专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

11. 发明申请

US20130174970A1 FORMING APPARATUS AND FORMING METHOD 有权
标题翻译：形成装置和形成方法
公开(公告)号：US20130174970A1
公开(公告)日：2013-07-11
申请号：US13823972
申请日：2011-11-22
申请人： Kenichi Mizoguchi , Kazunori Teramoto
发明人： Kenichi Mizoguchi , Kazunori Teramoto
IPC分类号： B29C65/48
CPC分类号： B29C65/48 , B29C51/082 , B29C51/16 , B29C51/32 , B29C51/428 , B29C2791/006 , Y10T156/1002
摘要： A forming apparatus includes a base material jig provided on a base, adhesion means for making a sheet having an adhesion layer and covered to a base material retained on the base material jig adhere to the base material, and trimming means for performing trimming on the sheet with respect to the base material with the sheet adhered thereto, in a state in which the base material is not removed from the base material jig.
摘要翻译：一种成形装置，包括设置在基座上的基材夹具，用于制造具有粘合层并覆盖在基材夹具上的基材的基材粘合到基材上的粘合装置，以及用于在该基材上进行修整的修整装置在基材未从基材夹具中除去的状态下，相对于附着有片材的基材。

12. 发明授权

US07833379B2 Method of cutting multilayer body, method of forming multilayer container, and multilayer formed product 有权
标题翻译：切割多层体的方法，多层容器的形成方法以及多层成型体
公开(公告)号：US07833379B2
公开(公告)日：2010-11-16
申请号：US10522392
申请日：2003-07-25
申请人： Kikuo Matsuoka , Shinji Tanaka , Yasuyo Sano , Toshihiro Takai , Kenichi Mizoguchi , Hideki Usami , Tomoaki Haruta
发明人： Kikuo Matsuoka , Shinji Tanaka , Yasuyo Sano , Toshihiro Takai , Kenichi Mizoguchi , Hideki Usami , Tomoaki Haruta
IPC分类号： B23B38/04 , B26D7/10
CPC分类号： B29C51/32 , B26D7/27 , B26F1/40 , B26F2001/4427 , B26F2210/06 , B29C51/04 , B29C51/10 , B29C51/14 , B29C2791/006 , B29L2031/712 , B32B27/18 , B65D81/267 , Y10T83/041 , Y10T83/0414 , Y10T83/0429 , Y10T83/283 , Y10T156/1052 , Y10T156/1054 , Y10T156/1313 , Y10T428/13 , Y10T428/1334 , Y10T428/1352
摘要： An end face of an intermediate layer of a multilayer structure is stably covered by surface resin layers at a time of cutting the multilayer structure. A cutting method of the multilayer structure 10 includes the steps of: compressing and deforming the multilayer structure, while extending respective layers 11, 12, 13 of the multilayer structure to provide a thin thickness portion, so that an upper layer bites into a lower layer by pushing a push cutter 15, by a predetermined amount, into the multilayer structure supported by a cutter receiving portion 14, in a fused state of at least one of the resin layers forming the multilayer structure; and push-cutting the compressed thin thickness portion S till the push cutter abuts against the cutter receiving portion so as to converge an intermediate layer 11 and surface resin layers 12, 13 of the multilayer structure to the abutting portion A of the push cutter 15 and the cutter receiving portion 14.
摘要翻译：在切割多层结构时，多层结构的中间层的端面被表面树脂层稳定地覆盖。多层结构10的切割方法包括以下步骤：压缩和变形多层结构，同时延伸多层结构的各层11,12,13，以提供薄的厚度部分，使得上层咬入下层通过将推动切割器15按预定量推入由切割器接收部分14支撑的多层结构中，在至少一个形成多层结构的树脂层的熔融状态下; 并推压压缩的薄壁部分S，直到推动切割器抵靠刀具接收部分，以将多层结构的中间层11和表面树脂层12,13会聚到推动切割器15的邻接部分A，并且刀具接收部分14。

13. 发明公开

US20230173738A1 THERMOFORMING DEVICE AND THERMOFORMING METHOD 审中-公开
公开(公告)号：US20230173738A1
公开(公告)日：2023-06-08
申请号：US18012436
申请日：2021-11-23
申请人： ASANO LABORATORIES CO., LTD.
发明人： Kazunori TERAMOTO , Shogo TAKAI , Yusuke SUZUKI , Kimihiro IIMURA
IPC分类号： B29C51/42
CPC分类号： B29C51/422 , B29C51/428 , B29C51/426
摘要： A thermoforming device according to the present invention has a masking plate and a heater block. A plurality of the heater blocks are disposed with a space therebetween in a planar direction of the masking plate. The thickness of the masking plate is 0.2-3.0 mm. The distance of the space is 1-15 mm, and the distance of the space is set at least five times larger than the thickness of the masking plate. Heat to be transmitted to the masking plate from a high temperature heater block is more easily transmitted in the thickness direction of the masking plate than in the surface direction of the masking plate, and is more easily transmitted to the sheet than to a portion, of the masking plate, corresponding to a low temperature heater block, whereby a temperature difference is provided between different zones of the masking plate.

14. 发明授权

US11173648B2 Thermoforming device and thermoforming method 有权
公开(公告)号：US11173648B2
公开(公告)日：2021-11-16
申请号：US15770844
申请日：2016-10-17
申请人： Asano Laboratories Co., Ltd.
发明人： Kazunori Teramoto , Masanobu Nihira , Hideki Usami
IPC分类号： B29C51/42 , B29C51/16 , B29C51/10 , B29C51/12 , B29C51/02 , B29C51/36 , B29C51/20 , B29C51/14 , B29C51/26 , B29K623/00
摘要： A thermoforming device includes: an upper hot plate including a first heating surface configured to heat a sheet from above; a lower hot plate including a second heating surface configured to heat the sheet from below; and a substrate-supplying unit including a base configured to hold a molded substrate, and configured to attach the molded substrate to and detach the molded substrate from the base and to dispose the molded substrate at a molding position below the first heating surface with the sheet interposed therebetween, in which the upper hot plate and the lower hot plate are configured to heat the sheet simultaneously from an upper surface and a lower surface of the sheet, the lower hot plate is provided to be movable in a horizontal direction with respect to a position below the upper hot plate, and the thermoforming device die-molds or adheres, onto the molded substrate held by the base, the sheet softened by being heated by the upper hot plate and the lower hot plate.

15. 发明授权

US07495194B2 Heating apparatus and heating method 有权
标题翻译：加热装置及加热方式
公开(公告)号：US07495194B2
公开(公告)日：2009-02-24
申请号：US11558507
申请日：2006-11-10
申请人： Toshihiro Takai , Yasuyoshi Ohashi , Kazushi Hayashi
发明人： Toshihiro Takai , Yasuyoshi Ohashi , Kazushi Hayashi
IPC分类号： H05B3/02 , H01C7/10
CPC分类号： B29C51/46 , B29B13/023 , B29C51/42 , B29C2037/90 , Y10T307/391 , Y10T307/527
摘要： A heating apparatus includes a plurality of heating means that heat a heated object, a temperature measuring means that measures temperatures of some of the plurality of heating means, a heated object information storing means that stores, in a coordinate manner, heated object identification names, target heating temperatures at the heating means, and sets of heating ratios respectively assigned to the heating means, a heating information storage means that defines a relationship between temperatures during heating of the heating means up to the target heating temperatures and heating intensities at the temperatures, a heated object identification name obtaining means that obtains one of the heated object identification names, a heated object information reading-out means that reads out one of the target heating temperatures and one of the sets of heating ratios respectively assigned to the plurality of heating means, corresponding to the heated object identification name from the heated object information storage means, a heating information reading-out means that reads out one of the heating intensities corresponding to the temperature measured by the temperature measuring means from the heating information storage means, and a heat control means that controls each of the plurality of heating means so that the target heating temperature is achieved.
摘要翻译：加热装置包括加热被加热物体的多个加热装置，测量多个加热装置中的一些加热装置的温度的温度测量装置，加热对象信息存储装置，以协调方式存储被加热物体识别名称，加热装置上的目标加热温度和分配给加热装置的一组加热比，加热信息存储装置，其限定加热装置的加热期间的温度与目标加热温度之间的关系和在该温度下的加热强度，获取被加热物体识别名称中的一个的被加热物体识别名称获取装置，读取目标加热温度中的一个加热对象信息读出装置和分别分配给多个加热装置的一组加热比，对应于加热的物体识别名称对象信息存储装置，加热信息读取装置，其从加热信息存储装置读出与由温度测量装置测量的温度相对应的加热强度之一;以及热控制装置，其控制多个加热装置，以达到目标加热温度。

16. 发明授权

US07323664B1 Heating system 有权
标题翻译：加热系统
公开(公告)号：US07323664B1
公开(公告)日：2008-01-29
申请号：US11558516
申请日：2006-11-10
申请人： Toshihiro Takai , Yasuyoshi Ohashi , Kazushi Hayashi
发明人： Toshihiro Takai , Yasuyoshi Ohashi , Kazushi Hayashi
IPC分类号： H05B1/02
CPC分类号： H05B1/0294
摘要： A heating system includes a plurality of radiant heaters, a power source supplying electricity to the radiant heaters, and a transformer provided between the radiant heaters and the power source, wherein each of the radiant heaters includes a support plate substantially having a rectangular shape, a pair of connection terminals substantially perpendicularly extending, while having a space therebetween, from one surface of the support plate, and a strip-shaped heater element arranged between the pair of connection terminals and covering the one surface of the support plate, wherein voltage E between the pair of connection terminals is adjusted by the transformer so as to satisfy an inequality of 25 V≦E≦35 V, wherein a width W of the strip-shaped heater element is set so as to satisfy an inequality of 8.5 mm≦W≦11.7 mm, and a thickness t thereof is set so as to satisfy an inequality of 0.05 mm≦t≦0.8 mm, and wherein the radiant heaters are connected to the transformer in a 3-phase and 4-wire configuration, a neutral line is connected to ones of the connection terminals, and one of a U-phase, V-phase, and W-phase of a secondary side of the transformer is connected to the others of the connection terminals.
摘要翻译：加热系统包括多个辐射加热器，向辐射加热器供电的电源和设置在辐射加热器和电源之间的变压器，其中每个辐射加热器包括基本上具有矩形形状的支撑板，一对连接端子从支撑板的一个表面基本上垂直延伸，同时具有一个空间，以及一个条形加热器元件，其布置在该对连接端子之间并且覆盖支撑板的一个表面，其中，所述一对连接端子被变压器调整以满足25V≤E≤35V的不等式，其中，所述条形加热器元件的宽度W被设定为满足不等式8.5mm < = W <= 11.7mm，其厚度t被设定为满足0.05mm <= t <= 0.8mm的不等式，并且其中辐射加热器以3相连接到变压器 d 4线配置，中性线连接到一个连接端子，并且变压器的次级侧的U相，V相和W相中的一个连接到其他连接端子。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式