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11. 发明申请

US20110156179A1 Silicon Microphone with Integrated Back Side Cavity 有权
标题翻译：带集成背面腔的硅麦克风
公开(公告)号：US20110156179A1
公开(公告)日：2011-06-30
申请号：US12969859
申请日：2010-12-16
申请人： Wei-Yan Shih
发明人： Wei-Yan Shih
IPC分类号： H01L29/84 , H01L21/04
CPC分类号： H04R19/005 , H01L27/0805 , H04R1/04 , H04R31/00
摘要： An integrated circuit containing a capacitive microphone with a back side cavity located within the substrate of the integrated circuit. Access holes may be formed through a dielectric support layer at the surface of the substrate to provide access for etchants to the substrate to form the back side cavity. The back side cavity may be etched after a fixed plate and permeable membrane of the capacitive microphone are formed by providing etchants through the permeable membrane and through the access holes to the substrate.
摘要翻译：一种集成电路，其包含具有位于集成电路的衬底内的背侧空腔的电容式麦克风。可以通过介质支撑层在基板的表面上形成通孔，以提供对基板的蚀刻剂的接近以形成背侧空腔。可以在固定板之后蚀刻背侧空腔，并且通过提供通过可渗透膜的蚀刻剂并通过到基板的通孔形成电容式麦克风的可渗透膜。

12. 发明申请

US20090128481A1 INTEGRATED SYSTEM WITH COMPUTING AND IMAGING CAPABILITES 有权
标题翻译：具有计算和成像能力的集成系统
公开(公告)号：US20090128481A1
公开(公告)日：2009-05-21
申请号：US11942122
申请日：2007-11-19
申请人： Wei-Yan Shih , Henry W. Neal , Michael McCormick , Paul Gerald Barker
发明人： Wei-Yan Shih , Henry W. Neal , Michael McCormick , Paul Gerald Barker
IPC分类号： G09G5/00
CPC分类号： G09G3/346 , G09G5/12 , G09G2360/02 , H04N9/3141 , H04N9/3188
摘要： An integrated system comprising both imaging and computing capabilities comprises a light valve and a CPU, as well as other functional members for performing computing and imaging.
摘要翻译：包括成像和计算功能的集成系统包括光阀和CPU，以及用于执行计算和成像的其它功能部件。

13. 发明授权

US06465350B1 Aluminum nitride thin film formation on integrated circuits 有权
标题翻译：集成电路上的氮化铝薄膜形成
公开(公告)号：US06465350B1
公开(公告)日：2002-10-15
申请号：US09689077
申请日：2000-10-12
申请人： Kelly J. Taylor , Wei-Yan Shih
发明人： Kelly J. Taylor , Wei-Yan Shih
IPC分类号： H01L2144
CPC分类号： H01L21/76888 , H01L21/318 , H01L21/76834
摘要： A method for forming a thin aluminum-nitride film (112). Solid hydrazine cyanurate is heated to produce in-situ hydrazine (N2H4). The in-situ hydrazine reacts with a previously deposited ailminum layer (108) to form aluminum-nitride (112).
摘要翻译：一种形成薄的氮化铝膜（112）的方法。将固体肼氰脲酸酯加热以产生原位肼（N 2 H 4）。原位肼与先前沉积的氧化铝层（108）反应形成氮化铝（112）。

14. 发明授权

US06268662B1 Wire bonded flip-chip assembly of semiconductor devices 有权
标题翻译：半导体器件的接线倒装芯片组装
公开(公告)号：US06268662B1
公开(公告)日：2001-07-31
申请号：US09418042
申请日：1999-10-14
申请人： Howard R. Test , Wei-Yan Shih , Willmar Subido
发明人： Howard R. Test , Wei-Yan Shih , Willmar Subido
IPC分类号： H01L2348
CPC分类号： H01L24/13 , H01L21/563 , H01L24/11 , H01L2224/05001 , H01L2224/05022 , H01L2224/05027 , H01L2224/0508 , H01L2224/05572 , H01L2224/1134 , H01L2224/13099 , H01L2224/131 , H01L2224/13111 , H01L2224/16 , H01L2224/73203 , H01L2224/85148 , H01L2924/0001 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/10253 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/181 , H01L2924/18161 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor assembly comprising a semiconductor chip having an active and a passive surface, said active surface including an integrated circuit and a plurality of bonding pads; said bonding pads having a metallization suitable for wire bonding; an array of interconnects of uniform height, each of said interconnects comprising a wire loop substantially perpendicular to said active surface, each of said loops having both wire ends attached to a bonding pad, respectively, and a major and a minor diameter, said loops being oriented parallel with regard to the plane of the opening and having constant offsets in both direction and magnitude of their apex relative to their bonding pad centers; said wire loops having sufficient elasticity to act as stress-absorbing springs; an electrically insulating substrate having first and second surfaces, a plurality of electrically conductive routing strips integral with said substrate, and a plurality of contact pads disposed on said first surface, with attachment material disposed on each of said contact pads; each contact pad being attached to one of said wire loops, respectively, such that electrical contact between said chip and said substrate is established, while forming a gap therebetween having a width of approximately said major loop diameter; encapsulation material within said gap; a plurality of contact pads disposed on said second surface of said substrate; and solder balls attached to each of said contact pads disposed on said second surface of said substrate.
摘要翻译：一种半导体组件，包括具有有源和无源表面的半导体芯片，所述有源表面包括集成电路和多个焊盘; 所述接合焊盘具有适于引线接合的金属化; 每个所述互连包括基本上垂直于所述有源表面的导线环，每个所述环具有分别连接到接合焊盘的两个导线端头以及主直径和小直径，所述环路是相对于开口的平面取向平行，并且在其顶点的相对于它们的焊盘中心的两个方向和大小上都具有恒定的偏移; 所述线圈具有足够的弹性以用作应力吸收弹簧; 具有第一和第二表面的电绝缘基板，与所述基板一体的多个导电布线条，以及设置在所述第一表面上的多个接触焊盘，其中每个所述接触焊盘上都安装有附着材料; 每个接触垫分别附接到所述线环中的一个，使得在所述芯片和所述衬底之间的电接触被建立，同时在其间形成具有大致所述主环直径的宽度的间隙; 所述间隙内的封装材料; 设置在所述基板的所述第二表面上的多个接触焊盘; 以及附接到设置在所述基板的所述第二表面上的每个所述接触焊盘的焊球。

15. 发明授权

US08304846B2 Silicon microphone with integrated back side cavity 有权
标题翻译：硅麦克风集成后侧腔
公开(公告)号：US08304846B2
公开(公告)日：2012-11-06
申请号：US12969859
申请日：2010-12-16
申请人： Wei-Yan Shih
发明人： Wei-Yan Shih
IPC分类号： H01L29/84
CPC分类号： H04R19/005 , H01L27/0805 , H04R1/04 , H04R31/00
摘要： An integrated circuit containing a capacitive microphone with a back side cavity located within the substrate of the integrated circuit. Access holes may be formed through a dielectric support layer at the surface of the substrate to provide access for etchants to the substrate to form the back side cavity. The back side cavity may be etched after a fixed plate and permeable membrane of the capacitive microphone are formed by providing etchants through the permeable membrane and through the access holes to the substrate.
摘要翻译：一种集成电路，其包含具有位于集成电路的衬底内的背侧空腔的电容式麦克风。可以通过介质支撑层在基板的表面上形成通孔，以提供对基板的蚀刻剂的接近以形成背侧空腔。可以在固定板之后蚀刻背侧空腔，并且通过提供通过可渗透膜的蚀刻剂并通过到基板的通孔形成电容式麦克风的可渗透膜。

16. 发明申请

US20080080077A1 Low cost window production for hermetically sealed optical packages 有权
标题翻译：用于密封光学封装的低成本窗口生产
公开(公告)号：US20080080077A1
公开(公告)日：2008-04-03
申请号：US11536857
申请日：2006-09-29
申请人： Wei-Yan Shih , Bradley M. Haskett
发明人： Wei-Yan Shih , Bradley M. Haskett
IPC分类号： G02B5/08 , B29D11/00
CPC分类号： G02B27/0006 , B29D11/0074 , B81B7/0077 , C03C17/22 , C03C17/23 , C03C27/02 , G02B26/0833 , Y10T29/49789 , Y10T29/49792
摘要： Disclosed embodiments demonstrate batch processing methods for producing optical windows for micro-devices. The windows protect the active elements of the micro-device from contaminants, while allowing light to pass into and out of the hermetically sealed micro-device package. Windows may be batch produced, reducing the cost of production, by fusing multiple metal frames to a single sheet of glass. In order to allow windows to be welded atop packages, disclosed embodiments keep a lip of metal without any glass after the metal frames are fused to the sheet of glass. Several techniques may accomplish this goal, including grinding grooves in the glass to provide a gap that prevents fusion of the glass to the metal frames along the outside edges in order to form a lip. The disclosed batch processing techniques may allow for more efficient window production, taking advantage of the economy of scale.
摘要翻译：公开的实施例示出了用于产生微器件的光学窗口的批处理方法。窗户保护微器件的有源元件免受污染，同时允许光进入和离开密封的微器件封装。 Windows可以批量生产，通过将多个金属框架融合到单张玻璃板来降低生产成本。为了允许将窗口焊接在封装的顶部，所公开的实施例在金属框架熔合到玻璃板之后保持没有任何玻璃的金属的唇缘。几种技术可以实现这一目标，包括在玻璃中的研磨槽以提供间隙，以防止玻璃与外部边缘的金属框架熔合以形成唇缘。公开的批量处理技术可以利用规模经济的优势来允许更有效的窗口生产。

17. 发明授权

US06937382B2 Active border pixels for digital micromirror device 有权
标题翻译：数位微镜器件的主动边框像素
公开(公告)号：US06937382B2
公开(公告)日：2005-08-30
申请号：US10750146
申请日：2003-12-31
申请人： Wei-Yan Shih
发明人： Wei-Yan Shih
IPC分类号： G02B26/00 , G02B26/08
CPC分类号： G02B26/0841
摘要： A method of ensuring that border pixels of a micromirror device are set to the “off” position. The method is typically performed at the factory, during inspection of the micromirror device. The border pixels are electrostatically set to the “on” position, then switched so that they are set to the “off” position. A reset signal then results in their being in the “off” position, even those pixels that were previously stuck or torqued “on”.
摘要翻译：确保微镜装置的边界像素被设置为“关”位置的方法。该方法通常在出厂时在微镜装置的检查期间进行。边框像素被静电设置为“开”位置，然后切换，使其被设置为“关”位置。然后，复位信号导致它们处于“关闭”位置，即使那些先前被卡住或扭转的像素“开”。

18. 发明申请

US20050146771A1 ACTIVE BORDER PIXELS FOR DIGITAL MICROMIRROR DEVICE 有权
标题翻译：用于数字微型设备的主动边界像素
公开(公告)号：US20050146771A1
公开(公告)日：2005-07-07
申请号：US10750146
申请日：2003-12-31
申请人： Wei-Yan Shih
发明人： Wei-Yan Shih
IPC分类号： G02B26/00 , G02B26/08
CPC分类号： G02B26/0841
摘要： A method of ensuring that border pixels of a micromirror device are set to the “off” position. The method is typically performed at the factory, during inspection of the micromirror device. The border pixels are electrostatically set to the “on” position, then switched so that they are set to the “off” position. A reset signal then results in their being in the “off” position, even those pixels that were previously stuck or torqued “on”.
摘要翻译：确保微镜装置的边界像素被设置为“关”位置的方法。该方法通常在出厂时在微镜装置的检查期间进行。边框像素被静电设置为“开”位置，然后切换，使其被设置为“关”位置。然后，复位信号导致它们处于“关闭”位置，即使那些先前被卡住或扭转的像素“开”。

19. 发明授权

US06329722B1 Bonding pads for integrated circuits having copper interconnect metallization 有权
标题翻译：具有铜互连金属化的集成电路的接合焊盘
公开(公告)号：US06329722B1
公开(公告)日：2001-12-11
申请号：US09346636
申请日：1999-07-01
申请人： Wei-Yan Shih , Arthur Wilson , Willmar Subido
发明人： Wei-Yan Shih , Arthur Wilson , Willmar Subido
IPC分类号： H05K332
CPC分类号： H01L24/05 , H01L23/53228 , H01L24/45 , H01L24/48 , H01L2224/02166 , H01L2224/04042 , H01L2224/05001 , H01L2224/05073 , H01L2224/05554 , H01L2224/05611 , H01L2224/05624 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48095 , H01L2224/48463 , H01L2224/48611 , H01L2224/48624 , H01L2224/48811 , H01L2224/85011 , H01L2224/85099 , H01L2224/85205 , H01L2224/85375 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/0103 , H01L2924/01049 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01084 , H01L2924/0132 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H01L2924/351 , H01L2924/00014 , H01L2924/01082 , H01L2924/00 , H01L2224/48824 , H01L2924/2075
摘要： A device having a thin metallic coating, such as tin which forms strong bonds to copper is provided on the bond pads of an integrated circuit having copper metallization; surface oxidation of the coating is self limiting and the oxides are readily removed, further the coated bond pad forms intermetallics at low temperatures making it both solderable and compatible with wire bonding. A low cost process for forming tin coated copper bonding pads is provided by electroless plating.
摘要翻译：在具有铜金属化的集成电路的接合焊盘上设置具有薄金属涂层的装置，例如与铜形成强键的锡，涂层的表面氧化是自限制的并且易于除去氧化物，此外，涂覆的焊盘在低温下形成金属间化合物，使其可焊接并且与引线键合相容。通过无电镀提供形成镀锡铜焊盘的低成本工艺。

20. 发明授权

US08617960B2 Silicon microphone transducer 有权
标题翻译：硅麦克风换能器
公开(公告)号：US08617960B2
公开(公告)日：2013-12-31
申请号：US12969784
申请日：2010-12-16
申请人： Marie Denison , Brian E. Goodlin , Wei-Yan Shih , Lance W. Barron
发明人： Marie Denison , Brian E. Goodlin , Wei-Yan Shih , Lance W. Barron
IPC分类号： H04R11/04 , H01L29/84 , H01L21/04
CPC分类号： H04R19/04 , H01L28/60
摘要： A capacitive microphone transducer integrated into an integrated circuit includes a fixed plate and a membrane formed in or above an interconnect region of the integrated circuit. A process of forming an integrated circuit containing a capacitive microphone transducer includes etching access trenches through the fixed plate to a region defined for the back cavity, filling the access trenches with a sacrificial material, and removing a portion of the sacrificial material from a back side of the integrated circuit.
摘要翻译：集成到集成电路中的电容麦克风换能器包括固定板和形成在集成电路的互连区域中或上方的膜。形成包含电容式麦克风换能器的集成电路的过程包括将通过固定板的访问沟槽蚀刻到为后腔定义的区域，用牺牲材料填充进入沟槽，以及从背面去除牺牲材料的一部分的集成电路。

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