专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

11. 发明授权

US07239527B1 Backplane with power plane having a digital ground structure in signal regions 有权
标题翻译：具有在信号区域中具有数字地面结构的电源平面的背板
公开(公告)号：US07239527B1
公开(公告)日：2007-07-03
申请号：US11009408
申请日：2004-12-08
申请人： Joel R. Goergen
发明人： Joel R. Goergen
IPC分类号： H01R12/16
CPC分类号： H05K1/0237 , H05K1/0219 , H05K1/0225 , H05K3/429 , H05K2201/044 , H05K2201/093 , H05K2201/09345 , H05K2201/09609 , H05K2201/09663
摘要： For electrical backplanes and the like, a power plane adaptation to improve the propagation of high-speed signals through clearances in an embedded power plane is disclosed. In exemplary embodiments, the power plane is segmented in a high-speed connector region, such that a portion of the metal layer that forms the power plane is retained in the high-speed connector region—but isolated from the power-delivery portion of the power plane. The isolated portion is connected to digital ground, and clearances are formed therein where high-speed signaling throughholes will pass through the region. In some embodiments, various attainable advantages include better manufacturability, better matching and control of high-speed signaling throughhole impedance, and improved noise isolation. Other embodiments are described and claimed.
摘要翻译：对于电气背板等，公开了一种用于改善高速信号通过嵌入式电源平面中的间隙的传播的电力平面适配。在示例性实施例中，电力平面在高速连接器区域中分段，使得形成电力平面的金属层的一部分保持在高速连接器区域中，但是与电力输送部分电力飞机隔离部分连接到数字地，并且在其中形成间隙，其中高速信令通孔将通过该区域。在一些实施例中，各种可获得的优点包括更好的可制造性，更好地匹配和控制高速信号通孔阻抗以及改进的噪声隔离。描述和要求保护其他实施例。

12. 发明授权

US06941649B2 Method of fabricating a high-layer-count backplane 有权
标题翻译：制造高层计数背板的方法
公开(公告)号：US06941649B2
公开(公告)日：2005-09-13
申请号：US10068745
申请日：2002-02-05
申请人： Joel R. Goergen
发明人： Joel R. Goergen
IPC分类号： H05K1/02 , H05K1/11 , H05K3/38 , H05K3/42 , H05K3/46 , H05K3/02
CPC分类号： H05K3/4688 , H05K1/0218 , H05K1/024 , H05K1/0243 , H05K1/0271 , H05K1/116 , H05K3/382 , H05K3/429 , H05K3/4626 , H05K3/4641 , H05K2201/0209 , H05K2201/044 , H05K2201/0723 , H05K2201/09236 , H05K2201/093 , H05K2201/09309 , H05K2201/09318 , H05K2201/09327 , H05K2201/09354 , H05K2201/09381 , H05K2201/09454 , H05K2201/09636 , H05K2201/09663 , H05K2201/09718 , H05K2201/09781 , H05K2203/061 , Y10T29/49117 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49162 , Y10T29/49163 , Y10T29/49165
摘要： The disclosed board fabrication techniques and design features enable the construction of a reliable, high-layer-count, and economical backplane for routers and the like that require a large number of signaling paths across the backplane at speeds of 2.5 Gbps or greater, as well as distribution of significant amounts of power to router components. The disclosed techniques and features allow relatively thick (e.g., three- or four-ounce copper) power distribution planes to be combined with large numbers of high-speed signaling layers in a common backplane. Using traditional techniques, such a construction would not be possible because of the number of layers required and the thickness of the power distribution layers. The disclosed embodiments use novel layer arrangements, material selection, processing techniques, and panel features to produce the desired high-speed layers and low-noise high-power distribution layers in a single mechanically stable board.
摘要翻译：所公开的板制造技术和设计特征使得能够构建用于路由器等的可靠的，高层次的和经济的背板，其需要以2.5Gbps或更高的速度跨越背板的大量信令路径，以及作为路由器组件的大量功率分配。所公开的技术和特征允许相对较厚（例如，三或四盎司铜）功率分配平面与公共背板中的大量高速信号层组合。使用传统技术，由于需要的层数和配电层的厚度，这种结构将是不可能的。所公开的实施例使用新颖的层布置，材料选择，处理技术和面板特征来在单个机械稳定的板中产生期望的高速层和低噪声大功率分配层。

13. 发明授权

US09560774B2 Method of fabricating a circuit board 有权
标题翻译：制造电路板的方法
公开(公告)号：US09560774B2
公开(公告)日：2017-01-31
申请号：US13420167
申请日：2012-03-14
申请人： Joel R. Goergen , Greg Hunt
发明人： Joel R. Goergen , Greg Hunt
IPC分类号： H05K3/20 , H05K3/42 , H05K1/02 , H05K3/00
CPC分类号： H05K3/429 , H05K1/0216 , H05K1/0237 , H05K3/0047 , H05K2201/044 , H05K2201/09236 , H05K2201/09845 , H05K2203/0207 , H05K2203/0242 , H05K2203/175 , Y10T29/49165
摘要： A high-speed router backplane is disclosed. The router backplane uses differential signal pairs on multiple signal layers, each sandwiched between a pair of digital ground layers. Thru-holes are used to connect the differential signal pairs to external components. To reduce routing complexity, at least some of the differential signal pairs route through a via pair, somewhere along their path, to a different signal layer. At least some of the thru-holes and vias are drilled to reduce an electrically conductive stub length portion of the hole. The drilled portion of a hole includes a transition from a first profile to a second profile to reduce radio frequency reflections from the end of the drilled hole.
摘要翻译：公开了一种高速路由器背板。路由器背板在多个信号层上使用差分信号对，每个信号对夹在一对数字接地层之间。通孔用于将差分信号对连接到外部组件。为了降低路由复杂度，差分信号对中的至少一些在其路径的某处沿着不同的信号层路由通路对。钻出至少一些通孔和通孔以减少孔的导电短截线长度部分。孔的钻孔部分包括从第一轮廓到第二轮廓的转变，以减少从钻孔的端部的射频反射。

14. 发明授权

US08345439B1 Modular chassis arrangement with redundant logic power delivery system 有权
标题翻译：具有冗余逻辑电源传输系统的模块化机箱布置
公开(公告)号：US08345439B1
公开(公告)日：2013-01-01
申请号：US12313265
申请日：2008-11-18
申请人： Joel R. Goergen , Donald Lewis
发明人： Joel R. Goergen , Donald Lewis
IPC分类号： H05K1/11
CPC分类号： H04L49/40 , H05K7/1458 , H05K2201/044
摘要： A modular packet network device has a chassis in which multiple logic cards mate to the front side of an electrical signaling backplane. Logic power for the logic cards is supplied from a group of power converter cards that convert primary power to the logic voltages required by the logic cards. The power converter cards lie in a separate cooling path behind the backplane. Advantages achieved in at least some of the embodiments include removing primary power planes from the signaling backplane or portion of the backplane, providing redundant, upgradeable power modules whose individual failure does not cause logic card failure, and providing cool air to power converter circuits that would be subject to only heated air if located on the logic cards. Other embodiments are also described and claimed.
摘要翻译：模块化分组网络设备具有其中多个逻辑卡配合到电信令背板的前侧的机箱。逻辑卡的逻辑电源由一组将主电源转换为逻辑卡所需的逻辑电压的电源转换器卡提供。电源转换卡位于背板背后的单独冷却路径中。在至少一些实施例中实现的优点包括从信令背板或背板的一部分移除主电源层，提供冗余的可升级电源模块，其单独的故障不会导致逻辑卡故障，并向功率转换器电路提供冷空气，如果位于逻辑卡上，只能加热空气。还描述和要求保护其他实施例。

15. 发明申请

US20120144665A1 IMPEDANCE TUNING FOR CIRCUIT BOARD SIGNAL PATH SURFACE PAD STRUCTURES 有权
标题翻译：用于电路板信号路径表面贴片结构的阻抗调谐
公开(公告)号：US20120144665A1
公开(公告)日：2012-06-14
申请号：US13400207
申请日：2012-02-20
申请人： Joel R. Goergen , Greg Hunt , Peter Tomaszewski , Joseph Pankow , Michael Laudon
发明人： Joel R. Goergen , Greg Hunt , Peter Tomaszewski , Joseph Pankow , Michael Laudon
IPC分类号： H05K3/32 , H05K3/10 , H05K3/30
CPC分类号： H05K1/111 , H05K1/0245 , H05K2201/0187 , H05K2201/0969 , Y02P70/611 , Y10T29/49117 , Y10T29/4913 , Y10T29/49131 , Y10T29/49155 , Y10T29/49165
摘要： The characteristic impedance of a surface pad is manipulated by reticulating the pad and filling the spaces with a dielectric material, providing an inductive element in the coupling of the surface pad to an underlying ground pad of a ground plane, or a combination of these approaches. In appropriate embodiments, acceptable signal trace routing paths will exist in an embedded signal layer under the ground plane and crossing under the surface pad. Other embodiments are also described and claimed.
摘要翻译：表面焊盘的特征阻抗是通过网状网格化和用介电材料填充空间来操作的，在表面焊盘与接地平面的下方接地焊盘的耦合中提供电感元件，或这些方法的组合。在适当的实施例中，可接受的信号迹线路由路径将存在于地平面下方的嵌入式信号层中，并在表面焊盘下交叉。还描述和要求保护其他实施例。

16. 发明授权

US08184450B1 EMI shielded bus bar configuration 有权
标题翻译： EMI屏蔽母线配置
公开(公告)号：US08184450B1
公开(公告)日：2012-05-22
申请号：US12313264
申请日：2008-11-18
申请人： Joel R. Goergen
发明人： Joel R. Goergen
IPC分类号： H05K1/11
CPC分类号： H05K7/1457 , H05K7/20572 , H05K9/002
摘要： A modular packet network device uses bus bars to transfer primary power to either a backplane or directly to one or more cards that perform primary-to-logic-power conversion. The bus bars are fabricated in packages that reduce the transfer of differential and common-mode noise existing in the device chassis into the power delivery system through the bus bars. Other embodiments are also described and claimed.
摘要翻译：模块化分组网络设备使用汇流条将主要功率传送到背板或直接传送到执行主要到逻辑功率转换的一个或多个卡。汇流条采用封装方式制造，可以减少设备机箱中存在的差动和共模噪声通过母线传输到电力输送系统。还描述和要求保护其他实施例。

17. 发明授权

US08119921B1 Impedance tuning for circuit board signal path surface pad structures 有权
标题翻译：电路板信号路径表面焊盘结构的阻抗调整
公开(公告)号：US08119921B1
公开(公告)日：2012-02-21
申请号：US12001941
申请日：2007-12-13
申请人： Joel R. Goergen , Greg Hunt , Peter Tomaszewski , Joseph Pankow , Michael Laudon
发明人： Joel R. Goergen , Greg Hunt , Peter Tomaszewski , Joseph Pankow , Michael Laudon
IPC分类号： H05K1/03
CPC分类号： H05K1/111 , H05K1/0245 , H05K2201/0187 , H05K2201/0969 , Y02P70/611 , Y10T29/49117 , Y10T29/4913 , Y10T29/49131 , Y10T29/49155 , Y10T29/49165
摘要： The characteristic impedance of a surface pad is manipulated by reticulating the pad and filling the spaces with a dielectric material, providing an inductive element in the coupling of the surface pad to an underlying ground pad of a ground plane, or a combination of these approaches. In appropriate embodiments, acceptable signal trace routing paths will exist in an embedded signal layer under the ground plane and crossing under the surface pad. Other embodiments are also described and claimed.
摘要翻译：表面焊盘的特征阻抗是通过网状网格化和用介电材料填充空间来操作的，在表面焊盘与接地平面的下方接地焊盘的耦合中提供电感元件，或这些方法的组合。在适当的实施例中，可接受的信号迹线路由路径将存在于地平面下方的嵌入式信号层中，并在表面焊盘下交叉。还描述和要求保护其他实施例。

18. 发明授权

US06988162B2 High-speed router with single backplane distributing both power and signaling 有权
公开(公告)号：US06988162B2
公开(公告)日：2006-01-17
申请号：US10068418
申请日：2002-02-05
申请人： Joel R. Goergen
发明人： Joel R. Goergen
IPC分类号： G06F13/00
CPC分类号： H05K1/0245 , H04Q1/03 , H04Q1/10 , H04Q1/155 , H04Q2201/12 , H05K3/4641 , H05K7/1459 , H05K2201/044 , H05K2201/09236 , H05K2201/09354 , H05K2201/09636
摘要： A high-speed, high-power modular router is disclosed. As opposed to conventional designs using optical backplane signaling and/or bus bars for power distribution, the disclosed embodiments combine high-power, low-noise power distribution with high-speed signal routing in a common backplane. Disclosed backplane features allow backplane signaling at 2.5 Gbps or greater on electrical differential pairs distributed on multiple high-speed signaling layers. Relatively thick power distribution layers are embedded within the backplane, shielded from the high-speed signaling layers by digital ground layers and other shielding features. A router using such a backplane provides a level of performance and economy that is believed to be unattainable by the prior art.

19. 发明授权

US09455937B2 Distributed packet switch having a wireless control plane 有权
标题翻译：具有无线控制平面的分布式分组交换机
公开(公告)号：US09455937B2
公开(公告)日：2016-09-27
申请号：US12776562
申请日：2010-05-10
申请人： Joel R. Goergen
发明人： Joel R. Goergen
IPC分类号： H04L12/28 , H04L12/56 , H04L12/931 , H04L12/64 , H04W28/02 , H04W28/18
CPC分类号： H04L49/40 , H04L12/64 , H04W28/02 , H04W28/18 , H04W56/00 , H04W72/12
摘要： A packet network device such as a network switch includes a number of functional cards or chassis modules at least some of which are connected to both an electrical backplane and a wireless backplane. The electrical backplane provides data plane signal paths and the wireless backplane provides control plane signal paths.
摘要翻译：诸如网络交换机的分组网络设备包括多个功能卡或机箱模块，其中至少一些连接到电背板和无线背板。电背板提供数据平面信号路径，无线背板提供控制平面信号路径。

20. 发明授权

US08218537B1 Dual signaling format switch fabric with multiplex capability 有权
标题翻译：具有复用能力的双信令格式交换结构
公开(公告)号：US08218537B1
公开(公告)日：2012-07-10
申请号：US12156339
申请日：2008-05-30
申请人： Ann Gui , Krishnamurthy Subramanian , Glenn Poole , Joel R. Goergen , Joanna Lin
发明人： Ann Gui , Krishnamurthy Subramanian , Glenn Poole , Joel R. Goergen , Joanna Lin
IPC分类号： H04L12/56 , H04J1/16
CPC分类号： H04L49/40 , H04L49/101
摘要： A serial channel switch circuit and modular packet switch using the serial channel switch circuits are disclosed. The serial channel switch circuit has a reconfigurable table for internal logical-to-physical channel switch translation. Depending on the slot in which a card containing such a serial channel switch circuit is inserted in the modular packet switch, its serial channel switch circuit may receive a different set of reconfigurable table values that are specific to that location. A global set of logical channel values can be applied to each card, which performs logical-to-physical channel mapping according to its location in the modular packet switch. Other embodiments are also described and claimed.
摘要翻译：公开了使用串行通道切换电路的串行通道切换电路和模块化分组交换机。串行通道切换电路具有用于内部逻辑到物理信道切换转换的可重配置表。根据其中包含这种串行通道切换电路的卡被插入到模块化分组交换机中的插槽，其串行通道切换电路可以接收特定于该位置的不同的一组可重新配置的表值。可以将每个逻辑信道值的全局集合应用于根据其在模块化分组交换机中的位置执行逻辑到物理信道映射的每个卡。还描述和要求保护其他实施例。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式