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    • 14. 发明申请
    • Screening using polarization anisotropy in FRET emissions
    • 在FRET排放中使用偏振各向异性进行筛选
    • US20080206888A1
    • 2008-08-28
    • US12069724
    • 2008-02-11
    • Steven C. MillerPaul B. ComitaChristopher B. ShumateEvan F. Cromwell
    • Steven C. MillerPaul B. ComitaChristopher B. ShumateEvan F. Cromwell
    • G01N33/566G01N21/76
    • G01N33/542G01N2500/00
    • Methods and apparatus are described for detecting specific binding between first and second chemical entities. The first chemical entity in association with a first fluorophore is immobilized. The second chemical entity is allowed to bind with the immobilized first chemical entity. The second chemical entity is or becomes coupled to a second fluorophore, which forms a FRET pair with the first fluorophore. The bound chemical entities are exposed to radiation at an excitation frequency for either the first or the second fluorophore, and polarization anisotropy of a FRET fluorescent signal from the bound chemical entities is measured to detect specific binding between the first and second chemical entities. Techniques are also disclosed for detecting whether a FRET interaction is occurring between a first chemical entity including a donor fluorophore and a second chemical entity including an acceptor fluorophore, using simultaneous anisotropy measurements at the wavelengths of the donor and acceptor fluorophores.
    • 描述了用于检测第一和第二化学实体之间的特异性结合的方法和装置。 与第一荧光团相关联的第一化学实体被固定化。 允许第二化学实体与固定化的第一化学实体结合。 第二化学实体是或连接到与第一荧光团形成FRET对的第二荧光团。 结合的化学实体以第一或第二荧光团的激发频率暴露于辐射,并且测量来自结合的化学实体的FRET荧光信号的偏振各向异性以检测第一和第二化学实体之间的特异性结合。 还公开了用于检测在包括供体荧光团的第一化学实体和包括受体荧光团的第二化学实体之间是否发生FRET相互作用的技术,其使用在供体和受体荧光团的波长处的同时各向异性测量。
    • 19. 发明授权
    • Silicon-containing layer deposition with silicon compounds
    • 含硅层沉积与硅化合物
    • US07645339B2
    • 2010-01-12
    • US11549033
    • 2006-10-12
    • Kaushal K. SinghPaul B. ComitaLance A. ScudderDavid K. Carlson
    • Kaushal K. SinghPaul B. ComitaLance A. ScudderDavid K. Carlson
    • C30B21/04
    • C07F7/0896C01B33/04C01B33/107C07F7/12C23C16/24C23C16/30
    • Embodiments of the invention relate to methods for depositing silicon-containing materials on a substrate. In one example, a method for selectively and epitaxially depositing a silicon-containing material is provided which includes positioning and heating a substrate containing a crystalline surface and a non-crystalline surface within a process chamber, exposing the substrate to a process gas containing neopentasilane, and depositing an epitaxial layer on the crystalline surface. In another example, a method for blanket depositing a silicon-containing material is provide which includes positioning and heating a substrate containing a crystalline surface and feature surfaces within a process chamber and exposing the substrate to a process gas containing neopentasilane and a carbon source to deposit a silicon carbide blanket layer across the crystalline surface and the feature surfaces. Generally, the silicon carbide blanket layer contains a silicon carbide epitaxial layer selectively deposited on the crystalline surface.
    • 本发明的实施例涉及在衬底上沉积含硅材料的方法。 在一个实例中,提供了一种用于选择性和外延沉积含硅材料的方法,其包括在处理室内定位和加热含有结晶表面和非结晶表面的基底,将基底暴露于含有新戊硅烷的工艺气体中, 以及在所述晶体表面上沉积外延层。 在另一个实例中,提供了一种用于覆盖沉积含硅材料的方法,其包括定位和加热含有结晶表面的基底和处理室内的特征表面,并将基底暴露于含有新戊硅烷和碳源的工艺气体沉积 跨过结晶表面和特征表面的碳化硅毯层。 通常,碳化硅覆盖层包含选择性地沉积在晶体表面上的碳化硅外延层。