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11. 发明授权

US08814030B2 Improvements of long term bondline reliability of power electronics operating at high temperatures 有权
标题翻译：电力电子在高温下运行的长期保护层可靠性的改进
公开(公告)号：US08814030B2
公开(公告)日：2014-08-26
申请号：US13723055
申请日：2012-12-20
申请人： Sang Won Yoon
发明人： Sang Won Yoon
IPC分类号： B23K31/02 , B23K20/16
CPC分类号： B23K31/02 , B23K20/16 , H01L24/29 , H01L24/83 , H01L24/94 , H01L2224/29109 , H01L2224/29111 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29155 , H01L2224/32145 , H01L2224/32225 , H01L2224/32503 , H01L2224/32507 , H01L2224/83447 , H01L2224/8381 , H01L2224/83825 , H01L2224/94 , H01L2224/83 , H01L2924/00014
摘要： Alloy formation systems and methods and a mechanism, strategy and design for power electronics having high operating temperatures. The system creates a bondline targeted for performance in power electronics. The system provides for sequential alloy growth in high temperature operating power electronics. The system is at least applicable to wafer-to-wafer, die-to-wafer, die-to-substrate, or die-to-die bonding.
摘要翻译：合金形成系统和方法以及具有高工作温度的电力电子器件的机理，策略和设计。该系统创建了一个针对电力电子产品性能的绑定线。该系统提供高温工作电力电子设备中顺序合金生长。该系统至少适用于晶片到晶片，晶片到晶片，管芯到衬底或管芯到管芯的接合。

12. 发明申请

US20130270327A1 IMPROVEMENTS OF LONG TERM BONDLINE RELIABILITY OF POWER ELECTRONICS OPERATING AT HIGH TEMPERATURES 有权
标题翻译：电力电子技术在高温下长期可靠性的改进
公开(公告)号：US20130270327A1
公开(公告)日：2013-10-17
申请号：US13723055
申请日：2012-12-20
申请人： Sang Won Yoon
发明人： Sang Won Yoon
IPC分类号： B23K31/02
CPC分类号： B23K31/02 , B23K20/16 , H01L24/29 , H01L24/83 , H01L24/94 , H01L2224/29109 , H01L2224/29111 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29155 , H01L2224/32145 , H01L2224/32225 , H01L2224/32503 , H01L2224/32507 , H01L2224/83447 , H01L2224/8381 , H01L2224/83825 , H01L2224/94 , H01L2224/83 , H01L2924/00014
摘要： Alloy formation systems and methods and a mechanism, strategy and design for power electronics having high operating temperatures. The system creates a bondline targeted for performance in power electronics. The system provides for sequential alloy growth in high temperature operating power electronics. The system is at least applicable to wafer-to-wafer, die-to-wafer, die-to-substrate, or die-to-die bonding.
摘要翻译：合金形成系统和方法以及具有高工作温度的电力电子器件的机理，策略和设计。该系统创建了一个针对电力电子产品性能的绑定线。该系统提供高温工作电力电子设备中的顺序合金生长。该系统至少适用于晶片到晶片，晶片到晶片，管芯到衬底或管芯到管芯的接合。

13. 发明申请

US20130270326A1 ALLOY FORMATION CONTROL OF TRANSIENT LIQUID PHASE BONDING 有权
标题翻译：瞬态液相接合的合金形成控制
公开(公告)号：US20130270326A1
公开(公告)日：2013-10-17
申请号：US13448632
申请日：2012-04-17
申请人： Sang Won Yoon , Koji Shiozaki
发明人： Sang Won Yoon , Koji Shiozaki
IPC分类号： B23K31/02 , B23K37/04 , B23K20/00
CPC分类号： B23K20/02 , B23K20/16 , B23K2101/36 , H01L24/83 , H01L2224/83 , H01L2224/83825 , H01L2224/8383
摘要： A bonding structure enabling fast and reliable methods to fabricate a substantially homogeneous bondline with reduced dependency of a thickness limitation is disclosed. Also, this system creates a bondline targeted for performance in power electronics. This system is highly adaptable as various structures and fabrication options may be implemented. This enables diverse fabrication selection and creates less dependency on outside conditions. The disclosed system is at least applicable to wafer-to-wafer, die-to-wafer, die-to-substrate, or die-to-die bonding.
摘要翻译：公开了一种能够快速且可靠地制造基本上均匀的粘合线的接合结构，其具有减小的厚度限制的依赖性。此外，该系统还创建了一个针对电力电子产品性能的粘合线。该系统是高度适应性的，因为可以实现各种结构和制造选项。这使得能够进行多样化的制造选择并且对外部条件产生较少的依赖性。所公开的系统至少适用于晶片到晶片，晶片到晶片，管芯到衬底或管芯到管芯的接合。

14. 发明授权

US08317784B2 Magnetic switching device 有权
标题翻译：磁性开关装置
公开(公告)号：US08317784B2
公开(公告)日：2012-11-27
申请号：US12840747
申请日：2010-07-21
申请人： William Choe , Sang Won Yoon
发明人： William Choe , Sang Won Yoon
IPC分类号： A61B18/12
CPC分类号： A61N1/3968 , A61B18/12 , A61B2018/00791 , A61N1/362 , A61N1/37223
摘要： A magnetic switching device includes an electromagnetic component adapted to be arranged proximate to an exterior surface of an object having a magnetically-switchable device therein and a control circuit electrically connected to the electromagnetic component. The electromagnetic component is constructed to generate a magnetic field of sufficient strength and orientation to engage a switch in the magnetically-switchable device. The invention further includes an electrocautery system, including an electrocautery device, a control circuit electrically connected to the electrocautery device, and an electromagnetic component electrically connected to the control circuit. The electromagnetic component is adapted to be arranged proximate to an exterior surface of an object having a magnetically-switchable device therein. Operation of the electrocautery device causes the electromagnetic component to generate a magnetic field of sufficient strength to engage a switch in the magnetically-switchable device.
摘要翻译：一种磁性开关装置包括：适于布置成靠近其中具有可磁化装置的物体的外表面的电磁部件和与电磁部件电连接的控制电路。电磁部件被构造成产生具有足够强度和取向的磁场，以接合可开关的装置中的开关。本发明还包括一种电烙术系统，包括电烙术装置，电连接到电灼装置的控制电路以及与控制电路电连接的电磁部件。电磁部件适于布置成靠近其中具有可磁性切换装置的物体的外表面。电灼装置的操作使得电磁部件产生足够强度的磁场，以接合可开关的装置中的开关。

15. 发明授权

US08138019B2 Integrated (multilayer) circuits and process of producing the same 有权
标题翻译：集成（多层）电路及其制造方法
公开(公告)号：US08138019B2
公开(公告)日：2012-03-20
申请号：US12611285
申请日：2009-11-03
申请人： Sang Won Yoon , Alexandros Margomenos
发明人： Sang Won Yoon , Alexandros Margomenos
IPC分类号： H01L21/00 , H01L21/30
CPC分类号： H01L25/0657 , B81C1/00238 , B81C2203/0771 , B81C2203/0792 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/18 , H01L25/50 , H01L2224/11003 , H01L2224/111 , H01L2224/11334 , H01L2224/1145 , H01L2224/11462 , H01L2224/1148 , H01L2224/1184 , H01L2224/11845 , H01L2224/11849 , H01L2224/13099 , H01L2224/131 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/1329 , H01L2224/13299 , H01L2224/133 , H01L2224/276 , H01L2224/2784 , H01L2224/27845 , H01L2224/29011 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/30181 , H01L2224/73104 , H01L2224/811 , H01L2224/81903 , H01L2224/83101 , H01L2224/83203 , H01L2224/838 , H01L2224/8385 , H01L2224/9221 , H01L2225/06513 , H01L2225/06517 , H01L2225/06562 , H01L2225/06565 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/07811 , H01L2924/14 , H01L2924/1461 , H01L2924/1579 , H01L2924/00014 , H01L2924/00 , H01L2924/01027 , H01L2924/3512
摘要： A process of forming a semiconductor integrated circuit that includes the steps of: forming at least a first element having a first pattern of conductive material and including a polymer layer surrounding the conductive material, forming at least a second element having a second pattern of conductive material and including a polymer layer surrounding the conductive material, positioning the first element relative to the second element, and bonding the polymer layer of the first and second elements at a temperature below a melting temperature of the conductive materials of the first and second elements wherein the conductive material of the first element contacts the conductive material of the second element and is maintained in position by the bonded polymer layers.
摘要翻译：一种形成半导体集成电路的方法，包括以下步骤：至少形成具有导电材料的第一图案的第一元件，并且包括围绕导电材料的聚合物层，至少形成具有第二导电材料图案的第二元件并且包括围绕所述导电材料的聚合物层，相对于所述第二元件定位所述第一元件，以及在低于所述第一和第二元件的导电材料的熔融温度的温度下将所述第一和第二元件的聚合物层粘合，其中第一元件的导电材料接触第二元件的导电材料，并通过结合的聚合物层保持在适当的位置。

16. 发明授权

US10058951B2 Alloy formation control of transient liquid phase bonding 有权
公开(公告)号：US10058951B2
公开(公告)日：2018-08-28
申请号：US13448632
申请日：2012-04-17
申请人： Sang Won Yoon , Koji Shiozaki
发明人： Sang Won Yoon , Koji Shiozaki
IPC分类号： B23K20/02 , B23K20/16 , H01L23/00 , B23K101/36
CPC分类号： B23K20/02 , B23K20/16 , B23K2101/36 , H01L24/83 , H01L2224/83 , H01L2224/83825 , H01L2224/8383
摘要： A bonding structure enabling fast and reliable methods to fabricate a substantially homogeneous bondline with reduced dependency of a thickness limitation is disclosed. Also, this system creates a bondline targeted for performance in power electronics. This system is highly adaptable as various structures and fabrication options may be implemented. This enables diverse fabrication selection and creates less dependency on outside conditions. The disclosed system is at least applicable to wafer-to-wafer, die-to-wafer, die-to-substrate, or die-to-die bonding.

17. 发明授权

US07986076B2 Energy harvesting device 有权
标题翻译：能量收集装置
公开(公告)号：US07986076B2
公开(公告)日：2011-07-26
申请号：US12610771
申请日：2009-11-02
申请人： Sang Won Yoon , Alexandros Margomenos
发明人： Sang Won Yoon , Alexandros Margomenos
IPC分类号： H01L41/08
CPC分类号： H02N2/186 , H01L41/1134 , H01L41/1136
摘要： The present invention discloses an energy harvesting device that converts small magnitude and low frequency vibrations into electrical energy. The device can include a base, a low frequency element, and a piezoelectric element. The low frequency element can be movably attached to the base and the piezoelectric element can also be attached to the base and be spaced apart from the low frequency element with a vacant space therebetween. Upon vibration of the low frequency element resulting from environmental vibrations, the low frequency element can impact the piezoelectric element and cause elastic deformation thereto.
摘要翻译：本发明公开了一种将小振幅和低频振动转换为电能的能量收集装置。该器件可以包括基极，低频元件和压电元件。低频元件可以可移动地附接到基座，并且压电元件也可以附接到基座并且与低频元件间隔开，其间具有空隙。由于环境振动引起的低频元件的振动，低频元件可能会冲击压电元件并引起弹性变形。

18. 发明申请

US20110060330A1 MAGNETIC SWITCHING DEVICE 有权
标题翻译：磁性开关装置
公开(公告)号：US20110060330A1
公开(公告)日：2011-03-10
申请号：US12840747
申请日：2010-07-21
申请人： William CHOE , Sang Won Yoon
发明人： William CHOE , Sang Won Yoon
IPC分类号： A61B18/12 , H01H50/00
CPC分类号： A61N1/3968 , A61B18/12 , A61B2018/00791 , A61N1/362 , A61N1/37223
摘要： A magnetic switching device includes an electromagnetic component adapted to be arranged proximate to an exterior surface of an object having a magnetically-switchable device therein and a control circuit electrically connected to the electromagnetic component. The electromagnetic component is constructed to generate a magnetic field of sufficient strength and orientation to engage a switch in the magnetically-switchable device. The invention further includes an electrocautery system, including an electrocautery device, a control circuit electrically connected to the electrocautery device, and an electromagnetic component electrically connected to the control circuit. The electromagnetic component is adapted to be arranged proximate to an exterior surface of an object having a magnetically-switchable device therein. Operation of the electrocautery device causes the electromagnetic component to generate a magnetic field of sufficient strength to engage a switch in the magnetically-switchable device.
摘要翻译：一种磁性开关装置包括：适于布置成靠近其中具有可磁化装置的物体的外表面的电磁部件和与电磁部件电连接的控制电路。电磁部件被构造成产生具有足够强度和取向的磁场，以接合可开关的装置中的开关。本发明还包括一种电烙术系统，包括电烙术装置，电连接到电灼装置的控制电路以及与控制电路电连接的电磁部件。电磁部件适于布置成靠近其中具有可磁性切换装置的物体的外表面。电灼装置的操作使得电磁部件产生足够强度的磁场，以接合可开关的装置中的开关。

19. 外观设计

USD566151S1 Surveillance camera 有权
公开(公告)号：USD566151S1
公开(公告)日：2008-04-08
申请号：US29274018
申请日：2007-03-21
申请人： Hyo Jin Won , Sang Won Yoon
设计人： Hyo Jin Won , Sang Won Yoon

20. 发明授权

US08803001B2 Bonding area design for transient liquid phase bonding process 有权
标题翻译：瞬态液相接合工艺的接合区设计
公开(公告)号：US08803001B2
公开(公告)日：2014-08-12
申请号：US13165660
申请日：2011-06-21
申请人： Sang Won Yoon , Satoshi Yasuda , Koji Shiozaki
发明人： Sang Won Yoon , Satoshi Yasuda , Koji Shiozaki
IPC分类号： H05K1/18 , B05D1/36 , B23K35/02 , B05D5/00
CPC分类号： B23K35/262 , H01L21/4846 , H01L23/3735 , H01L23/49811 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/94 , H01L25/0657 , H01L25/50 , H01L2224/26175 , H01L2224/27013 , H01L2224/29109 , H01L2224/29111 , H01L2224/32145 , H01L2224/32225 , H01L2224/83193 , H01L2224/83825 , H01L2224/94 , H01L2924/01029 , H01L2924/0132 , H01L2924/12042 , H01L2924/1461 , H01L2924/1579 , Y10T428/12222 , H01L2924/0105 , H01L2924/01006 , H01L2924/01014 , H01L2924/00014 , H01L2924/01047 , H01L2924/01049 , H01L2924/01079 , H01L2924/01028 , H01L2924/00 , H01L2224/83
摘要： Devices, methods and systems are disclosed herein to describe the wettability characteristics of the material forming a bonding area, a non-bonding area, and a melted bonding material. The melted bonding material may have a high degree of cohesion and may result in a very high contact angle (e.g., between 90°- 180°) in the non-bonding area thereby preventing or limiting the flow of a melted material into the non-bonding area, which often results when the melted bonding material forms a low contact angle (e.g., between 0°-90°) in the bonding area. In other words, by choosing a material for the non-bonding area to have low wettability characteristics when compared to the melted materials of the bonding area or by treating the material forming the non-bonding area to have much lower wettability characteristics, the melted materials of the bonding area may be prevented from flowing into the non-bonding area.
摘要翻译：本文公开的装置，方法和系统用于描述形成接合区域，非结合区域和熔融粘合材料的材料的润湿性能。熔融的粘合材料可能具有高度的内聚力，并且可能导致非接合区域中的非常高的接触角（例如，在90°至180°之间），从而防止或限制熔融材料流入非接触区域，粘结区域，这通常在熔融粘合材料在粘合区域中形成低接触角（例如0°-90°）时产生。换句话说，通过选择与接合区域的熔融材料相比具有低润湿性特性的非粘结区域的材料或通过处理形成非粘合区域的材料具有低得多的润湿性，熔融材料可以防止粘合区域流入非接合区域。

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