会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 14. 发明申请
    • Fabrication process for magnetoresistive devices of the CPP type
    • CPP型磁阻器件的制造工艺
    • US20100124617A1
    • 2010-05-20
    • US12292566
    • 2008-11-20
    • Hironobu MatsuzawaTsutomu ChouYoshihiro TsuchiyaShinji Hara
    • Hironobu MatsuzawaTsutomu ChouYoshihiro TsuchiyaShinji Hara
    • B05D5/12
    • G11B5/3163B82Y25/00B82Y40/00G01R33/098G11B5/3906H01F10/3254H01F41/307H01L43/12
    • The inventive fabrication process for magnetoresistive devices (CPP-GMR devices) involves the formation of a zinc oxide or ZnO layer that provides the intermediate layer of a spacer layer, comprising Zn film formation operation for forming a zinc or Zn layer and Zn film oxidization operation for oxidizing the zinc film after the Zn film formation operation. The Zn film formation operation is implemented such that after a multilayer substrate having a multilayer structure before the formation of the Zn film is cooled down to the temperature range of −140° C. to −60° C., the formation of the Zn film is set off, and the Zn film oxidization operation is implemented such that after the completion of the Zn film oxidization operation, oxidization treatment is set off at the substrate temperature range of −120° C. to −40° C. Thus, excelling in both flatness and crystallizability, the ZnO layer makes sure the device has high MR ratios, and can further have an area resistivity AR best suited for the device.
    • 用于磁阻器件(CPP-GMR器件)的本发明制造方法涉及形成提供间隔层的中间层的氧化锌或ZnO层,其包括用于形成锌或Zn层的Zn膜形成操作和Zn膜氧化操作 用于在Zn膜形成操作之后氧化锌膜。 实施Zn膜形成操作,使得在形成Zn膜之前具有多层结构的多层基板被冷却至-140℃至-60℃的温度范围,形成Zn膜 并且进行Zn膜氧化操作,使得在Zn膜氧化操作完成之后,在-120℃至-40℃的衬底温度范围内,氧化处理被降低。因此,优异的 平坦度和结晶性,ZnO层确保器件具有高MR比,并且还可以具有最适合于器件的面积电阻率AR。
    • 17. 发明授权
    • Fabrication process for magnetoresistive devices of the CPP type
    • CPP型磁阻器件的制造工艺
    • US08029853B2
    • 2011-10-04
    • US12292566
    • 2008-11-20
    • Hironobu MatsuzawaTsutomu ChouYoshihiro TsuchiyaShinji Hara
    • Hironobu MatsuzawaTsutomu ChouYoshihiro TsuchiyaShinji Hara
    • B05D5/12
    • G11B5/3163B82Y25/00B82Y40/00G01R33/098G11B5/3906H01F10/3254H01F41/307H01L43/12
    • The inventive fabrication process for magnetoresistive devices (CPP-GMR devices) involves the formation of a zinc oxide or ZnO layer that provides the intermediate layer of a spacer layer, comprising Zn film formation operation for forming a zinc or Zn layer and Zn film oxidization operation for oxidizing the zinc film after the Zn film formation operation. The Zn film formation operation is implemented such that after a multilayer substrate having a multilayer structure before the formation of the Zn film is cooled down to the temperature range of −140° C. to −60° C., the formation of the Zn film is set off, and the Zn film oxidization operation is implemented such that after the completion of the Zn film oxidization operation, oxidization treatment is set off at the substrate temperature range of −120° C. to −40° C. Thus, excelling in both flatness and crystallizability, the ZnO layer makes sure the device has high MR ratios, and can further have an area resistivity AR best suited for the device.
    • 用于磁阻器件(CPP-GMR器件)的本发明制造方法涉及形成提供间隔层的中间层的氧化锌或ZnO层,其包括用于形成锌或Zn层的Zn膜形成操作和Zn膜氧化操作 用于在Zn膜形成操作之后氧化锌膜。 实施Zn膜形成操作,使得在形成Zn膜之前具有多层结构的多层基板被冷却至-140℃至-60℃的温度范围,形成Zn膜 并且进行Zn膜氧化操作,使得在Zn膜氧化操作完成之后,在-120℃至-40℃的衬底温度范围内,氧化处理被降低。因此,优异的 平坦度和结晶性,ZnO层确保器件具有高MR比,并且还可以具有最适合于器件的面积电阻率AR。