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11. 发明授权

US07197725B2 Semiconductor integrated circuit and testing method for the same 有权
标题翻译：半导体集成电路和测试方法相同
公开(公告)号：US07197725B2
公开(公告)日：2007-03-27
申请号：US10187413
申请日：2002-07-02
申请人： Sadami Takeoka , Mitsuyasu Ohta , Osamu Ichikawa , Masayoshi Yoshimura , Takashi Ishimura
发明人： Sadami Takeoka , Mitsuyasu Ohta , Osamu Ichikawa , Masayoshi Yoshimura , Takashi Ishimura
IPC分类号： G06F17/50
CPC分类号： G11C29/12015 , G01R31/318552 , G01R31/31858 , G11C29/50012 , H03L7/00 , H03L7/06
摘要： A semiconductor integrated circuit of the present invention is provided with a clock control portion having a clock generation portion for generating a clock signal and an output command signal input portion for receiving a clock output command signal from the outside, and an internal circuit controlled by an output clock signal that is output from the clock control portion, and the clock control portion is configured so that it outputs the output clock signal to the internal circuit when a certain time period has passed from a time when the output command signal is received.
摘要翻译：本发明的半导体集成电路设置有时钟控制部分，其具有用于产生时钟信号的时钟产生部分和用于从外部接收时钟输出命令信号的输出命令信号输入部分和由外部控制的内部电路输出时钟信号，并且时钟控制部分被配置为使得当从接收到输出命令信号的时间过去一段时间时，它将输出时钟信号输出到内部电路。

12. 发明申请

US20060086074A1 Gas-liquid separator for a fuel cell system onboard a vehicle 失效
公开(公告)号：US20060086074A1
公开(公告)日：2006-04-27
申请号：US11251172
申请日：2005-10-14
申请人： Kuri Kasuya , Osamu Ichikawa
发明人： Kuri Kasuya , Osamu Ichikawa
IPC分类号： B01D45/00
CPC分类号： H01M8/0662 , B01D45/06
摘要： A gas-liquid separator for a fuel cell system onboard a vehicle includes an upper chamber, a lower chamber, a plate for separating the upper and lower chambers, a pipe for circulating the exhaust gas and connecting holes bored in the plate. The upper chamber receives exhaust gas from the fuel cell system to separate water contained in the exhaust gas. The lower chamber has a portion for discharging the water which is separated by the upper chamber. The pipe, which is attached to the upper chamber, has fluid communication with an inside of the upper chamber. The connecting holes provide fluid communication between the upper and lower chambers. The connecting holes are positioned off a center of the plate so that the connecting holes lie apart from the pipe.

13. 发明授权

US06514921B1 Cleaning agent 有权
公开(公告)号：US06514921B1
公开(公告)日：2003-02-04
申请号：US09658926
申请日：2000-09-11
申请人： Masahiko Kakizawa , Osamu Ichikawa , Ichiro Hayashida
发明人： Masahiko Kakizawa , Osamu Ichikawa , Ichiro Hayashida
IPC分类号： C11D166
CPC分类号： H01L21/02052 , C11D7/264 , C11D7/265 , C11D7/3209 , C11D7/3218 , C11D7/3245 , C11D11/0047
摘要： Removing particles and metallic contaminants without corrosing the metallized wirings and without giving adverse effect of planarization on the semiconductor substrate surface can be effectively achieved by use of a cleaning agent which comprises an organic acid having at least one carboxyl group and a complexing agent having chelating ability.

14. 发明授权

US06410494B1 Cleaning agent 有权
公开(公告)号：US06410494B1
公开(公告)日：2002-06-25
申请号：US09789736
申请日：2001-02-22
申请人： Masahiko Kakizawa , Osamu Ichikawa , Ichiro Hayashida
发明人： Masahiko Kakizawa , Osamu Ichikawa , Ichiro Hayashida
IPC分类号： C11D726
摘要： Removing particles and metallic contaminants without corrosing the metallized wirings and without giving adverse effect of planarization on the semiconductor substrate surface can be effectively achieved by use of a cleaning agent which comprises an organic acid having at least one carboxyl group and a complexing agent having chelating ability.

15. 发明授权

US06271677B1 Semiconductor integrated circuit and method for testing the semiconductor integrated circuit 失效
标题翻译：半导体集成电路和半导体集成电路测试方法
公开(公告)号：US06271677B1
公开(公告)日：2001-08-07
申请号：US09560126
申请日：2000-04-28
申请人： Mitsuyasu Ohta , Toshinori Hosokawa , Sadami Takeoka , Osamu Ichikawa
发明人： Mitsuyasu Ohta , Toshinori Hosokawa , Sadami Takeoka , Osamu Ichikawa
IPC分类号： H03K1900
CPC分类号： G01R31/318328
摘要： A semiconductor IC includes a test circuit comprising a logic circuit, a test timing generator, a first register serving as a test signal generation point, and second and third registers serving as test signal observation points. In this test circuit, a target signal transmission path to be tested is selected from a plurality of signal transmission paths in the logic circuit, and the test timing generator outputs a test clock having a cycle according to a delay time of the selected signal transmission path on design to the first to third registers, whereby the first register generates a test signal and the second and third registers observe the test signal. Therefore, the signal transmission paths connecting the test signal generation point and the test signal observation point are tested with high efficiency, whereby more signal transmission paths are tested for delay faults with less number of times the test is executed.
摘要翻译：半导体IC包括测试电路，其包括逻辑电路，测试定时发生器，用作测试信号生成点的第一寄存器，以及用作测试信号观测点的第二和第三寄存器。在该测试电路中，从逻辑电路中的多个信号传输路径选择要测试的目标信号传输路径，并且测试定时发生器输出具有根据所选信号传输路径的延迟时间的周期的测试时钟设计到第一至第三寄存器，由此第一寄存器产生测试信号，第二和第三寄存器观察测试信号。因此，连接测试信号生成点和测试信号观察点的信号传输路径被高效率地测试，由此对于执行测试次数较少的延迟故障来测试更多的信号传输路径。

16. 发明授权

US4752113A Waterproof optical fiber cable 失效
标题翻译：防水光缆
公开(公告)号：US4752113A
公开(公告)日：1988-06-21
申请号：US36454
申请日：1987-04-09
申请人： Yasunori Saito , Osamu Ichikawa , Toshio Oshima
发明人： Yasunori Saito , Osamu Ichikawa , Toshio Oshima
IPC分类号： H01B13/32 , G02B6/44
CPC分类号： G02B6/4427 , G02B6/4489 , G02B6/4491 , G02B6/4494
摘要： In a waterproof optical fiber cable for use in a communication system, one or more optical fibers are loosely put in grooves formed along a spacer and a plurality of filled portions are formed in each of said grooves by being filled with dampproof material with a predetermined interval so as to provide a plurality of filled portions and unfilled portions alternately, whereby undesired local bending of the optical fibers can be prevented. Also a method of making the waterproof optical fiber cable having such filled portions and unfilled portions is disclosed.

17. 发明授权

US4729627A Optical fiber cable for detecting low temperature 失效
标题翻译：用于检测低温的光缆
公开(公告)号：US4729627A
公开(公告)日：1988-03-08
申请号：US640093
申请日：1984-08-13
申请人： Yasunori Saito , Osamu Ichikawa
发明人： Yasunori Saito , Osamu Ichikawa
IPC分类号： G01K11/32 , G02B6/44 , H01J5/16
CPC分类号： G01K11/32
摘要： An optical fiber cable for detecting a low temperature comprising a center member made of a material having a low coefficient of linear expansion and one or more longitudinally extending grooves in each of which at least one optical fiber is placed, (i) wherein at least one optical fiber comprising a core and a cladding both made of silica glass is placed in each of said grooves and the interior space of the groove which is not occupied by the optical fiber or fibers may be filled with a resin which has a low glass transition temperature; or (ii) wherein each of the optical fibers placed in each of said grooves, have different coating structures from each other and/or different fiber structures from each other so as to detect a low temperature in different temperature ranges.
摘要翻译：一种用于检测低温的光缆，包括由具有低线性膨胀系数的材料制成的中心部件和一个或多个纵向延伸的凹槽，每个光纤放置至少一根光纤，（i）其中至少一个包括由石英玻璃制成的芯和包层的光纤被放置在每个所述凹槽中，并且未被光纤或纤维占据的槽的内部空间可以填充有玻璃化转变温度低的树脂 ; 或（ii）其中放置在每个所述凹槽中的每个光纤彼此具有不同的涂层结构和/或彼此不同的纤维结构，以便检测不同温度范围内的低温。

18. 发明授权

US08696342B2 Waveform monitor apparatus of injection molding machine 有权
标题翻译：注塑机波形监测仪
公开(公告)号：US08696342B2
公开(公告)日：2014-04-15
申请号：US13554259
申请日：2012-07-20
申请人： Nobukazu Kasuga , Hirofumi Murata , Takashi Hakoda , Osamu Ichikawa
发明人： Nobukazu Kasuga , Hirofumi Murata , Takashi Hakoda , Osamu Ichikawa
IPC分类号： B29C45/77 , B29C45/78
CPC分类号： B29C45/766 , B29C45/80 , B29C2045/7606 , B29C2945/76096 , B29C2945/76264 , B29C2945/76498 , B29C2945/76505 , B29C2945/76595 , B29C2945/76859
摘要： When a waveform monitor apparatus 1 of an injection molding machine M for monitoring an operation waveform at least during molding is configured by mounting the waveform monitor apparatus 1 on the injection molding machine M for performing molding according to a specific molding system, a parting opening detecting means Fp for detecting change data of a parting opening Lm to a time during molding, and an operation waveform displaying means Fd for displaying at least change data from a resin filling start is into a mold 2 to a cooling time termination to of the mold 2, detected by the parting opening detecting means Fp, on a waveform displaying portion 5 of a screen 4v on a display 4 attached to a molding machine controller 3 are provided.
摘要翻译：当至少在成型期间用于监视操作波形的注射成型机M的波形监视装置1通过将波形监视装置1安装在根据特定模制系统进行模制的注射成型机M上而构成时，意味着用于检测分模开口Lm到成型时间的变化数据的Fp，并且至少显示来自树脂填充开始的变化数据的操作波形显示装置Fd进入模具2到模具2的冷却时间终止提供了由分型开启检测装置Fp检测到的，在安装在成型机控制器3上的显示器4上的屏幕4v的波形显示部分5上。

19. 发明授权

US08431459B2 Semiconductor wafer, semiconductor device, and method of manufacturing a semiconductor device 有权
标题翻译：半导体晶片，半导体器件以及半导体器件的制造方法
公开(公告)号：US08431459B2
公开(公告)日：2013-04-30
申请号：US12934233
申请日：2009-03-26
申请人： Mitsuru Takenaka , Shinichi Takagi , Masahiko Hata , Osamu Ichikawa
发明人： Mitsuru Takenaka , Shinichi Takagi , Masahiko Hata , Osamu Ichikawa
IPC分类号： H01L21/00
CPC分类号： H01L29/7787 , H01L21/28264 , H01L29/205 , H01L29/517 , H01L29/66462 , H01L29/66522 , H01L29/78648 , H01L29/78681
摘要： It is an objective of the present invention to form a favorable interface between an oxide layer and a group 3-5 compound semiconductor using a practical and simple method.Provided is a semiconductor wafer comprising a first semiconductor layer that is a group 3-5 compound not containing arsenic and that lattice matches or pseudo-lattice matches with InP; and a second semiconductor layer that is formed to contact the first semiconductor layer, is a group 3-5 compound semiconductor layer that lattice matches or pseudo-lattice matches with InP, and can be selectively oxidized relative to the first semiconductor layer. Also provided is a semiconductor device comprising a first semiconductor layer that is a group 3-5 compound not containing arsenic and that lattice matches or pseudo-lattice matches with InP; an oxide layer formed by selectively oxidizing, relative to the first semiconductor layer, at least a portion of a second semiconductor layer that is a group 3-5 compound formed to contact the first semiconductor layer and that lattice matches or pseudo-lattice matches with InP; and a control electrode that adds an electric field to a channel formed in the first semiconductor layer.
摘要翻译：本发明的目的是使用实用和简单的方法在氧化物层和3-5族化合物半导体之间形成良好的界面。提供了包括第一半导体层的半导体晶片，其是不含砷的组3-5化合物，并且晶格匹配或伪晶格与InP匹配; 和形成为与第一半导体层接触的第二半导体层是与InP晶格匹配或伪晶格匹配的组3-5化合物半导体层，并且可相对于第一半导体层选择性地氧化。还提供了一种半导体器件，其包括第一半导体层，其是不含砷的组3-5化合物，并且晶格匹配或伪晶格与InP匹配; 通过相对于第一半导体层选择性地氧化形成为与第一半导体层接触的组3-5化合物的第二半导体层的至少一部分，并且晶格匹配或伪晶格匹配的InP形成的氧化物层 ; 以及将电场与形成在第一半导体层中的沟道相加的控制电极。

20. 发明授权

US08165317B2 Method and system for position detection of a sound source 有权
标题翻译：声源位置检测方法及系统
公开(公告)号：US08165317B2
公开(公告)日：2012-04-24
申请号：US12498012
申请日：2009-07-06
申请人： Osamu Ichikawa , Tohru Nagano , Masafumi Nishimura
发明人： Osamu Ichikawa , Tohru Nagano , Masafumi Nishimura
IPC分类号： H04R3/00
CPC分类号： G01S5/30 , H04R3/005
摘要： A position detection method, system, and computer readable article of manufacture tangibly embodying computer readable instructions for executing the method for detecting the position of a sound source using at least two microphones. The method includes the steps of: emitting a reproduced sound from the sound source; observing the reproduced sound and an observed sound at the microphones; converting the reproduced sound and the observed sound into electrical signals; transforming the signals of the reproduced sound and of the observed sound into frequency spectra by a frequency spectrum transformer apparatus; calculating Crosspower Spectrum Phase (CSP) coefficients of the frequency spectra of the signals by a CSP coefficient calculator apparatus; and calculating distances between the position of the sound source and the positions of the microphones based on the calculated CSP coefficients by a distance calculating apparatus, thereby detecting the position of the sound source.
摘要翻译：一种有形地体现用于执行用于使用至少两个麦克风来检测声源的位置的方法的计算机可读指令的位置检测方法，系统和计算机可读制品。该方法包括以下步骤：从声源发射再现的声音; 观察麦克风上再现的声音和观察到的声音; 将再现的声音和观察到的声音转换成电信号; 通过频谱变换装置将再生声音和观测声音的信号变换为频谱; 通过CSP系数计算装置计算信号频谱的交叉频谱相位（CSP）系数; 并且通过距离计算装置基于所计算的CSP系数来计算声源的位置与麦克风的位置之间的距离，从而检测声源的位置。

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