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    • 11. 发明申请
    • Heat conductive silicone composition
    • 导热硅胶组合物
    • US20060270788A1
    • 2006-11-30
    • US11439277
    • 2006-05-24
    • Toshiyuki OzaiNaoki Yamakawa
    • Toshiyuki OzaiNaoki Yamakawa
    • C08G59/40
    • C08L83/04C08G77/045C08G77/12C08G77/14C08G77/18C08G77/20C08L83/00
    • A heat conductive silicone composition is provided, which includes (A) an organopolysiloxane having the formula (1): {(CH2═CH)R12SiO1/2}L(R1SiO3/2)m(R12SiO)n{O1/2SiR12—R2—SiR1(3-a)(OR3)a}o  (1) wherein R1 represents monovalent hydrocarbon groups, R2 represents an oxygen atom or a bivalent hydrocarbon group, R3 represents an alkyl group, alkoxyalkyl group, alkenyl group, or acyl group, L and o represent numbers from 1 to 10, m represents a number from 0 to 10, n represents a number from 5 to 100, a represents an integer from 1 to 3, and when m=0, L+o=2 and R2 is a bivalent hydrocarbon group, (B) a heat conductive filler, and (C) an organopolysiloxane other than the component (A). Even upon high-level packing with the heat conductive filler to obtain a highly heat conductivity, the composition still exhibits favorable handling and moldability properties
    • 提供了一种导热硅氧烷组合物,其包括(A)具有式(1)的有机聚硅氧烷:<?in-line-formula description =“In-line formula”end =“lead”?> {(CH < 2 - - - - - - - - - - - - - - - - - - - - - - - - (1) 1 SiO 2/2/2)SiO 2(R 1)2 SiO 2)n < / O 2 1/2 SiR 1 - 2 - - - - - - - - - - - - - - - - - - - - - (3-a)(或<3>)(1)<? -formulae description =“In-line Formulas”end =“tail”?>其中R 1表示一价烃基,R 2表示氧原子或二价烃基 R 3表示烷基,烷氧基烷基,烯基或酰基,L和o表示1〜10的数,m表示0〜10的数,n表示5以上的数 至100时,a表示1〜3的整数,当m = 0时,L + o = 2,R 2为二价烃基,(B) 导电填料,(C)除(A)成分以外的有机聚硅氧烷。 即使使用导热填料进行高级包装以获得高导热性,组合物仍然表现出良好的处理和成型性能
    • 12. 发明授权
    • Organosilicon compound
    • 有机硅化合物
    • US07045572B2
    • 2006-05-16
    • US11015024
    • 2004-12-20
    • Toshiyuki OzaiHiroyasu HaraYoshifumi InoueTomoyuki Goto
    • Toshiyuki OzaiHiroyasu HaraYoshifumi InoueTomoyuki Goto
    • C08G77/06
    • C07F7/1804
    • An organosilicon compound represented by the following general formula (1): wherein R1 is a hydrogen atom, a phenyl group or a halogenated phenyl group; R2 is a hydrogen atom or a methyl group; R3's are each a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms; X is a hydrolyzable group; Z1 is —R4—, —R4O— or —R4(CH3)2SiO—, where R4 is a substituted or unsubstituted divalent hydrocarbon group having 1 to 10 carbon atoms; Z2 is an oxygen atom or a substituted or unsubstituted divalent hydrocarbon group having 1 to 10 carbon atoms; and m is 0, 1 or 2 and n is 0, 1 or 2. When incorporated in silicone compositions, the organosilicon compound acts as a cross-linking agent having well-balanced photopolymerizability and condensation curability.
    • 由以下通式(1)表示的有机硅化合物:其中R 1是氢原子,苯基或卤代苯基; R 2是氢原子或甲基; R 3各自为取代或未取代的碳原子数为1〜10的一价烃基; X是可水解基团; Z 1是-R 4 - , - R 4 O-或-R 4(CH 3) 3 SiO 2,其中R 4是取代或未取代的具有1至10个碳原子的二价烃基; Z 2是氧原子或取代或未取代的碳原子数为1〜10的二价烃基; 并且m为0,1或2,n为0,1或2.当掺入有机硅组合物中时,有机硅化合物用作具有良好平衡光聚合性和缩合固化性的交联剂。
    • 14. 发明申请
    • SILICONE ADHESIVE FOR SEMICONDUCTOR ELEMENT
    • 硅胶用于半导体元件
    • US20090258216A1
    • 2009-10-15
    • US12421876
    • 2009-04-10
    • Naoki YAMAKAWAKei MiyoshiToshiyuki OzaiYoshinori Ogawa
    • Naoki YAMAKAWAKei MiyoshiToshiyuki OzaiYoshinori Ogawa
    • B32B7/12C09J183/00C09J183/06
    • H01L33/56C09J183/14
    • A silicone adhesive for a semiconductor element that is suitable as a die bonding material for fixing a light emitting diode chip to a substrate. The adhesive includes (a) an addition reaction-curable silicone resin composition having a viscosity at 25° C. of not more than 100 Pa·s, and yielding a cured product upon heating at 150° C. for 3 hours that has a type D hardness prescribed in JIS K6253 of at least 30, (b) a white pigment powder having an average particle size of less than 1 μm, and (c) a white or colorless and transparent powder having an average particle size of at least 1 μm but less than 10 μm. The adhesive exhibits high levels of concealment, effectively reflects light emitted from the LED chip, and also exhibits favorable chip positioning properties, superior adhesive strength, and excellent durability.
    • 一种用于半导体元件的硅粘合剂,其适合作为用于将发光二极管芯片固定到基板的芯片接合材料。 粘合剂包括(a)在25℃下的粘度不大于100Pa.s的加成反应固化性有机硅树脂组合物,并且在150℃加热3小时时产生固化产物,其具有类型 JIS K6253规定的D硬度为30以上,(b)平均粒径小于1μm的白色颜料粉末,(c)平均粒径为1μm以上的白色或无色透明粉末 但少于10个妈妈。 粘合剂显示出高水平的隐蔽性,有效地反映了从LED芯片发出的光,并且还显示出有利的芯片定位性能,优异的粘合强度和优异的耐久性。
    • 17. 发明授权
    • Organosilicon compound
    • 有机硅化合物
    • US06849755B2
    • 2005-02-01
    • US09983933
    • 2001-10-26
    • Toshiyuki OzaiHiroyasu HaraYoshifumi InoueTomoyuki Goto
    • Toshiyuki OzaiHiroyasu HaraYoshifumi InoueTomoyuki Goto
    • C07F7/08C07F7/18C07F7/04
    • C07F7/1804
    • An organosilicon compound represented by the following general formula (1): wherein R1 is a hydrogen atom, a phenyl group or a halogenated phenyl group; R2 is a hydrogen atom or a methyl group; R3's are each a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms; X is a hydrolyzable group; Z1 is —R4—, —R4O— or —R4(CH3)2SiO—, where R4 is a substituted or unsubstituted divalent hydrocarbon group having 1 to 10 carbon atoms; Z2 is an oxygen atom or a substituted or unsubstituted divalent hydrocarbon group having 1 to 10 carbon atoms; and m is 0, 1 or 2 and n is 0, 1 or 2. When incorporated in silicone compositions, the organosilicon compound acts as a cross-linking agent having well-balanced photopolymerizability and condensation curability.
    • 由以下通式(1)表示的有机硅化合物:其中R 1是氢原子,苯基或卤代苯基; R 2是氢原子或甲基; R 3各自为取代或未取代的碳原子数为1〜10的一价烃基; X是可水解基团; Z 1是-R 4 - ,-R 4 O-或-R 4(CH 3)2 SiO - ,其中R 4是具有1至10个碳原子的取代或未取代的二价烃基 ; Z 2是氧原子或具有1〜10个碳原子的取代或未取代的二价烃基; 并且m为0,1或2,n为0,1或2.当掺入有机硅组合物中时,有机硅化合物充当具有良好平衡的光聚合性和冷凝固化性的交联剂。
    • 18. 发明授权
    • Method for reducing a surface glossiness of an organopolysiloxane-cured article
    • 降低有机聚硅氧烷固化物的表面光泽度的方法
    • US08142698B2
    • 2012-03-27
    • US12956989
    • 2010-11-30
    • Toshiyuki OzaiMitsuhiro Iwata
    • Toshiyuki OzaiMitsuhiro Iwata
    • B29C47/00B28B1/14
    • C08L83/04C08G77/12C08G77/20C08K7/22Y10T428/24372Y10T428/24421Y10T428/31663C08L83/00
    • A method of reducing a surface glossiness of an organopolysiloxane-cured article is provided. The method comprises preparing the liquid organopolysiloxane composition for matting comprising: (A) 100 parts by weight of a thermosetting liquid organopolysiloxane composition having a specific gravity larger than the component (B), and (B) 0.1 to 100 parts by weight of a hollow filler having a melting point of at least 150° C., and a particle size of up to 200 μm, casting the liquid organopolysiloxane composition as a potting material or coating material; and curing the liquid organopolysiloxane composition at a temperature of 10 to 160 C for 30 to 180 minutes, whereby the hollow filler floats to the surface of the organopolysiloxane and forms surface irregularities on the surface of the cured article during curing to provide a surface glossiness of up to 40 in a cured article having a matted surface.
    • 提供了降低有机聚硅氧烷固化物的表面光泽度的方法。 该方法包括制备用于消光的液体有机基聚硅氧烷组合物,其包括:(A)100重量份比重大于组分(B)的热固性液体有机基聚硅氧烷组合物,和(B)0.1至100重量份的中空 填料的熔点至少为150℃,粒径可达200​​μm,将液体有机基聚硅氧烷组合物浇铸成灌封材料或涂料; 并在10至160℃的温度下固化液体有机基聚硅氧烷组合物30至180分钟,由此中空填料漂浮到有机聚硅氧烷的表面,并在固化期间在固化物的表面上形成表面凹凸,以提供表面光泽度 在具有无光表面的固化制品中至多40个。