专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

11. 发明授权

US08916893B2 Light-emitting device 有权
标题翻译：发光装置
公开(公告)号：US08916893B2
公开(公告)日：2014-12-23
申请号：US13192928
申请日：2011-07-28
申请人： Yasunari Ooyabu , Toshitaka Nakamura , Hironaka Fujii , Hisataka Ito
发明人： Yasunari Ooyabu , Toshitaka Nakamura , Hironaka Fujii , Hisataka Ito
IPC分类号： H01L33/00 , H01L33/50 , B82Y30/00 , C04B35/44 , C04B35/645 , C09K11/08 , C09K11/61 , C09K11/77 , H01L33/58
CPC分类号： H01L33/504 , B82Y30/00 , C04B35/44 , C04B35/6455 , C04B2235/3225 , C04B2235/3229 , C04B2235/443 , C04B2235/5445 , C04B2235/5454 , C04B2235/652 , C04B2235/6562 , C04B2235/6581 , C04B2235/6582 , C04B2235/764 , C04B2235/9653 , C04B2235/9661 , C09K11/0883 , C09K11/615 , C09K11/7731 , C09K11/7734 , C09K11/7774 , H01L33/505 , H01L33/507 , H01L33/58 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , Y02B20/181 , H01L2924/00014 , H01L2924/00
摘要： A light-emitting device includes a circuit board to which external electric power is supplied, a light emitting diode that is electrically connected onto the circuit board and emits light based on electric power from the circuit board, a housing provided on the circuit board so as to surround the light emitting diode and so that the upper end portion of the housing is positioned above the upper end portion of the light emitting diode, and a fluorescent laminate provided on the housing. The fluorescent laminate includes a first fluorescent layer that emits fluorescent light and a second fluorescent layer that emits fluorescent light having a wavelength that is longer than that of the first fluorescent layer. The second fluorescent layer is disposed on the housing and the first fluorescent layer is laminated on the second fluorescent layer.
摘要翻译：发光装置包括：供给外部电力的电路基板，电连接到电路基板上的发光二极管，基于来自电路基板的电力发光;电路基板上设置的壳体，以围绕发光二极管，并且使得壳体的上端部分位于发光二极管的上端部分的上方，以及设置在壳体上的荧光层压板。荧光层叠体包括发射荧光的第一荧光层和发射波长比第一荧光层长的荧光的第二荧光层。第二荧光层设置在壳体上，第一荧光层层压在第二荧光层上。

12. 发明授权

US08716733B2 Transfer sheet for phosphor layer and light-emitting device 有权
标题翻译：荧光粉层和发光装置用转印片
公开(公告)号：US08716733B2
公开(公告)日：2014-05-06
申请号：US13167331
申请日：2011-06-23
申请人： Yasunari Ooyabu , Satoshi Sato , Hisataka Ito
发明人： Yasunari Ooyabu , Satoshi Sato , Hisataka Ito
IPC分类号： H01L33/50
CPC分类号： H01L33/505 , H01L2224/48091 , H01L2933/0041 , H05B33/22 , H01L2924/00014
摘要： A transfer sheet for a phosphor layer includes a release substrate, a phosphor layer formed on the release substrate, and an adhesive layer formed on the phosphor layer.
摘要翻译：荧光体层用转印片包括剥离基板，形成在剥离基板上的荧光体层，以及形成在荧光体层上的粘接层。

13. 发明申请

US20120248485A1 PRODUCING METHOD OF LIGHT EMITTING DIODE DEVICE AND LIGHT EMITTING DIODE ELEMENT 有权
标题翻译：发光二极管器件和发光二极管元件的生产方法
公开(公告)号：US20120248485A1
公开(公告)日：2012-10-04
申请号：US13431240
申请日：2012-03-27
申请人： Yuki SHINBORI , Yasunari Ooyabu , Satoshi Sato , Hisataka Ito
发明人： Yuki SHINBORI , Yasunari Ooyabu , Satoshi Sato , Hisataka Ito
IPC分类号： H01L33/40 , H01L33/60
CPC分类号： H01L33/56 , H01L33/505 , H01L33/62 , H01L2224/13 , H01L2933/005
摘要： A method for producing a light emitting diode device includes the steps of preparing a phosphor layer formed in a sheet state; forming a light semiconductor layer on one surface in a thickness direction of the phosphor layer; forming an electrode portion on one surface of the light semiconductor layer; forming an encapsulating resin layer containing a light reflecting component so as to cover the light semiconductor layer and the electrode portion; producing the light emitting diode element by partially removing the encapsulating resin layer so as to expose one surface of the electrode portion; and allowing the electrode portion to be electrically connected to the terminal, so that the light emitting diode element is flip-chip mounted on the base board.
摘要翻译：一种发光二极管器件的制造方法，其特征在于，具有：制作以片状形成的荧光体层的工序; 在所述荧光体层的厚度方向的一个表面上形成光半导体层; 在所述光半导体层的一个表面上形成电极部分; 形成包含光反射部件的封装树脂层，以覆盖所述光半导体层和所述电极部分; 通过部分地去除封装树脂层来制造发光二极管元件，以暴露电极部分的一个表面; 并且允许电极部分电连接到端子，使得发光二极管元件倒装芯片安装在基板上。

14. 发明授权

US08664678B2 Phosphor ceramic and light-emitting device 失效
标题翻译：荧光陶瓷和发光器件
公开(公告)号：US08664678B2
公开(公告)日：2014-03-04
申请号：US13167286
申请日：2011-06-23
申请人： Yasunari Ooyabu , Toshitaka Nakamura , Hironaka Fujii , Hisataka Ito
发明人： Yasunari Ooyabu , Toshitaka Nakamura , Hironaka Fujii , Hisataka Ito
IPC分类号： H01L33/44
CPC分类号： C09K11/7774 , B32B5/16 , B32B9/005 , B32B2250/03 , B32B2250/40 , B32B2262/105 , B32B2264/107 , B32B2307/50 , B32B2307/732 , B32B2457/14 , C04B35/44 , C04B2235/3225 , C04B2235/3229 , C04B2235/764 , C09K11/025 , H01L33/44 , H01L33/505 , H01L33/507 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , Y10T428/263 , H01L2924/00014 , H01L2924/00
摘要： A phosphor ceramic includes at least one fluorescent layer that is capable of emitting fluorescent light; and at least one non-fluorescent layer that does not emit fluorescent light and is laminated onto the fluorescent layer.
摘要翻译：荧光体陶瓷包括能够发射荧光的至少一个荧光层; 以及至少一个不发射荧光并层叠在荧光层上的非荧光层。

15. 发明授权

US08809900B2 Light emitting diode device and producing method thereof 有权
标题翻译：发光二极管装置及其制造方法
公开(公告)号：US08809900B2
公开(公告)日：2014-08-19
申请号：US13429681
申请日：2012-03-26
申请人： Satoshi Sato , Hisataka Ito , Yasunari Ooyabu , Yuki Shinbori
发明人： Satoshi Sato , Hisataka Ito , Yasunari Ooyabu , Yuki Shinbori
IPC分类号： H01L33/00 , H01L21/00 , H01L33/46 , H01L33/60 , H01L33/40
CPC分类号： H01L33/46 , H01L24/17 , H01L33/405 , H01L33/505 , H01L33/60 , H01L2224/16225 , H01L2924/12041 , H01L2924/12042 , H01L2924/15787 , H01L2924/181 , H01L2933/005 , H01L2924/00
摘要： A method for producing a light emitting diode device includes the steps of preparing a base board; allowing a light semiconductor layer where an electrode portion is provided at one side in a thickness direction to be disposed in opposed relation to the base board, and the electrode portion to be electrically connected to a terminal, so that the light semiconductor layer is flip-chip mounted on the base board; forming an encapsulating resin layer containing a light reflecting component at the other side of the base board so as to cover the light semiconductor layer and the electrode portion; removing the other side portion of the encapsulating resin layer so as to expose the light semiconductor layer; and forming a phosphor layer formed in a sheet state so as to be in contact with the other surface of the light semiconductor layer.
摘要翻译：一种发光二极管装置的制造方法，其特征在于，具备准备基板的工序，允许在与厚度方向一侧设置电极部分的光半导体层相对于基板设置，并且电极部分与端子电连接，使得光半导体层被翻转，芯片安装在基板上; 在所述基板的另一侧形成包含光反射部件的封装树脂层，以覆盖所述光半导体层和所述电极部分; 去除封装树脂层的另一侧部分以暴露光半导体层; 以及形成为片状状的荧光体层，以便与所述光半导体层的另一个表面接触。

16. 发明授权

US08796712B2 Phosphor layer and light-emitting device 有权
标题翻译：荧光体层和发光装置
公开(公告)号：US08796712B2
公开(公告)日：2014-08-05
申请号：US13167370
申请日：2011-06-23
申请人： Yasunari Ooyabu , Satoshi Sato , Yuki Shinbori , Shinya Ota , Hisataka Ito
发明人： Yasunari Ooyabu , Satoshi Sato , Yuki Shinbori , Shinya Ota , Hisataka Ito
IPC分类号： H01L33/50
CPC分类号： H01L33/505 , H01L33/501 , H01L2224/48091 , H01L2933/0041 , H01L2933/0091 , H05B33/145 , H01L2924/00014
摘要： A phosphor layer is composed of a resin in which phosphor particles and light scattering particles are dispersed.
摘要翻译：荧光体层由分散有荧光体粒子和光散射粒子的树脂构成。

17. 发明授权

US08314338B2 Wired circuit board and connection structure between wired circuit boards 有权
标题翻译：有线电路板和有线电路板之间的连接结构
公开(公告)号：US08314338B2
公开(公告)日：2012-11-20
申请号：US12219343
申请日：2008-07-21
申请人： Jun Ishii , Yasunari Ooyabu , Takeshi Tanaka , Toshiki Naito
发明人： Jun Ishii , Yasunari Ooyabu , Takeshi Tanaka , Toshiki Naito
IPC分类号： H05K1/03 , H05K1/11 , H05K1/14
CPC分类号： H05K3/363 , H05K1/056 , H05K1/117 , H05K1/142 , H05K2201/058 , H05K2201/09145 , H05K2201/09381 , H05K2203/167
摘要： A wired circuit board includes a first wired circuit board and a second wired circuit board disposed to be opposed to the first wired circuit board in the same plane. A first opposed surface of the first wired circuit board facing the second wired circuit board and a second opposed surface of the second wired circuit board facing the first wired circuit board include at least two types of interfitting surfaces extending in different directions so as to mutually interfit the first opposed surface with the second opposed surface.
摘要翻译：布线电路板包括第一布线电路板和布置成与同一平面中的第一布线电路板相对的第二布线电路板。面向第二布线电路板的第一布线电路板的第一相对表面和面对第一布线电路板的第二布线电路板的第二相对表面包括沿不同方向延伸的至少两种类型的配合表面，以便相互配合具有第二相对表面的第一相对表面。

18. 发明授权

US08723167B2 Reflecting material and light emitting diode device 有权
标题翻译：反射材料和发光二极管装置
公开(公告)号：US08723167B2
公开(公告)日：2014-05-13
申请号：US13484399
申请日：2012-05-31
申请人： Satoshi Sato , Hisataka Ito , Yasunari Ooyabu , Yuki Shinbori
发明人： Satoshi Sato , Hisataka Ito , Yasunari Ooyabu , Yuki Shinbori
IPC分类号： H01L35/24
CPC分类号： H01L33/60 , H01L24/97 , H01L33/0095 , H01L2224/16225 , H01L2924/12041 , H01L2924/12042 , H01L2924/15787 , H01L2924/181 , H01L2933/0058 , H01L2924/00 , H01L2924/00012
摘要： A reflecting material contains a silicone resin composition prepared from a polysiloxane containing silanol groups at both ends, an ethylenic silicon compound, a silicon compound containing an epoxy group, an organohydrogenpolysiloxane, a condensation catalyst, and an addition catalyst; and a light reflecting component.
摘要翻译：反射材料含有由两端含有硅烷醇基的聚硅氧烷，乙烯基硅化合物，含有环氧基的硅化合物，有机氢聚硅氧烷，缩合催化剂和加成催化剂制备的有机硅树脂组合物; 和光反射部件。

19. 发明授权

US08233287B2 Ground vias for enhanced preamp heat release in hard disk drives 有权
标题翻译：用于硬盘驱动器中增强前置放热释放的通孔
公开(公告)号：US08233287B2
公开(公告)日：2012-07-31
申请号：US12024857
申请日：2008-02-01
申请人： Alex Cayaban , Szu-Han Hu , Yasunari Ooyabu , Martin John McCaslin
发明人： Alex Cayaban , Szu-Han Hu , Yasunari Ooyabu , Martin John McCaslin
IPC分类号： H05K7/10
CPC分类号： G11B33/1426 , G11B33/123 , H05K1/0206 , H05K1/056 , H05K1/189 , H05K2201/09509 , H05K2201/09554
摘要： Described is a preamp flex cable for use in a hard drive. The flex cable incorporates a stiffener layer operable to provide a mechanical support, an insulating layer provided over the stiffener layer and having at least one via provided therein to expose the stiffener layer, and at least one conductive layer provided over the insulating layer. The at least one conductive layer forms an electrical circuit and at least one heat removing element that extends through the via and establishes a contact with the stiffener layer. In one implementation, the heat removing element includes a rectangular plate having a recessed center portion and an edge portion. The recessed center portion protrudes through the at least one via in the insulating layer to mechanically couple with the stiffener. In another implementation, the heat removing element includes first portion and second rectangular portions. The first portion protrudes through the at least one via in the insulating layer to thermally couple with the stiffener and the second portion is disposed over the insulating layer, such that the second portion can be thermally coupled to the preamp.
摘要翻译：描述了一种用于硬盘驱动器的前置放大器柔性电缆。柔性电缆包括可操作以提供机械支撑件的加强层，设置在加强层上的绝缘层，并且具有设置在其中的至少一个通孔以露出加强层，以及设置在绝缘层上的至少一个导电层。所述至少一个导电层形成电路和至少一个散热元件，其延伸穿过所述通孔并与所述加强层建立接触。在一个实施方式中，除热元件包括具有凹入的中心部分和边缘部分的矩形板。凹陷的中心部分穿过绝缘层中的至少一个通孔突出以与加强件机械地联接。在另一实施方式中，除热元件包括第一部分和第二矩形部分。第一部分穿过绝缘层中的至少一个通孔突出，以与加强件热耦合，并且第二部分设置在绝缘层上方，使得第二部分可以热耦合到前置放大器。

20. 发明授权

US08164002B2 Wired circuit board and producing method thereof 失效
标题翻译：有线电路板及其制造方法
公开(公告)号：US08164002B2
公开(公告)日：2012-04-24
申请号：US12004038
申请日：2007-12-20
申请人： Jun Ishii , Yasunari Ooyabu
发明人： Jun Ishii , Yasunari Ooyabu
IPC分类号： H05K1/03
CPC分类号： H05K1/0259 , G11B5/486 , H05K1/056 , H05K1/167 , H05K3/28 , H05K2201/0329
摘要： A wired circuit board includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, a first semiconductive layer formed on a surface of the insulating base layer exposed from the conductive pattern, an insulating cover layer formed on the conductive pattern and the first semiconductive layer and a second semiconductive layer formed on a surface of the insulating cover layer. The first semiconductive layer is electrically connected to the conductive pattern and the metal supporting board, and the second semiconductive layer is electrically connected to the metal supporting board.
摘要翻译：布线电路板包括金属支撑板，形成在金属支撑板上的绝缘基底层，形成在绝缘基底层上的导电图案，形成在从导电图案露出的绝缘基底层的表面上的第一半导体层，形成在导电图案和第一半导体层上的绝缘覆盖层和形成在绝缘覆盖层的表面上的第二半导体层。第一半导电层电连接到导电图案和金属支撑板，并且第二半导体层电连接到金属支撑板。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式