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    • 15. 发明授权
    • Integrated circuit lead coupling device and method
    • 集成电路引线耦合器件及方法
    • US4232815A
    • 1980-11-11
    • US958118
    • 1978-11-06
    • Masahiko NakanoNobuaki Miyauchi
    • Masahiko NakanoNobuaki Miyauchi
    • H01L21/00H01L21/48H01L23/498H05K3/00H05K3/34B23K31/02H01L21/60
    • H01L23/49811H01L21/4853H01L2924/0002H05K3/0097H05K3/3405Y10T29/49121
    • A device and method for coupling leads to integrated circuit packages via lead frame rail members. The lead frame rail members consist of resilient leads coupled to a first rail and other resilient leads coupled to a second rail. The first rail is connected to the second rail such that the leads of the first rail are separated from and oppose the leads of the second rail. The coupling device consists of a main frame, a spreading means, an insertion means, and a releasing means. The spreading means is coupled to the main frame and is adapted to spread the leads of each rail of a lead frame rail member away from the opposing leads of the other rail such that an integrated circuit package can be inserted between the opposing leads at intervals along the rail member. The insertion means is coupled to the main frame and is adapted to insert coupling material between the integrated circuit packages and the leads. The releasing means is also coupled to the main frame and is adapted to release the resilient leads of each rail member such that the coupling material is clamped between the leads and the package. Also included in the invention is a method for coupling leads to a plurality of integrated circuit packages.
    • 一种用于通过引线框轨道构件将引线连接到集成电路封装的装置和方法。 引导框架轨道构件由耦合到第一轨道的弹性引线和联接到第二轨道的其它弹性引线组成。 第一轨道连接到第二轨道,使得第一轨道的引线与第二轨道的引线分离并与第二轨道的引线相对。 联接装置由主框架,扩展装置,插入装置和释放装置组成。 扩展装置耦合到主框架并且适于将引线框轨道构件的每个轨道的引线分散远离另一个轨道的相对引线,使得集成电路封装可以间隔沿着相对的引线插入 铁路会员。 插入装置联接到主框架并且适于在集成电路封装件和引线之间插入耦合材料。 释放装置还联接到主框架并且适于释放每个轨道构件的弹性引线,使得联接材料被夹紧在引线和封装之间。 本发明还包括将引线耦合到多个集成电路封装的方法。