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11. 发明申请

US20130067424A1 LIFE PREDICTION METHOD OF ELECTRONIC DEVICE AND DESIGN METHOD OF ELECTRONIC DEVICE USING THE METHOD 审中-公开
标题翻译：电子设备的生命预测方法和使用该方法的电子设备的设计方法
公开(公告)号：US20130067424A1
公开(公告)日：2013-03-14
申请号：US13593499
申请日：2012-08-23
申请人： Kenichi YAMAMOTO , Ryosuke Kimoto , Kenya Kawano , Hisashi Tanie , Yasuhiro Naka
发明人： Kenichi YAMAMOTO , Ryosuke Kimoto , Kenya Kawano , Hisashi Tanie , Yasuhiro Naka
IPC分类号： G06F19/00 , G06F17/50
CPC分类号： G06F17/5018 , G06F2217/40 , G06F2217/76 , G06F2217/80
摘要： A life prediction method of an electronic device in which the life prediction accuracy is more improved than that in a related art technique, and a design method of an electronic device based on the above method, are established. Life prediction is performed by incorporating either of a change in a physical property of a solder joint portion and a change in the fatigue life of a solder, the changes occurring when left at a high temperature. The change in a physical property of the solder joint portion or the change in the fatigue life of the solder is determined from the relationship between a heat treatment temperature and a heat treatment time. These changes are then formulated to be incorporated into the life prediction.
摘要翻译：建立了寿命预测精度比现有技术更好的电子设备的寿命预测方法，并且建立了基于上述方法的电子设备的设计方法。寿命预测通过掺入焊接部分的物理性质的改变和焊料的疲劳寿命的变化来执行，当在高温下放置时发生的变化。根据热处理温度和热处理时间的关系，确定焊点的物性的变化或焊料的疲劳寿命的变化。然后将这些变化制定为纳入人生预测。

12. 发明授权

US08324993B2 Electromagnetic contact device 有权
标题翻译：电磁接触器
公开(公告)号：US08324993B2
公开(公告)日：2012-12-04
申请号：US13138926
申请日：2010-06-14
申请人： Yasuhiro Naka , Toshikatwsu Ohgami , Koji Okubo , Kouetsu Takaya , Kenji Suzuki
发明人： Yasuhiro Naka , Toshikatwsu Ohgami , Koji Okubo , Kouetsu Takaya , Kenji Suzuki
IPC分类号： H01H67/02
CPC分类号： H01H50/643 , H01H50/045 , H01H50/20
摘要： Within a case (4), are accommodated an electromagnet (8) having a fixed core (8c) and a movable core (8d) capable of contacting and separating from the fixed core (8c); a movable contact point support (7a) which moves in parallel with the movable core; a return spring (7b) which causes the movable contact point support to return to an initial position; and a driving lever (9) which rotates with a rotation support point portion (9a) provided on one end thereof as a support point, and which transmits attraction movement and release movement of the movable core to the movable contact point support. The rotation support point portion of the driving lever is fitted into and supported by a support point recess (5a) provided in an inner face of an extinction cover (5) mounted on the case.
摘要翻译：在壳体（4）内容纳有能够与固定芯（8c）接触和分离的具有固定芯（8c）和可动芯（8d）的电磁体（8）。与所述可动芯平行移动的可动接点支撑部（7a）复位弹簧（7b），其使可动触点支撑件返回到初始位置; 和驱动杆（9），其以设置在其一端上的旋转支撑点部（9a）作为支撑点旋转，并且将可动铁芯的吸引移动和移动移动到可动接触点支撑体。驱动杆的旋转支撑点部分装配到设置在安装在壳体上的消光罩（5）的内表面中的支撑点凹部（5a）并由支撑点凹部支撑。

13. 外观设计

USD657749S1 Electromagnetic contactor 有权
公开(公告)号：USD657749S1
公开(公告)日：2012-04-17
申请号：US29387360
申请日：2011-03-11
申请人： Kenji Suzuki , Kouetsu Takaya , Yuichi Yamamoto , Yuji Shiba , Yasuhiro Naka
设计人： Kenji Suzuki , Kouetsu Takaya , Yuichi Yamamoto , Yuji Shiba , Yasuhiro Naka

14. 发明申请

US20090324995A1 GLASS SUBSTRATE FOR MAGNETIC DISK 失效
标题翻译：用于磁盘的玻璃基板
公开(公告)号：US20090324995A1
公开(公告)日：2009-12-31
申请号：US12474765
申请日：2009-05-29
申请人： Shinpei Todo , Yasuhiro Naka
发明人： Shinpei Todo , Yasuhiro Naka
IPC分类号： G11B5/70
CPC分类号： G11B5/7315 , C03C19/00 , C03C2204/08 , G11B5/8404
摘要： There is provided a glass substrate for a magnetic disk in which a maximum height of bumps forming a roughness pattern at a period of smaller than 2 μm is 6 nm or lower in an annular area having a width of 30 μm on a main surface on which a magnetic recording area is formed, a number of bumps having a height of 3 nm or higher in a unit area having a circular arc length of 30 μm within the annular area is one or less, and a difference in arithmetic average roughness between unit areas within the annular area is 0.2 nm or smaller.
摘要翻译：提供了一种用于磁盘的玻璃基板，其中在其主表面上的宽度为30μm的环形区域中，在小于2μm的周期形成粗糙图案的凸块的最大高度为6nm或更小，形成磁记录区域，在环形区域内具有圆弧长度为30μm的单位面积中具有3nm以上的高度的凸起的数量为1个以下，单位面积之间的算术平均粗糙度差在环形区域内为0.2nm以下。

15. 发明申请

US20090122448A1 GLASS SUBSTRATE FOR MAGNETIC DISK APPARATUS 有权
标题翻译：用于磁盘设备的玻璃基板
公开(公告)号：US20090122448A1
公开(公告)日：2009-05-14
申请号：US12267917
申请日：2008-11-10
申请人： Hiroshi Kuraseko , Nobuaki Orita , Yasuhiro Naka
发明人： Hiroshi Kuraseko , Nobuaki Orita , Yasuhiro Naka
IPC分类号： G11B5/60 , B32B3/02
CPC分类号： G11B5/7315 , G11B5/54 , G11B5/82 , G11B21/12 , G11B21/22 , Y10T428/21
摘要： A main surface of a glass substrate for a magnetic disk is disk-shaped and has a ski jump on an outer peripheral end portion of the main surface opposing a magnetic head slider to be loaded. A rate of change of angles of tangents to a slope of the ski jump in a radial direction in a range between an inner circumferential side and a transition point on the slope is equal to or less than 10/W μrad/mm where W is a width of the magnetic head slider.
摘要翻译：用于磁盘的玻璃基板的主表面是盘形的，并且在与要装载的磁头滑块相对的主表面的外周端部上具有滑行跳台。在斜坡上的内周侧和过渡点之间的范围内的切线角与径向滑动坡度的斜率的变化率等于或小于10 / W穆拉德/ mm，其中W是磁头滑块的宽度。

16. 发明申请

US20090109641A1 Wafer of circuit board and joining structure of wafer or circuit board 有权
标题翻译：电路板晶圆和晶圆或电路板的接合结构
公开(公告)号：US20090109641A1
公开(公告)日：2009-04-30
申请号：US12285222
申请日：2008-09-30
申请人： Masakazu Ishino , Hiroaki Ikeda , Hideharu Miyake , Shiro Uchiyama , Hiroyuki Tenmei , Kunihiko Nishi , Yasuhiro Naka , Nae Hisano
发明人： Masakazu Ishino , Hiroaki Ikeda , Hideharu Miyake , Shiro Uchiyama , Hiroyuki Tenmei , Kunihiko Nishi , Yasuhiro Naka , Nae Hisano
IPC分类号： H05K7/00
CPC分类号： H05K1/0296 , H01L23/481 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/81 , H01L24/90 , H01L25/0657 , H01L2224/03912 , H01L2224/0401 , H01L2224/05599 , H01L2224/1147 , H01L2224/11901 , H01L2224/11902 , H01L2224/13099 , H01L2224/13111 , H01L2224/2518 , H01L2224/81193 , H01L2224/81801 , H01L2224/90 , H01L2225/06513 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H05K1/09 , H05K3/3436 , H05K2201/0367 , H05K2201/10674 , Y02P70/613
摘要： A wafer (or a circuit board), which is used to perform three-dimensional mounting, has protrusion 20 which is provided in low melting point metal 15 for electrically connecting mutually joined wafers 61 and 62, and which defines an interval between mutually joined wafers 61 and 62 without being deformed at the time when low melting point metal 15 is melted. A joining structure of wafers 61 and 62 is manufactured by using wafers 61 and 62, at least one of which has protrusion 20. In the manufactured joining structure of wafers 61 and 62, wafers 61 and 62 are electrically connected to each other by low melting point metal 15, and protrusion 20, which defines the interval between wafers 61 and 62 without being deformed at the time when low melting point metal 15 is melted, is provided in low melting point metal 15.
摘要翻译：用于进行三维安装的晶片（或电路板）具有突起20，该突起20设置在用于电连接相互接合的晶片61和62的低熔点金属15中，并且限定相互连接的晶片之间的间隔 61和62，在低熔点金属15熔化时不变形。通过使用晶片61和62中的至少一个具有突起20来制造晶片61和62的接合结构。在制造的晶片61和62的接合结构中，晶片61和62通过低熔点彼此电连接点金属15和在低熔点金属15熔化时不会变形的晶片61和62之间的间隔的突起20设置在低熔点金属15中。

17. 发明申请

US20060197204A1 Semiconductor device 有权
公开(公告)号：US20060197204A1
公开(公告)日：2006-09-07
申请号：US11404135
申请日：2006-04-14
申请人： Yasuhiro Naka , Naotaka Tanaka , Ikuo Yoshida , Satoshi Imasu , Takahiro Naito
发明人： Yasuhiro Naka , Naotaka Tanaka , Ikuo Yoshida , Satoshi Imasu , Takahiro Naito
IPC分类号： H01L23/02
CPC分类号： H01L21/563 , H01L25/0655 , H01L25/50 , H01L29/0657 , H01L2224/16225 , H01L2224/32014 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2924/00014 , H01L2924/01019 , H01L2924/01079 , H01L2924/15311 , H01L2924/3025 , H01L2924/00 , H01L2224/0401
摘要： In a semiconductor device adapted to be mounted on a board and to be electrically connected to the board, comprising, at least two semiconductor electric chips, and a substrate on which the semiconductor electric chips are mounted and to which the semiconductor electric chips are electrically connected, in such a manner that the semiconductor electric chips are mounted on and electrically connected to the board through the substrate, according to the present invention, a thickness of each of the semiconductor electric chips in a direction in which the each of the semiconductor electric chips and the substrate are stacked is smaller than a thickness of the substrate in the direction.

18. 发明授权

US07057278B2 Semiconductor device 有权
公开(公告)号：US07057278B2
公开(公告)日：2006-06-06
申请号：US10741637
申请日：2003-12-18
申请人： Yasuhiro Naka , Naotaka Tanaka , Ikuo Yoshida , Satoshi Imasu , Takahiro Naito
发明人： Yasuhiro Naka , Naotaka Tanaka , Ikuo Yoshida , Satoshi Imasu , Takahiro Naito
IPC分类号： H01L23/34
CPC分类号： H01L21/563 , H01L25/0655 , H01L25/50 , H01L29/0657 , H01L2224/16225 , H01L2224/32014 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2924/00014 , H01L2924/01019 , H01L2924/01079 , H01L2924/15311 , H01L2924/3025 , H01L2924/00 , H01L2224/0401
摘要： In a semiconductor device adapted to be mounted on a board and to be electrically connected to the board, comprising, at least two semiconductor electric chips, and a substrate on which the semiconductor electric chips are mounted and to which the semiconductor electric chips are electrically connected, in such a manner that the semiconductor electric chips are mounted on and electrically connected to the board through the substrate, according to the present invention, a thickness of each of the semiconductor electric chips in a direction in which the each of the semiconductor electric chips and the substrate are stacked is smaller than a thickness of the substrate in the direction.

19. 发明申请

US20060043605A1 Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：US20060043605A1
公开(公告)日：2006-03-02
申请号：US11172207
申请日：2005-06-29
申请人： Yasuhiro Naka , Tomio Iwasaki , Hidekazu Okuda , Yuji Fujii
发明人： Yasuhiro Naka , Tomio Iwasaki , Hidekazu Okuda , Yuji Fujii
IPC分类号： H01L23/48
CPC分类号： H01L24/05 , H01L24/11 , H01L24/13 , H01L2224/0401 , H01L2224/04042 , H01L2224/05001 , H01L2224/0554 , H01L2224/11 , H01L2224/1147 , H01L2224/13 , H01L2224/13099 , H01L2224/16 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/73265 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/1306 , H01L2924/351 , H01L2924/00014 , H01L2924/00
摘要： To prevent peeling-off of a film in a solder connection pad of a semiconductor device, which peeling-off may occur due to thermal load and so on in the manufacture process, a pad structure is adopted in which a Cr film good in adhesiveness to either of a Ti film or Ti compound film and a Ni film (or a Cu film) is interposed between the Ti film or Ti compound film formed on a silicon or silicon oxide film, and the Ni film (or the Cu film) to be connected to solder. Further, to prevent peeling-off at the interface between the Ti film or Ti compound film and the silicon oxide film, the Cr film is formed in a larger area than the Ti film or Ti compound film.
摘要翻译：为了防止在制造过程中由于热负荷等而在半导体器件的焊料接合焊盘中的膜剥离，由此导致剥离，可以采用衬垫结构，其中Cr膜具有良好的粘合性在形成于硅或氧化硅膜上的Ti膜或Ti化合物膜之间插入Ti膜或Ti化合物膜和Ni膜（或Cu膜），Ni膜（或Cu膜）为连接到焊料。此外，为了防止在Ti膜或Ti化合物膜与氧化硅膜之间的界面处的剥离，Cr膜形成在比Ti膜或Ti化合物膜更大的面积上。

20. 发明授权

US06827883B2 Optical fiber preform and the method of producing the same 有权
标题翻译：光纤预制棒及其制造方法
公开(公告)号：US06827883B2
公开(公告)日：2004-12-07
申请号：US10242609
申请日：2002-09-13
申请人： Yukio Koumura , Yasuhiro Naka , Nobuaki Orita
发明人： Yukio Koumura , Yasuhiro Naka , Nobuaki Orita
IPC分类号： G02B616
CPC分类号： C03B37/027 , C03B37/01446 , C03B37/01466 , C03B2205/90 , Y02P40/57 , Y10T428/24926 , Y10T428/2495
摘要： An optical fiber preform (1) serving as a material of an optical fiber has a shoulder portion (12) thrusting beyond a middle portion (M) in a base end region (K) which is on the upper side when the optical fiber preform is suspended for a drawing process. The optical fiber preform (1) of this configuration can be easily produced by appropriately setting the heating condition, etc. for the sintering step in the production process. Thus, it is possible to omit the elongating step after the sintering step, thereby simplifying the production process. Further, in the prior-art technique, turbulence is generated in the gas flow in the furnace of the drawing apparatus toward the end of the drawing step, making it impossible to draw in a stable manner. In contrast, in this embodiment, due to the shoulder portion (12), there is a small gap between the inner wall surface of the furnace and the optical fiber preform; due to this small gap, the gas flow is regulated, and the drawing can be conducted in a stable manner even toward the end of the drawing step.
摘要翻译：用作光纤材料的光纤预制件（1）具有在光纤预制件是上侧时位于上侧的基端区域（K）中的超过中间部分（M）的肩部（12）暂停绘制过程。通过在生产过程中适当地设定烧结步骤的加热条件等，可以容易地制造这种结构的光纤预制件（1）。因此，可以省略烧结步骤后的延伸工序，从而简化了制造工序。此外，在现有技术中，在拉拔装置的炉内的气流中产生湍流，使得不可能稳定地绘制。相反，在本实施方式中，由于肩部（12），炉内壁面和光纤预制体之间存在小间隙，由于这种小的间隙，气流被调节，并且即使在拉拔步骤结束时也可以以稳定的方式进行拉伸。

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