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11. 发明授权

US06919777B2 Surface acoustic wave filter device 有权
标题翻译：表面声波滤波装置
公开(公告)号：US06919777B2
公开(公告)日：2005-07-19
申请号：US10111003
申请日：2001-08-15
申请人： Norio Taniguchi , Toshiaki Takata , Mitsuo Takeda
发明人： Norio Taniguchi , Toshiaki Takata , Mitsuo Takeda
IPC分类号： H03H9/25 , H03H9/05 , H03H9/10 , H03H9/64 , H03H9/72
CPC分类号： H03H9/1071 , H01L2224/16225 , H01L2924/16195 , H03H9/0557 , H03H9/059 , H03H9/6483
摘要： A surface acoustic wave filter device includes a surface acoustic wave filter element having a ladder type circuit electrically connected and mechanically fixed to a package by a face down mounting method. A micro-strip line connected to series arm resonator and/or a parallel arm resonator is provided inside the package, whereby excellent filter characteristics are provided by the addition of the inductance component thereof.
摘要翻译：表面声波滤波器装置包括具有梯形电路的表面声波滤波器元件，该梯形电路通过面朝下安装方法电连接并机械地固定到封装。连接到串联臂谐振器和/或并联臂谐振器的微带线设置在封装内部，由此通过添加其电感分量来提供优异的滤波器特性。

12. 发明授权

US06815834B2 Electronic part 失效
标题翻译：电子部件
公开(公告)号：US06815834B2
公开(公告)日：2004-11-09
申请号：US10240513
申请日：2003-04-22
申请人： Kazunobu Shimoe , Mitsuo Takeda , Toshiaki Takata , Norihiko Takada
发明人： Kazunobu Shimoe , Mitsuo Takeda , Toshiaki Takata , Norihiko Takada
IPC分类号： H01L2348
CPC分类号： H03H9/059 , H01L24/81 , H01L2224/05573 , H01L2224/05624 , H01L2224/05655 , H01L2224/05666 , H01L2224/13144 , H01L2224/16 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01012 , H01L2924/01013 , H01L2924/01033 , H01L2924/01057 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/00014
摘要： An electronic component includes an electronic element and a substrate to which the electronic element is mounted, the electronic element and the substrate being electrically or mechanically connected to each other by at least three bumps. Both the value obtained by dividing the total bonding-area of the bumps bonded to the electronic element by the mass of the electronic element and the value obtained by dividing the total bonding-area of the bumps bonded to the substrate by the mass of the electronic element are at least about 8.8 mm2/g.
摘要翻译：电子部件包括电子元件和安装有电子元件的基板，电子元件和基板通过至少三个凸块彼此电或机械地连接。将与电子元件接合的凸点的总接合面积除以电子元件的质量所得到的值和通过将与基板接合的凸块的总接合面积除以电子元件的质量而得到的值元素为至少约8.8mm 2 / g。

13. 发明授权

US5747632A Polycarbonate resin with high flowability and process for producing the same 失效
标题翻译：具有高流动性的聚碳酸酯树脂及其制造方法
公开(公告)号：US5747632A
公开(公告)日：1998-05-05
申请号：US744315
申请日：1996-11-07
申请人： Takahiro Adachi , Toshiaki Takata
发明人： Takahiro Adachi , Toshiaki Takata
IPC分类号： C08G64/24 , C08G64/00
CPC分类号： C08G64/24
摘要： Disclosed are a polycarbonate resin with high flowability having a viscosity average molecular weight (Mv) of 13,000 to 20,000 and containing below 1% by weight of low molecular weight carbonate compounds having the range of molecular weight 1,000 or below and at least 10% by weight of a polycarbonate oligomer having the range of molecular weight 2,000 to 5,000 and a process for producing the same.
摘要翻译：公开了具有粘度平均分子量（Mv）为13000至20,000并且含有低于1重量％的分子量为1,000以下且至少10重量％的低分子量碳酸酯化合物的高流动性的聚碳酸酯树脂的分子量为2,000〜5000的聚碳酸酯低聚物及其制造方法。

14. 发明授权

US5273685A Thermoplastic resin composition 失效
公开(公告)号：US5273685A
公开(公告)日：1993-12-28
申请号：US838676
申请日：1992-02-21
申请人： Toshiaki Takata , Tadami Kinugawa , Hideo Otaki
发明人： Toshiaki Takata , Tadami Kinugawa , Hideo Otaki
IPC分类号： C08K3/04 , C08L69/00 , C08L83/10
CPC分类号： C08L69/00 , C08K3/04 , C08L83/10
摘要： A thermoplastic resin composition comprising (a) 100 parts by weight of thermoplastic copolycarbonate comprising 0.1 to 50% by weight of structural unit of the following general formula (1) and 99.9 to 50% by weight of structural unit of the following general formula (2): ##STR1## and (b) 0.1 to 30 parts by weight of electroconductive carbon black can produce a molding product having good mechanical properties and surface smoothness with good moldability.

15. 发明授权

US06557225B2 Method of producing surface acoustic wave device 有权
标题翻译：制造表面声波装置的方法
公开(公告)号：US06557225B2
公开(公告)日：2003-05-06
申请号：US09833396
申请日：2001-04-12
申请人： Toshiaki Takata , Shuji Yamato , Norihiko Takada
发明人： Toshiaki Takata , Shuji Yamato , Norihiko Takada
IPC分类号： H04R1700
CPC分类号： H03H9/6483 , H03H3/10 , H03H9/02921 , H04R7/045 , Y10T29/42 , Y10T29/49004 , Y10T29/49005 , Y10T29/49155 , Y10T29/49156 , Y10T29/49158 , Y10T29/49176
摘要： A method of producing a surface acoustic wave device by use of a flip chip process, includes the steps of forming on a piezoelectric substrate at least one interdigital transducer and a plurality of electrode pads electrically connected to the interdigital transducer, forming bumps on the respective electrode pads, and providing an insulating film at a region other than a region where the bumps are formed.
摘要翻译：一种使用倒装芯片工艺制造表面声波装置的方法包括以下步骤：在压电基板上形成至少一个叉指式换能器和电连接到叉指式换能器的多个电极垫，在相应电极上形成凸块垫，并且在除了形成凸块的区域之外的区域提供绝缘膜。

16. 发明授权

US06404101B1 Surface acoustic wave device 有权
标题翻译：表面声波装置
公开(公告)号：US06404101B1
公开(公告)日：2002-06-11
申请号：US09953720
申请日：2001-09-17
申请人： Norio Taniguchi , Toshiaki Takata , Tatsurou Nagai , Shuji Yamato
发明人： Norio Taniguchi , Toshiaki Takata , Tatsurou Nagai , Shuji Yamato
IPC分类号： H01L4104
CPC分类号： H03H9/6436 , H03H9/0222 , H03H9/14538 , H03H9/25 , H03H9/6483
摘要： A surface acoustic wave device is arranged such that surface acoustic wave energy is trapped substantially perpendicularly to the surface acoustic wave propagation direction. At least one interdigital transducer having a plurality of electrode fingers and first and second bus bar electrodes is located on a piezoelectric substrate on which a surface acoustic wave is excited, and has an anisotropy index &ggr; of less than about −1 in the propagation direction. The electrode fingers each have a film thickness of not less than about 0.04 &lgr; in which &lgr; is the wavelength of the surface acoustic wave. At least a portion of the first and second bus bar electrodes have a thickness that is larger than that of each electrode finger.
摘要翻译：表面声波装置被布置成使得表面声波能量基本上垂直于声表面波传播方向被捕获。具有多个电极指和第一和第二汇流条电极的至少一个叉指换能器位于其上激励表面声波并且在传播方向上具有小于约-1的各向异性指数γ的压电基板上。电极指各自具有不小于约0.04兰姆的膜厚度，其中羔羊是表面声波的波长。第一和第二汇流条电极的至少一部分的厚度大于每个电极指的厚度。

17. 发明授权

US5324454A Conductive copolycarbonate-siloxane compositions 失效
标题翻译：导电共聚碳酸酯 - 硅氧烷组合物
公开(公告)号：US5324454A
公开(公告)日：1994-06-28
申请号：US128157
申请日：1993-09-29
申请人： Toshiaki Takata , Tadami Kinugawa , Hideo Otaki
发明人： Toshiaki Takata , Tadami Kinugawa , Hideo Otaki
IPC分类号： C08K3/04 , C08L69/00 , C08L83/10
CPC分类号： C08L69/00 , C08K3/04 , C08L83/10
摘要： A thermoplastic resin composition comprising (a) 100 parts by weight of thermoplastic copolycarbonate comprising 0.1 to 50% by weight of structural unit of the following general formula (1) and 99.9 to 50% by weight of structural unit of the following general formula (2): ##STR1## and (b) 0.1 to 30 parts by weight of electroconductive carbon black can produce a molding product having good mechanical properties and surface smoothness with good moldability and (c) a polyester or styrenic resin.
摘要翻译：一种热塑性树脂组合物，其包含（a）100重量份的包含0.1至50重量％的下列通式（1）的结构单元和99.9至50重量％的下列通式（2）的结构单元的热塑性共聚碳酸酯）（1）＆lt; IMAGE＆gt;（2）和（b）0.1〜30重量份的导电炭黑可以制造具有良好的机械性能和表面光滑性以及良好成型性的成型品，（c）聚酯或苯乙烯树脂

18. 发明授权

US08222973B2 Elastic wave resonator, ladder filter and duplexer 有权
标题翻译：弹性波谐振器，梯形滤波器和双工器
公开(公告)号：US08222973B2
公开(公告)日：2012-07-17
申请号：US13306012
申请日：2011-11-29
申请人： Toshiaki Takata
发明人： Toshiaki Takata
IPC分类号： H03H9/64 , H03H9/72 , H03H9/25
CPC分类号： H03H9/0222 , H03H9/02929 , H03H9/02944 , H03H9/02992 , H03H9/1452 , H03H9/14573
摘要： An acoustic wave resonator that is excellent in terms of return loss characteristics at the resonant and anti-resonant frequencies and that is capable of effectively reducing loss includes an IDT electrode in which a plurality of first electrode fingers and a plurality of second dummy electrode fingers are connected to a first common electrode, a plurality of second electrode fingers and a plurality of first dummy electrode fingers are connected to a second common electrode. Apodization weighting is applied in the acoustic wave propagation direction. The metallization ratio of a non-crossing region is relatively high compared with the metallization ratio of a crossing region in the acoustic wave propagation direction.
摘要翻译：在谐振和反谐振频率方面具有优异的回波损耗特性并且能够有效减少损耗的声波谐振器包括：多个第一电极指和多个第二虚拟电极指的IDT电极连接到第一公共电极，多个第二电极指和多个第一虚拟电极指连接到第二公共电极。在声波传播方向上应用变迹加权。非交叉区域的金属化率相对于声波传播方向上的交叉区域的金属化率相对较高。

19. 发明授权

US06933803B2 Surface acoustic wave filter, branching filter, and communication apparatus 有权
标题翻译：表面声波滤波器，分路滤波器和通信装置
公开(公告)号：US06933803B2
公开(公告)日：2005-08-23
申请号：US10464653
申请日：2003-06-19
申请人： Toshiaki Takata
发明人： Toshiaki Takata
IPC分类号： H03H7/46 , H03H9/10 , H03H9/145 , H03H9/64 , H03H9/72 , H01L4/00 , H03H9/00
CPC分类号： H03H9/14517 , H03H9/1071 , H03H9/6483
摘要： A surface acoustic wave filter includes a piezoelectric substrate and a plurality of one-terminal-pair surface acoustic wave resonators, which are disposed on the piezoelectric substrate in a ladder pattern and each of which includes an IDT electrode having a pair of comb electrodes. The one-terminal-pair surface acoustic wave resonators disposed in a ladder pattern include series resonators, all of which are thinned. The electrode pitch of the IDT electrode of at least one of the series resonators is different from that of the IDT electrodes of the other series resonators.
摘要翻译：表面声波滤波器包括压电基板和多个单端对声表面波谐振器，它们以梯形图案设置在压电基板上，并且每个包括具有一对梳状电极的IDT电极。设置在梯形图案中的单端对声表面波谐振器包括串联谐振器，所有这些共振器均变薄。串联谐振器中的至少一个的IDT电极的电极间距与其他串联谐振器的IDT电极的电极间距不同。

20. 发明申请

US20050025324A1 Surface acoustic wave device and communication apparatus 有权
标题翻译：声表面波装置及通信装置
公开(公告)号：US20050025324A1
公开(公告)日：2005-02-03
申请号：US10847584
申请日：2004-05-18
申请人： Toshiaki Takata
发明人： Toshiaki Takata
IPC分类号： H03H9/64 , H03H7/075 , H03H9/145 , H04R1/02 , H04R25/00
CPC分类号： H03H9/6483
摘要： A surface acoustic wave device includes one-terminal-pair SAW series resonators and one-terminal-pair SAW parallel resonators arranged in a ladder configuration. Among the series resonators, the resonant frequencies of, for example, two series resonators forming the pass band are lower than the anti-resonant frequency of the parallel resonators forming the pass band. A capacitive area of one of the series resonator is disposed in an inductive area formed by the parallel resonators forming the pass band and the other series resonators forming the pass band.
摘要翻译：表面声波装置包括以梯形结构布置的单端对SAW串联谐振器和单端对SAW并联谐振器。在串联谐振器中，形成通带的例如两个串联谐振器的谐振频率低于形成通带的并联谐振器的反谐振频率。串联谐振器之一的电容区域设置在由形成通带的并联谐振器和形成通带的其它串联谐振器形成的感应区域中。

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