会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 17. 发明申请
    • Mullticomponent Backing Block for Ultrasound Sensor Assemblies
    • 用于超声波传感器组件的Mullticomponent背衬块
    • US20080229835A1
    • 2008-09-25
    • US11916762
    • 2006-06-05
    • Richard DavidsenShon Schmidt
    • Richard DavidsenShon Schmidt
    • G01N29/00
    • B06B1/0622
    • Backing block (16) for interconnecting a transducer array (12) and interconnection cables (18) connecting the transducer array (12) to a main system processing unit of an ultrasound imaging system which includes at least one base electronic component (24) electrically connected to the interconnection cable(s) (18) and which provides a pattern of interconnection structures (28), a redistribution interposer (22) electrically coupled on one side (40) to the base components) (24) and on an opposite side (38) to transducer array (12), and at least one subsidiary electronic component (26) supported by the base component(s) (24). The subsidiary components (26) can be arranged alongside the redistribution interposer (22), i.e., on a common side of the base component(s) (24) therewith, since the redistribution interposer (22) tapers in at least one dimension so that it has a smaller pitch on the side (40) connected to the base component(s) (24) than on the side (38) connected to the transducer array (12).
    • 用于将换能器阵列(12)和将所述换能器阵列(12)连接到超声成像系统的主系统处理单元的互连电缆(18)互连的支撑块(16),所述主系统处理单元包括电连接的至少一个基本电子部件 互连电缆(18),并且提供互连结构(28)的图案,在一侧(40)上电耦合到基座部件(24)和相对侧(28)上的再分配插入器(22) 38)到换能器阵列(12),以及至少一个辅助电子部件(26),由所述基部部件(24)支撑。 辅助部件(26)可以与再分配插入件(22)一起布置,即在其上的基部部件(24)的共同侧上,因为再分布插入件(22)至少在一个维度上渐缩,使得 在连接到基座部件(24)的侧面(40)上的间距小于在连接到换能器阵列(12)的侧面(38)上的间距。
    • 18. 发明申请
    • HYBRID IC FOR ULTRASOUND BEAMFORMER PROBE
    • 用于超声波束探头的混合IC
    • US20090146695A1
    • 2009-06-11
    • US11719813
    • 2005-11-17
    • Scott SchweizerShon SchmidtManfred Bartz
    • Scott SchweizerShon SchmidtManfred Bartz
    • B06B1/02
    • A61B8/546G01S7/5208G01S7/523G01S15/8915G01S15/8927G10K11/346
    • A hybrid integrated circuit package for a microbeamformer in an ultrasound probe includes a substrate, a driver circuit for generating transmit pulses to be transmitted to the transducer elements of the probe for producing a transmit beam, and a beamformer circuit including time delay circuits and a summation circuit, the time delay circuits being operatively arranged for receiving a plurality of reflected pulses from the transducer elements and delaying the reflected pulses and the summation circuit operatively arranged summing groups of the delayed reflected pulses for producing beamformed signals. The driver circuit is part of a high voltage integrated circuit device including said driver circuit. At least a portion of the beamformer circuit is part of a low voltage integrated circuit device, wherein the high voltage integrated circuit and the low voltage integrated circuit are mounted on the substrate.
    • 用于超声波探头中的微波束形成器的混合集成电路封装包括:衬底,用于产生要传输到用于产生发射波束的探头的换能器元件的发射脉冲的驱动器电路,以及包括时间延迟电路和加法的波束形成器电路 时间延迟电路被可操作地布置成用于从换能器元件接收多个反射脉冲,并延迟反射脉冲和加法电路可操作地布置的延迟反射脉冲的求和组以产生波束形成的信号。 驱动器电路是包括所述驱动电路的高压集成电路器件的一部分。 波束形成器电路的至少一部分是低压集成电路器件的一部分,其中高压集成电路和低电压集成电路安装在基板上。