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    • 13. 发明申请
    • Method of manufacturing group III nitride substrate and semiconductor device
    • 制造III族氮化物衬底和半导体器件的方法
    • US20070187700A1
    • 2007-08-16
    • US11731225
    • 2007-03-30
    • Yasuo KitaokaHisashi MinemotoIsao KidoguchiAkihiko Ishibashi
    • Yasuo KitaokaHisashi MinemotoIsao KidoguchiAkihiko Ishibashi
    • H01L33/00
    • C30B25/02C30B19/00C30B29/403C30B29/406Y10S117/902
    • The present invention provides a method of manufacturing a Group III nitride substrate that has less variations in in-plane carrier concentration and includes crystals grown at a high growth rate. The manufacturing method of the present invention includes: (i) forming a semiconductor layer (a seed layer 12) on a substrate, with the semiconductor layer being formed of a semiconductor expressed by a composition formula of AluGavIn1−u−vN (wherein 0≦u≦1 and 0≦v≦1) and having a (0001) plane present at its surface; (ii) processing the surface of the semiconductor layer so that the surface becomes a plane sloped with respect to the (0001) plane of the semiconductor layer; and (iii) bringing the surface of the semiconductor layer into contact with a melt containing a solvent and at least one Group III element selected from gallium, aluminum, and indium, in an atmosphere containing nitrogen, to make the at least one Group III element and the nitrogen react with each other to grow Group III nitride crystals (GaN single crystals 13) on the semiconductor layer.
    • 本发明提供一种制造面内载流子浓度变化小的III族氮化物衬底的方法,包括以高生长速率生长的晶体。 本发明的制造方法包括:(i)在基板上形成半导体层(种子层12),半导体层由以下组成式表示的半导体形成:半导体层 (其中0 <= u <= 1且0 <= v <= 1),并且在其表面上存在(0001)面 ; (ii)处理半导体层的表面,使得该表面成为相对于半导体层的(0001)面倾斜的平面; 和(iii)在含氮气氛中使半导体层的表面与含有溶剂和至少一种选自镓,铝和铟的III族元素的熔体接触,以制备至少一种III族元素 并且氮彼此反应以在半导体层上生长III族氮化物晶体(GaN单晶13)。
    • 20. 发明授权
    • Method of forming silicon-contained crystal thin film
    • 形成含硅晶体薄膜的方法
    • US06468884B2
    • 2002-10-22
    • US09765728
    • 2001-01-19
    • Koji MiyakeKiyoshi Ogata
    • Koji MiyakeKiyoshi Ogata
    • H01L2136
    • H01L21/76254C30B19/00C30B19/12C30B29/06C30B29/60C30B31/22H01L21/26506
    • A method of forming a silicon-contained crystal thin film can efficiently form the crystal thin film of a relatively large thickness. In the method, hydrogen ions are implanted into a silicon-contained crystal substrate. Voids are formed by immersing the ion-implanted crystal substrate in a melted metal liquid containing, e.g., silicon and indium for heating the substrate. While pressing an ion-injected surface of the substrate, the substrate is heated by the melted metal liquid to form the voids. By cooling the liquid, the silicon in the supersaturated liquid is deposited on the surface of the substrate so that the silicon-contained crystal film is formed on the surface of the substrate. The substrate is divided in the void-formed position. Thereby, a thin film including the silicon-contained crystal film layered on a portion of the substrate is obtained. The silicon-contained crystal thin film thus obtained can be adhered to a support substrate, if necessary.
    • 形成含硅晶体薄膜的方法可以有效地形成厚度较大的晶体薄膜。 在该方法中,将氢离子注入到含硅晶体基板中。 通过将离子注入的晶体衬底浸入含有例如硅和铟的熔融金属液体中以加热衬底而形成空隙。 在按压衬底的离子注入表面的同时,通过熔化的金属液体加热衬底以形成空隙。 通过冷却液体,将过饱和液体中的硅沉积在基板的表面上,使得在基板的表面上形成含硅晶体膜。 基板被分成空隙形成位置。 由此,获得了包含层叠在基板的一部分上的含硅晶体膜的薄膜。 如果需要,由此获得的含硅晶体薄膜可以粘附到支撑基板上。