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11. 发明申请

US20170114979A1 LENS AND LIGHT-EMITTING DEVICE MODULE COMPRISING THE SAME 审中-公开
公开(公告)号：US20170114979A1
公开(公告)日：2017-04-27
申请号：US15128811
申请日：2015-03-24
申请人： LG INNOTEK CO., LTD.
发明人： Min Soo KANG , Kwang Ho KIM
IPC分类号： F21V5/04 , F21V19/00 , F21V7/04 , H01L33/62
CPC分类号： F21V5/04 , F21V7/04 , F21V19/0025 , G09G3/36 , G09G2300/0426 , G09G2310/08 , G09G2330/021 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/14 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2924/00
摘要： An embodiment provides a lens for changing the path of light incident from a light source, the lens comprising: region 1 which faces a light source and has a concave section formed thereon; and region 2 which faces region 1 and has a central region concave in the direction of region 1, wherein the surface of the concave section comprises: region 1-1 facing the center of the light source; region 1-3 formed at the edge; and region 1-2 formed between region 1-1 and region 1-3, the curvatures of region 1-1, region 1-2 and region 1-3 being different from one another.

12. 发明申请

US20170104138A1 Packaging for Ultraviolet Optoelectronic Device 审中-公开
公开(公告)号：US20170104138A1
公开(公告)日：2017-04-13
申请号：US15388468
申请日：2016-12-22
申请人： Sensor Electronic Technology, Inc.
发明人： Maxim S. Shatalov , Saulius Smetona , Alexander Dobrinsky , Michael Shur , Mikhail Gaevski
IPC分类号： H01L33/56 , H01L33/58 , H01L33/50 , H01L33/48
CPC分类号： H01L33/56 , B29C51/12 , B29L2031/3481 , B29L2031/747 , G02B3/005 , G02B6/4249 , H01L24/14 , H01L24/16 , H01L24/81 , H01L24/97 , H01L33/0095 , H01L33/58 , H01L2224/14 , H01L2224/1403 , H01L2224/16225 , H01L2224/81801 , H01L2933/0041 , H01L2933/005 , H01L2933/0058
摘要： A solution for packaging an optoelectronic device using an ultraviolet transparent polymer is provided. The ultraviolet transparent polymer material can be placed adjacent to the optoelectronic device and/or a device package on which the optoelectronic device is mounted. Subsequently, the ultraviolet transparent polymer material can be processed to cause the ultraviolet transparent polymer material to adhere to the optoelectronic device and/or the device package. The ultraviolet transparent polymer can be adhered in a manner that protects the optoelectronic device from the ambient environment.

13. 发明申请

US20170062677A1 LIGHT-EMITTING DEVICE 有权
标题翻译：发光装置
公开(公告)号：US20170062677A1
公开(公告)日：2017-03-02
申请号：US15244548
申请日：2016-08-23
申请人： STANLEY ELECTRIC CO., LTD.
发明人： Tsutomu OKUBO
IPC分类号： H01L33/58 , H01L33/50 , H01L33/52
CPC分类号： H01L33/56 , H01L33/507 , H01L2224/14 , H01L2224/16225 , H01L2224/48091 , H01L2224/73265 , H01L2224/8592 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： A light-emitting device of the invention includes, a first substrate; a light-emitting element mounted on the first substrate and includes a second substrate and a semiconductor structure including a light-emitting layer; and a light-shielding body which is formed only on a surface of the light-emitting element opposite to the first substrate and includes a material including light-shielding particles.
摘要翻译：本发明的发光装置包括：第一基板; 安装在第一基板上并包括第二基板和包括发光层的半导体结构的发光元件; 以及遮光体，其仅形成在与第一基板相反的发光元件的表面上，并且包括包含遮光性粒子的材料。

14. 发明授权

US09543221B2 Method of manufacturing light-emitting apparatus, light-emitting module inspecting apparatus, and method of determining whether light-emitting module meets quality requirement 有权
标题翻译：制造发光装置的方法，发光模块检查装置以及确定发光模块是否符合质量要求的方法
公开(公告)号：US09543221B2
公开(公告)日：2017-01-10
申请号：US14937347
申请日：2015-11-10
申请人： Samsung Electronics Co., Ltd.
发明人： Dae-seo Park , Ka-ram Lee , Choo-ho Kim
IPC分类号： H01L21/20 , H01L21/66 , H01L33/58 , H01L33/54
CPC分类号： H01L22/12 , H01L33/54 , H01L33/58 , H01L2224/14 , H01L2224/16225 , H01L2933/0033 , H01L2933/0058
摘要： A method of manufacturing a light-emitting apparatus includes disposing a substrate on a support; disposing a light-emitting package including a light-emitting device on the substrate so as to allow the light-emitting package to be positioned at a target position on the substrate; applying energy to the light-emitting package to make the light-emitting device emit light; and analyzing the light that is emitted from the light-emitting device due to the energy, and determining a position where the light-emitting package is actually disposed. Thus, the light-emitting apparatus may be easily and inexpensively manufactured, and may generate a limited number of spots and provide improved uniform brightness.
摘要翻译：一种制造发光装置的方法包括：将基板设置在支撑体上; 在基板上设置包括发光器件的发光封装，以使发光封装件位于基板上的目标位置; 向发光封装施加能量，使发光元件发光; 并且分析由于能量而从发光装置发射的光，并且确定实际设置发光封装的位置。因此，发光装置可以容易且廉价地制造，并且可以产生有限数量的斑点并提供改善的均匀亮度。

15. 发明申请

US20160343901A1 Semiconductor Layer Including Compositional Inhomogeneities 有权
标题翻译：包含组成不均匀性的半导体层
公开(公告)号：US20160343901A1
公开(公告)日：2016-11-24
申请号：US15225382
申请日：2016-08-01
申请人： Sensor Electronic Technology, Inc.
发明人： Michael Shur , Rakesh Jain , Maxim S. Shatalov , Alexander Dobrinsky , Jinwei Yang , Remigijus Gaska , Mikhail Gaevski
IPC分类号： H01L33/06 , H01L33/00 , H01L33/62
CPC分类号： H01L33/06 , H01L33/007 , H01L33/18 , H01L33/30 , H01L33/382 , H01L2224/14 , H01S5/0224 , H01S5/3209 , H01S5/3413 , H01S5/34333
摘要： A device comprising a semiconductor layer including a plurality of compositional inhomogeneous regions is provided. The difference between an average band gap for the plurality of compositional inhomogeneous regions and an average band gap for a remaining portion of the semiconductor layer can be at least thermal energy. Additionally, a characteristic size of the plurality of compositional inhomogeneous regions can be smaller than an inverse of a dislocation density for the semiconductor layer.
摘要翻译：提供了包括包括多个组成不均匀区域的半导体层的器件。多个组成不均匀区域的平均带隙与半导体层的剩余部分的平均带隙之间的差可以是至少热能。此外，多个组成不均匀区域的特征尺寸可以小于半导体层的位错密度的倒数。

16. 发明授权

US09450157B2 Ultraviolet light emitting device using metal non-bondable amorphous fluororesin molding compound 有权
标题翻译：紫外线发光装置采用金属非键合无定形氟树脂模塑料
公开(公告)号：US09450157B2
公开(公告)日：2016-09-20
申请号：US14416198
申请日：2014-04-17
申请人： Soko Kagaku Co., Ltd. , Asahi Glass Company, Limited
发明人： Kiho Yamada , Shoko Nagai , Yuta Furusawa , Akira Hirano , Masamichi Ippommatsu , Ko Aosaki , Naoki Morishima
IPC分类号： H01L33/56 , H01L33/32 , H01L33/62
CPC分类号： H01L33/56 , H01L33/32 , H01L33/62 , H01L2224/14 , H01L2224/16225 , H01L2224/8192
摘要： An ultraviolet light emitting device having high quality and high reliability is provided by preventing deterioration of electrical characteristics which is associated with an ultraviolet light emission operation and caused by a sealing resin. The ultraviolet light emitting device is an ultraviolet light emitting device including: an ultraviolet light emitting element (2) formed of a nitride semiconductor; and an ultraviolet-transparent sealing resin (3) covering the ultraviolet light emitting element (2), wherein at least a specific portion (3a) of the sealing resin (3), which is in contact with pad electrodes (18) and (17) of the ultraviolet light emitting element (2), is a first type amorphous fluororesin, and a terminal functional group of a polymer or a copolymer that forms the first type amorphous fluororesin is a nonreactive terminal functional group which is not bondable to a metal that forms the pad electrodes (16) and (17).
摘要翻译：通过防止与紫外线发射操作相关联并由密封树脂引起的电特性的劣化来提供具有高质量和高可靠性的紫外线发射装置。紫外光发射装置是一种紫外线发射装置，包括：由氮化物半导体形成的紫外线发光元件; 以及覆盖所述紫外线发光元件（2）的紫外线透明密封树脂（3），其中，至少与所述密封树脂（3）的特定部分（3a）接触，所述特定部分（3a）与焊盘电极（18）和（17 ）是第一种无定形氟树脂，形成第一类非晶态氟树脂的聚合物或共聚物的末端官能团是不与金属结合的非反应性末端官能团，形成焊盘电极（16）和（17）。

17. 发明授权

US09449937B2 Semiconductor device and method for manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US09449937B2
公开(公告)日：2016-09-20
申请号：US14402221
申请日：2013-08-02
申请人： Panasonic Intellectual Property Management Co., Ltd.
发明人： Koji Kawakita , Susumu Sawada , Seiichi Nakatani , Yoshihisa Yamashita
IPC分类号： H01L23/00 , H01L33/64 , H01L23/367 , H01L33/60
CPC分类号： H01L24/32 , H01L23/3677 , H01L23/562 , H01L24/03 , H01L24/05 , H01L24/27 , H01L24/83 , H01L24/94 , H01L24/96 , H01L33/60 , H01L33/647 , H01L2224/0346 , H01L2224/04042 , H01L2224/04105 , H01L2224/05567 , H01L2224/05639 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05669 , H01L2224/14 , H01L2224/2746 , H01L2224/2784 , H01L2224/32113 , H01L2224/3224 , H01L2224/3226 , H01L2224/45144 , H01L2224/48091 , H01L2224/48639 , H01L2224/48647 , H01L2224/48655 , H01L2224/48664 , H01L2224/48669 , H01L2224/49107 , H01L2224/73267 , H01L2224/94 , H01L2224/96 , H01L2224/97 , H01L2924/00014 , H01L2924/12041 , H01L2924/12042 , H01L2924/13055 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2924/2064 , H01L2924/2075 , H01L2924/351 , H01L2933/0058 , H01L2933/0066 , H01L2933/0075 , H01L2924/00 , H01L2224/82 , H01L2224/03 , H01L2924/00015 , H01L2224/05552 , H01L2924/00012
摘要： There is provided a semiconductor device. The semiconductor device of the present invention includes a semiconductor element and a metal buffer layer in an electrical connection to the semiconductor element. The metal buffer layer and the semiconductor element are in a connection with each other by mutual surface contact of the metal buffer layer and the semiconductor element. The metal buffer layer is an external connection terminal used for a mounting with respect to a secondary mount substrate, and the metal buffer layer serves as a buffer part having a stress-relaxation effect between the semiconductor element and the secondary mount substrate.
摘要翻译：提供了一种半导体器件。本发明的半导体器件包括与半导体元件电连接的半导体元件和金属缓冲层。金属缓冲层和半导体元件通过金属缓冲层和半导体元件的相互表面接触而彼此连接。金属缓冲层是用于相对于辅助安装基板的安装的外部连接端子，并且金属缓冲层用作在半导体元件和辅助安装基板之间具有应力松弛效应的缓冲部分。

18. 发明授权

US09431360B2 Semiconductor structure and manufacturing method thereof 有权
标题翻译：半导体结构及其制造方法
公开(公告)号：US09431360B2
公开(公告)日：2016-08-30
申请号：US14287389
申请日：2014-05-27
申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
发明人： Hsuan-Ting Kuo , Yu-Peng Tsai , Wei-Hung Lin , Chun-Lung Jao , Chao-Wen Shih , Ming-Da Cheng , Chung-Shi Liu
IPC分类号： H01L23/48 , H01L23/00 , H01L21/78 , H01L21/56 , H01L23/544 , H01L23/31
CPC分类号： H01L24/14 , H01L21/561 , H01L21/78 , H01L23/3114 , H01L23/544 , H01L24/11 , H01L24/13 , H01L24/92 , H01L24/94 , H01L2223/54426 , H01L2223/54453 , H01L2224/0391 , H01L2224/11334 , H01L2224/13022 , H01L2224/131 , H01L2224/13111 , H01L2224/13116 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/14 , H01L2224/14131 , H01L2224/16145 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/92 , H01L2224/94 , H01L2924/1815 , H01L2924/182 , H01L2924/186 , H01L2924/206 , H01L2924/20656 , H01L2924/20657 , H01L2924/20658 , H01L2224/11 , H01L2924/014 , H01L2924/00014 , H01L2924/01029 , H01L2924/0665
摘要： A semiconductor structure includes a substrate including a front side, a conductive bump disposed over the front side, and an opaque molding disposed over the front side and around a periphery portion of an outer surface of the conductive bump, wherein the opaque molding includes a recessed portion disposed above a portion of the front side adjacent to a corner of the substrate and extended through the opaque molding to expose the portion of the front side and an alignment feature disposed within the portion of the front side.
摘要翻译：半导体结构包括：基板，其包括前侧，设置在前侧的导电凸块和设置在导电凸块的外表面的前侧和周围部分之外的不透明模制件，其中所述不透明模制件包括凹陷所述部分设置在与所述基板的角部相邻的所述前侧的一部分上方并且延伸穿过所述不透明模制件以暴露所述前侧部分以及设置在所述前侧部分内的对准特征。

19. 发明授权

US09425173B2 Display device using semiconductor light emitting device 有权
标题翻译：使用半导体发光装置的显示装置
公开(公告)号：US09425173B2
公开(公告)日：2016-08-23
申请号：US14463417
申请日：2014-08-19
申请人： LG Electronics Inc.
发明人： Byungjoon Rhee
IPC分类号： H01L27/15 , H01L25/075 , H01L33/00 , H01L33/46
CPC分类号： H01L25/0753 , H01L27/156 , H01L33/0079 , H01L33/46 , H01L2224/14
摘要： A display device according to an embodiment of the present disclosure may include a lower substrate disposed with a line electrode at an upper portion thereof, a plurality of semiconductor light emitting devices electrically connected to the line electrode to generate light and disposed to be separated from one another, and an adhesive portion including a body configured to fix the location of the lower substrate to that of the semiconductor light emitting device, and a conductor dispersed within the body to electrically connect the lower substrate to the semiconductor light emitting device, wherein the plurality of semiconductor light emitting devices form one pixel region (P) having red, green and blue semiconductor light emitting devices that emit red, green and blue light, and contain a material selected from inorganic semiconductor materials, and the adhesive portion blocks light generated from the plurality of semiconductor light emitting devices.
摘要翻译：根据本公开的实施例的显示装置可以包括在其上部设置有线电极的下基板，多个半导体发光器件，电连接到线电极以产生光并且被布置成与一个另一方面，以及包括被配置为将下基板的位置固定到半导体发光器件的位置的主体的粘合部分以及分散在主体内的导体，以将下基板电连接到半导体发光器件，其中多个的半导体发光器件形成具有发射红色，绿色和蓝色光的红色，绿色和蓝色半导体发光器件的一个像素区域（P），并且包含从无机半导体材料中选择的材料，并且粘合剂部分阻挡从多个半导体发光器件。

20. 发明申请

US20160240519A1 LIGHT-EMITTING DEVICE 有权
标题翻译：发光装置
公开(公告)号：US20160240519A1
公开(公告)日：2016-08-18
申请号：US15136531
申请日：2016-04-22
申请人： EPISTAR CORPORATION
发明人： Chien-Liang LIU , Ming-Chi HSU
IPC分类号： H01L25/075 , H01L33/50
CPC分类号： H01L25/0753 , H01L33/50 , H01L2224/14 , H01L2933/0033 , H01L2933/0041
摘要： A light-emitting device, having an overall color temperature when emitting light, includes a carrier, a first LED unit, and a second LED unit. The carrier has a circuit. The first LED unit is arranged on the carrier and has a first color temperature. The second LED unit is spaced apart from the first LED unit by a space, and electrically connected to first LED unit and the circuit. The first LED unit and the second LED unit, and each includes a light-emitting body and a wavelength conversion layer covering the light-emitting body. The first color temperature is different from the overall color temperature.
摘要翻译：在发光时具有整体色温的发光装置包括载体，第一LED单元和第二LED单元。载体有电路。第一LED单元布置在载体上并具有第一色温。第二LED单元与第一LED单元隔开一个空间，并且电连接到第一LED单元和电路。第一LED单元和第二LED单元，并且每个包括发光体和覆盖发光体的波长转换层。第一个色温与整体色温不同。

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