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    • 14. 发明申请
    • MEMORY CELL HAVING IMPROVED READ STABILITY
    • 具有改进的读取稳定性的存储单元
    • US20060146638A1
    • 2006-07-06
    • US11069018
    • 2005-02-28
    • Leland ChangRobert DennardRobert Kevin Montoye
    • Leland ChangRobert DennardRobert Kevin Montoye
    • G11C8/00
    • G11C11/413H01L27/11H01L27/1104
    • A memory cell for use in a memory array includes a storage element for storing a logical state of the memory cell, a write circuit and a read circuit. The write circuit is operative to selectively connect a first node of the storage element to at least a first write bit line in the memory array in response to a write signal for selectively writing the logical state of the memory cell. The read circuit includes a substantially high impedance input node connected to the storage element and an output node connectable to a read bit line of the memory array. The read circuit is configured to generate an output signal at the output node which is representative of the logical state of the storage element in response to a read signal applied to the read circuit. The memory cell is configured such that the write circuit is disabled during a read operation of the memory cell so as to substantially isolate the storage element from the first write bit line during the read operation. A strength of at least one transistor device in the storage element is separately optimized relative to a strength of at least one transistor device in the write circuit and/or the read circuit.
    • 用于存储器阵列的存储单元包括用于存储存储单元的逻辑状态的存储元件,写入电路和读取电路。 写入电路用于响应于用于选择性地写入存储器单元的逻辑状态的写入信号,有选择地将存储元件的第一节点连接到存储器阵列中的至少第一写入位线。 读取电路包括连接到存储元件的基本上高阻抗的输入节点和可连接到存储器阵列的读取位线的输出节点。 读取电路被配置为响应于施加到读取电路的读取信号而在输出节点处产生代表存储元件的逻辑状态的输出信号。 存储单元被配置为使得在存储单元的读取操作期间禁止写入电路,以便在读取操作期间基本上将存储元件与第一写入位线隔离。 存储元件中的至少一个晶体管器件的强度相对于写入电路和/或读取电路中的至少一个晶体管器件的强度分别优化。
    • 16. 发明申请
    • Threshold voltage roll-off compensation using back-gated mosfet devices for system high-performance and low standby power
    • 使用后门控mosfet器件进行系统高性能和低待机功耗的阈值电压滚降补偿
    • US20050204319A1
    • 2005-09-15
    • US10796805
    • 2004-03-09
    • Hussein HanafiRobert DennardWilfried Haensch
    • Hussein HanafiRobert DennardWilfried Haensch
    • G06F17/50
    • H03K19/0013
    • A method for compensating the threshold voltage roll-off using transistors containing back-gates or body nodes is provided. The method includes designing a semiconductor system or chip having a plurality of transistors with a channel length of Lnom. For the present invention, it is assumed that the channel length of these transistors at the completion of chip manufacturing is Lmax. This enables one to set the off-current to the maximum value of I-offmax which is done by setting the threshold voltage value to Vtmin. The Vtmin for these transistors is obtained during processing by using the proper implant dose. After manufacturing, the transistors are then tested to determine the off-current thereof. Some transistors within the system or chip will have an off-current value that meets a current specification. For those transistor devices, no further compensation is required. For other transistors within the system or chip, the off-current is not within the predetermined specification. For those transistors, threshold voltage roll-off has occurred since they are transistors that have a channel length that is less than nominal. For such short channel transistors, the threshold voltage is low, even lower than Vtmin, and the off-current is high, even higher than I-offmax. Compensation of the short channel transistors is achieved in the present invention by biasing the back-gate or body node to give increased threshold voltage about equal to Vtmin and hence an off-current that meets the predetermined specification, which is about equal to I-offmax.
    • 提供了使用包含背栅或体节点的晶体管补偿阈值电压滚降的方法。 该方法包括设计具有通道长度为L nom的多个晶体管的半导体系统或芯片。 对于本发明,假设在芯片制造完成时这些晶体管的沟道长度为L max max。 这使得能够将截止电流设置为通过将阈值电压值设置为Vt分钟来完成的I-OFF 的最大值。 通过使用适当的植入剂量,在处理期间获得这些晶体管的Vt 。 在制造之后,然后测试晶体管以确定其截止电流。 系统或芯片内的一些晶体管将具有满足当前规范的截止值。 对于那些晶体管器件,不需要进一步的补偿。 对于系统或芯片内的其他晶体管,截止电流不在预定的规范内。 对于那些晶体管,已经发生阈值电压滚降,因为它们是具有小于额定值的沟道长度的晶体管。 对于这种短沟道晶体管,阈值电压低,甚至低于Vt分钟<! - SIPO - >,并且截止电流高,甚至高于I-off最大值。 在本发明中通过偏置背栅极或体节点以提供大约等于Vt分钟的阈值电压,从而达到满足预定规格的截止电流来实现短沟道晶体管的补偿, 其大约等于I-off最大
    • 17. 发明申请
    • Substrate solution for back gate controlled SRAM with coexisting logic devices
    • 用于具有共存逻辑器件的背栅控制SRAM的衬底解决方案
    • US20070138533A1
    • 2007-06-21
    • US11311462
    • 2005-12-19
    • Robert DennardWilfried HaenschArvind KumarRobert Miller
    • Robert DennardWilfried HaenschArvind KumarRobert Miller
    • H01L29/76
    • H01L27/1108
    • A semiconductor structure that includes at least one logic device region and at least one static random access memory (SRAM) device region wherein each device region includes a double gated field effect transistor (FET) wherein the back gate of each of the FET devices is doped to a specific level so as to improve the performance of the FET devices within the different device regions is provided. In particular, the back gate within the SRAM device region is more heavily doped than the back gate within the logic device region. In order to control short channel effects, the FET device within the logic device region includes a doped channel, while the FET device within the SRAM device region does not. A none uniform lateral doping profile with a low net doping beneath the source/drain regions and a high net doping underneath the channel would provide additional SCE control for the logic device
    • 一种半导体结构,其包括至少一个逻辑器件区域和至少一个静态随机存取存储器(SRAM)器件区域,其中每个器件区域包括双门控场效应晶体管(FET),其中每个FET器件的背栅极掺杂 提供了特定的水平,以提高不同器件区域内的FET器件的性能。 特别地,SRAM器件区域内的背栅极比逻辑器件区域内的后栅极重掺杂。 为了控制短沟道效应,逻辑器件区域内的FET器件包括掺杂沟道,而SRAM器件区域内的FET器件不是。 在源极/漏极区域之下具有低净掺杂的无均匀横向掺杂分布以及在沟道下方的高净掺杂将为逻辑器件提供附加的SCE控制