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11. 发明授权

US08232185B2 Method for manufacturing semiconductor chip, adhesive film for semiconductor, and composite sheet using the film 失效
标题翻译：半导体芯片的制造方法，半导体用粘合膜以及使用该膜的复合片
公开(公告)号：US08232185B2
公开(公告)日：2012-07-31
申请号：US12594634
申请日：2008-03-31
申请人： Yuuki Nakamura , Tsutomu Kitakatsu , Youji Katayama , Keiichi Hatakeyama
发明人： Yuuki Nakamura , Tsutomu Kitakatsu , Youji Katayama , Keiichi Hatakeyama
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50 , H01L21/46 , H01L21/78
CPC分类号： C09J201/00 , B23K26/364 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/172 , B23K2103/50 , B28D5/0082 , H01L21/67132 , H01L21/6835 , H01L21/6836 , H01L21/78 , H01L24/27 , H01L24/73 , H01L24/83 , H01L25/50 , H01L2221/68327 , H01L2221/68336 , H01L2224/274 , H01L2224/29006 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/8385 , H01L2224/92247 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01051 , H01L2924/01077 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/15747 , H01L2924/15788 , H01L2924/181 , Y10T428/28 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/3512
摘要： There is provided a method that allows semiconductor chips to be obtained from a semiconductor wafer at high yield, while sufficiently inhibiting generation of chip cracks and burrs. The method for manufacturing a semiconductor chip comprises a step of preparing a laminated body having a semiconductor wafer, an adhesive film for a semiconductor and dicing tape laminated in that order, the semiconductor wafer being partitioned into multiple semiconductor chips and notches being formed from the semiconductor wafer side so that at least a portion of the adhesive film for a semiconductor remains uncut in its thickness direction, and a step of stretching out the dicing tape in a direction so that the multiple semiconductor chips are separated apart, to separate the adhesive film for a semiconductor along the notches. The adhesive film for a semiconductor has a tensile breaking elongation of less than 5% and the tensile breaking elongation of less than 110% of the elongation at maximum load.
摘要翻译：提供了一种允许以高产率从半导体晶片获得半导体芯片的方法，同时充分抑制了芯片裂纹和毛刺的产生。制造半导体芯片的方法包括制备具有半导体晶片的层叠体，半导体用粘合膜和切割带，其顺序层叠，将半导体晶片划分成多个半导体芯片，并由半导体形成沟槽使得至少一部分用于半导体的粘合膜在其厚度方向上保持未切割，并且在使多个半导体芯片分开的方向上伸出切割带的步骤，以分离用于沿着凹口的半导体。半导体用粘合膜的拉伸断裂伸长率小于5％，拉伸断裂伸长率小于最大载荷下伸长率的110％。

12. 发明授权

US08180251B2 Cover and cartridge 有权
标题翻译：盖子和墨盒
公开(公告)号：US08180251B2
公开(公告)日：2012-05-15
申请号：US12912016
申请日：2010-10-26
申请人： Yuuki Nakamura , Yoshifumi Takeyama
发明人： Yuuki Nakamura , Yoshifumi Takeyama
IPC分类号： G03G21/18 , G03G15/02 , G03G15/08 , G03G15/00
CPC分类号： G03G21/1828
摘要： An electrophotographic image forming apparatus detachably mountable to a main assembly of the apparatus, includes a rotatable image bearing member on which a latent image is to be formed; charging means for contacting said image bearing member to charge a surface of said image bearing member; a frame supporting said image bearing member and said charging means; a covering member, demountably mounted to said frame, for protecting the surface of said image bearing member; and a spacer member including a spacing portion, movably provided on said covering member, for entering between said image bearing member and said charging means to space them therebetween, and a retaining portion, contacting said covering member when said spacing portion is not between said image bearing member and said charging means, for preventing said spacer member from disengaging from said covering member.
摘要翻译：可拆卸地安装到装置的主组件上的电子照相图像形成装置包括可在其上形成潜像的可旋转图像承载构件; 用于接触所述图像承载部件以对所述图像承载部件的表面充电的充电装置; 支撑所述图像承载部件和所述充电装置的框架; 可拆卸地安装到所述框架的用于保护所述图像承载部件的表面的覆盖部件; 以及间隔部件，包括可移动地设置在所述覆盖部件上的间隔部分，用于进入所述图像承载部件和所述充电装置之间以将它们间隔开;以及保持部分，当所述间隔部分不在所述图像之间时与所述覆盖部件接触轴承构件和所述充电装置，用于防止所述间隔构件从所述覆盖构件脱离。

13. 发明申请

US20110291260A1 SEMICONDUCTOR ENCAPSULATION ADHESIVE COMPOSITION, SEMICONDUCTOR ENCAPSULATION FILM-LIKE ADHESIVE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE 有权
标题翻译：半导体封装粘合组合物，半导体封装薄膜粘合剂，用于生产半导体器件和半导体器件的方法
公开(公告)号：US20110291260A1
公开(公告)日：2011-12-01
申请号：US12788110
申请日：2010-05-26
申请人： Kazutaka Honda , Tetsuya Enomoto , Yuuki Nakamura
发明人： Kazutaka Honda , Tetsuya Enomoto , Yuuki Nakamura
IPC分类号： H01L23/498 , C09J163/00 , H01L21/56
CPC分类号： H01L23/293 , C08K3/014 , C08K5/13 , C08L79/08 , C09J163/00 , H01L21/563 , H01L2224/73204 , H01L2224/83192 , C08K3/0041
摘要： A semiconductor encapsulation adhesive composition comprising (a) an epoxy resin, (b) a curing agent and (c) an antioxidant.
摘要翻译：一种半导体封装胶粘剂组合物，其包含（a）环氧树脂，（b）固化剂和（c）抗氧化剂。

14. 发明申请

US20110210407A1 DOUBLE-FACED ADHESIVE FILM AND ELECTRONIC COMPONENT MODULE USING SAME 审中-公开
标题翻译：双面胶粘膜和电子元件组件使用相同
公开(公告)号：US20110210407A1
公开(公告)日：2011-09-01
申请号：US13060670
申请日：2009-08-25
申请人： Youji Katayama , Yuuki Nakamura , Masanobu Miyahara , Koichi Kimura , Tsutomu Kitakatsu
发明人： Youji Katayama , Yuuki Nakamura , Masanobu Miyahara , Koichi Kimura , Tsutomu Kitakatsu
IPC分类号： H01L29/66 , B32B7/12 , H01L23/58
CPC分类号： H01L24/83 , C08G73/1046 , C08G73/14 , C09J7/20 , C09J179/08 , C09J2201/134 , C09J2201/606 , C09J2201/61 , C09J2479/08 , H01L23/293 , H01L24/29 , H01L2224/2919 , H01L2224/2929 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/2936 , H01L2224/29386 , H01L2224/83101 , H01L2224/83191 , H01L2924/00013 , H01L2924/10253 , H01L2924/1461 , H01L2924/15747 , H01L2924/15787 , H01L2924/351 , Y10T428/28 , Y10T428/2874 , Y10T428/2878 , H01L2924/0665 , H01L2924/00014 , H01L2924/05442 , H01L2924/04642 , H01L2924/0503 , H01L2924/05432 , H01L2924/05032 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2924/00
摘要： A double-faced adhesive film including: a supporting film; a first adhesive layer laminated on one surface of the supporting film; and a second adhesive layer laminated on the other surface of the supporting film, wherein the glass transition temperatures, after curing, of the first adhesive layer and the second adhesive layer are each 100° C. or lower, and the first adhesive layer and the second adhesive layer are the layers capable of being formed by a method including the steps of directly applying a varnish to the supporting film and drying the applied varnish.
摘要翻译：一种双面粘合膜，包括：支撑膜; 层压在所述支撑膜的一个表面上的第一粘合剂层; 以及层叠在所述支撑膜的另一个表面上的第二粘合剂层，其中所述第一粘合层和所述第二粘合层的固化后的玻璃化转变温度各自为100℃以下，所述第一粘合层和第二粘合剂层是能够通过包括以下步骤形成的层：将清漆直接涂布到支撑膜上并干燥涂布的清漆。

15. 发明申请

US20100112783A1 ADHESIVE FILM FOR SEMICONDUCTOR, COMPOSITE SHEET, AND METHOD FOR PRODUCING SEMICONDUCTOR CHIP USING THEM 有权
标题翻译：用于半导体的胶粘膜，复合片和使用它们生产半导体芯片的方法
公开(公告)号：US20100112783A1
公开(公告)日：2010-05-06
申请号：US12594847
申请日：2008-03-31
申请人： Yuuki Nakamura , Tsutomu Kitakatsu , Youji Katayama , Keiichi Hatakeyama
发明人： Yuuki Nakamura , Tsutomu Kitakatsu , Youji Katayama , Keiichi Hatakeyama
IPC分类号： H01L21/78 , B32B7/12 , C08G77/26 , C08L83/08
CPC分类号： C09J183/10 , C08G73/106 , C08G77/26 , C08G77/452 , C09D183/08 , C09J179/08 , C09J183/08 , H01L21/67132 , H01L21/6835 , H01L21/78 , H01L23/296 , H01L24/27 , H01L24/29 , H01L24/48 , H01L24/73 , H01L24/83 , H01L25/50 , H01L2224/274 , H01L2224/29006 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/8385 , H01L2224/92247 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01051 , H01L2924/01058 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/12044 , H01L2924/15747 , H01L2924/15788 , H01L2924/181 , Y10T428/2826 , Y10T428/2896 , H01L2924/07025 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： There is provided an adhesive film for a semiconductor, which can be attached to a semiconductor wafer at low temperature and which allows semiconductor chips to be obtained at high yield from the semiconductor wafer while sufficiently inhibiting generation of chip cracks and burrs. The adhesive film for a semiconductor comprises a polyimide resin that can be obtained by reaction between a tetracarboxylic dianhydride containing 4,4′-oxydiphthalic dianhydride represented by chemical formula (I) below and a diamine containing a siloxanediamine represented by the following general formula (II) below, and that can be attached to a semiconductor wafer at 100° C. or below.
摘要翻译：提供了一种用于半导体的粘合膜，其可以在低温下附着到半导体晶片，并且允许从半导体晶片以高产率获得半导体芯片，同时充分抑制芯片裂纹和毛刺的产生。半导体用粘合膜包括聚酰亚胺树脂，其可以通过以下化学式（I）表示的含有4,4'-氧联二邻苯二甲酸二酐的四羧酸二酐和由以下通式（II）表示的含有硅氧烷二胺的二胺），并且可以在100℃或更低温度下连接到半导体晶片。

16. 发明授权

US5236784A Bearing material and plastic bearing 失效
标题翻译：轴承材料和塑料轴承
公开(公告)号：US5236784A
公开(公告)日：1993-08-17
申请号：US876979
申请日：1992-05-01
申请人： Toshihiro Kobayashi , Tokuhisa Tsutsui , Yuuki Nakamura
发明人： Toshihiro Kobayashi , Tokuhisa Tsutsui , Yuuki Nakamura
IPC分类号： F16C33/16 , F16C33/20
CPC分类号： F16C33/201 , F16C33/16 , F16C33/20 , Y10S384/907 , Y10S384/908 , Y10S384/909 , Y10S384/91 , Y10T428/25 , Y10T428/30 , Y10T428/31678
摘要： A bearing material mainly comprising plastics and a plastic bearing made thereof. The bearing material is composed of 30 to 98 wt % of glassy carbon and 70 to 2 wt % of plastics, and has persistent, excellent abrasion resistance, sliding properties, and heat resistance.
摘要翻译：主要包括塑料的轴承材料和由其制成的塑料轴承。轴承材料由30〜98重量％的玻璃碳和70〜2重量％的塑料构成，具有持久的，优异的耐磨性，滑动性和耐热性。

17. 发明授权

US09024455B2 Semiconductor encapsulation adhesive composition, semiconductor encapsulation film-like adhesive, method for producing semiconductor device and semiconductor device 有权
标题翻译：半导体封装胶粘剂组合物，半导体封装膜状粘合剂，半导体器件和半导体器件的制造方法
公开(公告)号：US09024455B2
公开(公告)日：2015-05-05
申请号：US12788110
申请日：2010-05-26
申请人： Kazutaka Honda , Tetsuya Enomoto , Yuuki Nakamura
发明人： Kazutaka Honda , Tetsuya Enomoto , Yuuki Nakamura
IPC分类号： H01L23/29 , C09J163/00 , H01L21/56
CPC分类号： H01L23/293 , C08K3/014 , C08K5/13 , C08L79/08 , C09J163/00 , H01L21/563 , H01L2224/73204 , H01L2224/83192 , C08K3/0041
摘要： A semiconductor encapsulation adhesive composition comprising (a) an epoxy resin, (b) a curing agent and (c) an antioxidant.
摘要翻译：一种半导体封装胶粘剂组合物，其包含（a）环氧树脂，（b）固化剂和（c）抗氧化剂。

18. 发明授权

US08674502B2 Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device 有权
标题翻译：半导体封装用粘合剂，半导体封装膜状粘合剂，半导体装置的制造方法以及半导体装置
公开(公告)号：US08674502B2
公开(公告)日：2014-03-18
申请号：US12838291
申请日：2010-07-16
申请人： Kazutaka Honda , Tetsuya Enomoto , Yuuki Nakamura
发明人： Kazutaka Honda , Tetsuya Enomoto , Yuuki Nakamura
IPC分类号： H01L23/48 , H01L21/00
CPC分类号： H01L21/563 , C08G59/42 , C08L63/00 , C09J163/00 , C09J163/04 , C09J179/08 , H01L23/293 , H01L24/29 , H01L24/73 , H01L24/81 , H01L24/83 , H01L2224/13144 , H01L2224/13155 , H01L2224/16225 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29386 , H01L2224/29388 , H01L2224/29393 , H01L2224/73104 , H01L2224/73204 , H01L2224/81191 , H01L2224/81201 , H01L2224/81411 , H01L2224/81444 , H01L2224/81455 , H01L2224/81805 , H01L2224/81903 , H01L2224/83191 , H01L2224/83192 , H01L2224/94 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/00 , H01L2224/11 , H01L2224/27 , H01L2924/00014 , H01L2924/05442 , H01L2924/05432 , H01L2924/05341 , H01L2924/0503 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： The present invention relates to a semiconductor-encapsulating adhesive, a semiconductor-encapsulating film-form adhesive, a method for producing a semiconductor device, and a semiconductor device. The present invention provides a semiconductor-encapsulating adhesive comprising (a) an epoxy resin, and (b) a compound formed of an organic acid reactive with an epoxy resin and a curing accelerator.
摘要翻译：本发明涉及半导体封装胶粘剂，半导体封装膜状粘合剂，半导体装置的制造方法以及半导体装置。本发明提供了包含（a）环氧树脂和（b）由与环氧树脂反应的有机酸和固化促进剂形成的化合物的半导体封装粘合剂。

19. 发明授权

US08628112B2 Curtain air bag system 有权
标题翻译：窗帘气囊系统
公开(公告)号：US08628112B2
公开(公告)日：2014-01-14
申请号：US13297528
申请日：2011-11-16
申请人： Hideki Kato , Yosuke Shimizu , Yuuki Nakamura , Yutaka Nakajima
发明人： Hideki Kato , Yosuke Shimizu , Yuuki Nakamura , Yutaka Nakajima
IPC分类号： B60R21/232
CPC分类号： B60R21/232 , B60R21/233 , B60R21/2334 , B60R2021/23107
摘要： With the curtain air bag system according to this aspect, if the vehicle ends up rolling over, the main deployment portion receives a supply of gas and consequently inflates and deploys in a curtain shape. Also, the auxiliary deployment portion inflates and deploys by receiving a supply of gas from this main deployment portion via the gas passage. The head of an occupant seated in the front seat is protected against a rollover by the main deployment portion and the auxiliary deployment portion. Here, with the curtain air bag system described above, the upper end portion of the auxiliary deployment portion is connected to the front pillar via the connecting portion. Therefore, it is possible to prevent or effectively suppress the upper end of the auxiliary deployment portion from becoming offset in the vehicle width direction with respect to the front pillar when protecting the head of an occupant, which improves occupant head protection performance forward of the seat.
摘要翻译：在本实施方式的帘式气囊系统中，如果车辆端部翻转，则主要部署部接收气体供给，因此以窗帘形状进行充气和展开。此外，辅助展开部分通过经由气体通道接收来自该主展开部分的气体的供给而膨胀和部署。坐在前排座椅上的乘客的头部被主要部署部分和辅助部署部分保护而不会翻转。这里，通过上述帘式气囊系统，辅助配置部的上端部经由连接部连接到前支柱。因此，能够防止或有效地抑制辅助展开部的上端在保护乘员的头部时相对于前柱在车辆宽度方向上偏移，这提高了座椅向前的乘员头部保护性能。

20. 发明授权

US08404564B2 Adhesive film for semiconductor, composite sheet, and method for producing semiconductor chip using them 有权
标题翻译：用于半导体的粘合膜，复合片和使用它们的半导体芯片的制造方法
公开(公告)号：US08404564B2
公开(公告)日：2013-03-26
申请号：US12594847
申请日：2008-03-31
申请人： Yuuki Nakamura , Tsutomu Kitakatsu , Youji Katayama , Keiichi Hatakeyama
发明人： Yuuki Nakamura , Tsutomu Kitakatsu , Youji Katayama , Keiichi Hatakeyama
IPC分类号： H01L21/00 , H01L21/301 , H01L21/78
CPC分类号： C09J183/10 , C08G73/106 , C08G77/26 , C08G77/452 , C09D183/08 , C09J179/08 , C09J183/08 , H01L21/67132 , H01L21/6835 , H01L21/78 , H01L23/296 , H01L24/27 , H01L24/29 , H01L24/48 , H01L24/73 , H01L24/83 , H01L25/50 , H01L2224/274 , H01L2224/29006 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/8385 , H01L2224/92247 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01051 , H01L2924/01058 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/12044 , H01L2924/15747 , H01L2924/15788 , H01L2924/181 , Y10T428/2826 , Y10T428/2896 , H01L2924/07025 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： There is provided an adhesive film for a semiconductor, which can be attached to a semiconductor wafer at low temperature and which allows semiconductor chips to be obtained at high yield from the semiconductor wafer while sufficiently inhibiting generation of chip cracks and burrs. The adhesive film for a semiconductor comprises a polyimide resin that can be obtained by reaction between a tetracarboxylic dianhydride containing 4,4′-oxydiphthalic dianhydride represented by chemical formula (I) below and a diamine containing a siloxanediamine represented by the following general formula (II) below, and that can be attached to a semiconductor wafer at 100° C. or below.
摘要翻译：提供了一种用于半导体的粘合膜，其可以在低温下附着到半导体晶片，并且允许从半导体晶片以高产率获得半导体芯片，同时充分抑制芯片裂纹和毛刺的产生。半导体用粘合膜包括聚酰亚胺树脂，其可以通过以下化学式（I）表示的含有4,4'-氧联二邻苯二甲酸二酐的四羧酸二酐和由以下通式（II）表示的含有硅氧烷二胺的二胺），并且可以在100℃或更低温度下连接到半导体晶片。

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