接收器被形成在衬底的顶表面上。穿通基板通孔耦合到RF放大器的输出端。形成在基板的底表面上的金属化天线与穿通基板通孔相连。当DWG耦合到衬底的底侧时，金属化天线被配置为将代表RF信号的电磁波发射到电介质波导（DWG）中。

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