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11. 发明申请

US20090231819A1 MULTILAYER SUBSTRATE 审中-公开
标题翻译：多层基板
公开(公告)号：US20090231819A1
公开(公告)日：2009-09-17
申请号：US12331769
申请日：2008-12-10
申请人： Yoshiaki SATAKE , Taihei Nakada
发明人： Yoshiaki SATAKE , Taihei Nakada
IPC分类号： H05K1/18
CPC分类号： H05K1/0253 , H05K1/0224 , H05K1/025 , H05K3/429 , H05K2201/0191 , H05K2201/0715 , H05K2201/09336 , H05K2201/09627 , H05K2201/09845 , H05K2201/09972
摘要： A multilayer substrate has a 1st strip line, a 2nd strip line and the 3rd strip line, and those characteristic impedances are different each other. The third strip line has a strip conductor of which length is equivalent to ¼ wavelength of an operating frequency. A strip conductor of the third strip line is the same conductor as a strip conductor of the first strip line, and is a different conductor layer from a strip conductor of the second strip line. Ground conductors of the 3rd strip line are formed of the same conductor layer as one of a ground conductor of the 1st strip line, and the same conductor layer as one of a ground conductor of the 2nd strip line. The strip conductor of the second strip line and the strip conductor of the third strip line are connected through via hole arranged in the multilayer substrate.
摘要翻译：多层基板具有第一带状线，第二带状线和第三带状线，并且那些特性阻抗彼此不同。第三带状线具有条形导体，其长度等于工作频率的1/4波长。第三带状线的带状导体是与第一带状线的带状导体相同的导体，并且是与第二带状线的带状导体不同的导体层。第三带状线的接地导体由与第一带状线的接地导体中的一个相同的导体层和与第二带状线的接地导体之一相同的导体层形成。第二带状带的带状导体和第三条带的带状导体通过设置在多层基板中的通孔连接。

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