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11. 发明授权

US07308802B2 Refrigeration system 失效
标题翻译：制冷系统
公开(公告)号：US07308802B2
公开(公告)日：2007-12-18
申请号：US11094375
申请日：2005-03-30
申请人： Tay-Jian Liu , Chih-Peng Lee
发明人： Tay-Jian Liu , Chih-Peng Lee
IPC分类号： F25D23/12
CPC分类号： F25D19/006 , H01L23/4006 , H01L23/427 , H01L23/4338 , H01L2924/0002 , H01L2924/00
摘要： A mounting assembly (30) for mounting an evaporator (21) of a refrigeration system (20) to an electronic component (10) includes a housing member (31) and a clamping member (32). The housing member defines a through hole (33) with the electronic component located therein. The evaporator is received in the through hole and located in axial alignment with the electronic component. The evaporator defines therein a fluid flow channel (25) for passage of a refrigerant fluid. The refrigeration system is in fluid communication with the fluid flow channel of the evaporator to supply refrigerant fluid thereto. The clamping member is attached to the housing member and has an abutting portion (84) integrally formed therefrom for exerting an uniform force to the evaporator to maintain the evaporator in thermal contact with the electronic component.
摘要翻译：用于将制冷系统（20）的蒸发器（21）安装到电子部件（10）的安装组件（30）包括壳体构件（31）和夹紧构件（32）。壳体构件限定了电子部件位于其中的通孔（33）。蒸发器被容纳在通孔中并且与电子部件轴向对准。蒸发器在其中限定用于制冷剂流体通过的流体流动通道（25）。制冷系统与蒸发器的流体流动通道流体连通以向其供应制冷剂流体。夹紧构件附接到壳体构件并且具有由其一体地形成的邻接部分（84），用于向蒸发器施加均匀的力以保持蒸发器与电子部件热接触。

12. 发明授权

US07775262B2 Loop-type heat exchange device 失效
标题翻译：环型热交换装置
公开(公告)号：US07775262B2
公开(公告)日：2010-08-17
申请号：US11308072
申请日：2006-03-05
申请人： Tay-Jian Liu , Chao-Nien Tung , Chuen-Shu Hou , Chih-Peng Lee
发明人： Tay-Jian Liu , Chao-Nien Tung , Chuen-Shu Hou , Chih-Peng Lee
IPC分类号： F28D15/00 , H05K7/20
CPC分类号： H01L23/427 , F28D15/0266 , F28D15/046 , F28F9/026 , H01L2924/0002 , H01L2924/00
摘要： A loop-type heat exchange device (10) includes an evaporator (20), a vapor conduit (30), a condenser (50) and a liquid conduit (70). The evaporator contains therein a working fluid. The working fluid turns into vapor in the evaporator upon receiving heat from a heat-generating component. The condenser includes a housing member (52), a plurality of tube members (53) being in fluid communication with the housing member, and a fin member (54) maintained in thermal contact with the tube members. The vapor conduit and the liquid conduit are each connected between the evaporator and the condenser. The vapor conduit conveys the vapor generated in the evaporator to the tube members of the condenser. The vapor turns into condensate in the tube members upon releasing the heat to the fin member. The condensate is conveyed back to the evaporator by the liquid conduit.
摘要翻译：环型热交换装置（10）包括蒸发器（20），蒸汽导管（30），冷凝器（50）和液体导管（70）。蒸发器包含工作流体。当从发热部件接收热量时，工作流体在蒸发器中变成蒸气。冷凝器包括壳体构件（52），与壳体构件流体连通的多个管构件（53）和与管构件保持热接触的翅片构件（54）。蒸气导管和液体导管各自连接在蒸发器和冷凝器之间。蒸汽导管将蒸发器中产生的蒸气传送到冷凝器的管件。在将热量释放到翅片构件上时，蒸汽在管构件中变成冷凝物。冷凝液被液体导管输送回蒸发器。

13. 发明授权

US07556689B2 Device for spreading viscous thermal medium on heat dissipation device for electronic component 失效
标题翻译：用于在电子部件散热装置上散布粘性热介质的装置
公开(公告)号：US07556689B2
公开(公告)日：2009-07-07
申请号：US11307544
申请日：2006-02-13
申请人： Chih-Peng Lee , Tay-Jian Liu
发明人： Chih-Peng Lee , Tay-Jian Liu
IPC分类号： B05B1/16 , B23K3/06
CPC分类号： B05C7/06 , B05C5/02 , B23K3/0638 , B23K2101/14 , B23K2101/36 , F28D15/0275 , F28F1/32
摘要： A spreading device (10) includes an injector (14) and a spreading tube (16) connected with the injector. The injector contains therein a viscous thermal medium material for being spread on a surface of a cooling device for electronic components. The spreading tube defines therein at least one outlet hole (164) for release of the thermal medium material contained in the injector. The spreading device further includes means formed on the spreading tube for evenly distributing the material released through the outlet hole of the spreading tube over an entire area of the surface to be applied with the thermal medium material.
摘要翻译：扩散装置（10）包括与喷射器连接的喷射器（14）和扩散管（16）。喷射器中包含用于电子部件的冷却装置的表面上的粘性热介质材料。扩展管中限定有至少一个用于释放包含在喷射器中的热介质材料的出口孔（164）。扩展装置还包括形成在扩展管上的装置，用于将通过扩展管的出口孔释放的材料均匀地分布在待施加热介质材料的表面的整个区域上。

14. 发明申请

US20060266498A1 LIQUID COOLING SYSTEM SUITABLE FOR REMOVING HEAT FROM ELECTRONIC COMPONENTS 审中-公开
标题翻译：液体冷却系统适用于从电子元件中去除热量
公开(公告)号：US20060266498A1
公开(公告)日：2006-11-30
申请号：US11306914
申请日：2006-01-16
申请人： Tay-Jian Liu , Chih-Peng Lee
发明人： Tay-Jian Liu , Chih-Peng Lee
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A liquid cooling system (30) for removing heat from a heat-generating component is disclosed. The liquid cooling system includes a heat-absorbing member (50) defining therein a fluid flow channel (54) for passage of a coolant. The fluid flow channel includes a plurality of passage segments (54a, 54b, 54c) arranged from a center portion to a peripheral portion of the heat-absorbing member. Every two adjacent passage segments are in fluid communication with each other in such a manner that, when the coolant flows from one passage segment to enter into an adjacent passage segment, the coolant is divided into at least two currents flowing in different directions in the adjacent passage segment.
摘要翻译：公开了一种用于从发热部件除去热量的液体冷却系统（30）。液体冷却系统包括在其中限定用于冷却剂通过的流体流动通道（54）的吸热构件（50）。流体流动通道包括从吸热构件的中心部分到周边部分布置的多个通道段（54a，54b，54c）。每两个相邻的通道段彼此流体连通，使得当冷却剂从一个通道段流入相邻通道段时，冷却剂被分成至少两个在相邻的通道中沿不同方向流动的电流通道段

15. 发明申请

US20060260541A1 DEVICE FOR SPREADING VISCOUS THERMAL MEDIUM ON HEAT DISSIPATION DEVICE FOR ELECTRONIC COMPONENT 失效
标题翻译：用于电子元件热释放装置传播粘度热介质的装置
公开(公告)号：US20060260541A1
公开(公告)日：2006-11-23
申请号：US11307544
申请日：2006-02-13
申请人： Chih-Peng Lee , Tay-Jian Liu
发明人： Chih-Peng Lee , Tay-Jian Liu
IPC分类号： B05C5/00 , B05C11/02
CPC分类号： B05C7/06 , B05C5/02 , B23K3/0638 , B23K2101/14 , B23K2101/36 , F28D15/0275 , F28F1/32
摘要： A spreading device (10) includes an injector (14) and a spreading tube (16) connected with the injector. The injector contains therein a viscous thermal medium material for being spread on a surface of a cooling device for electronic components. The spreading tube defines therein at least one outlet hole (164) for release of the thermal medium material contained in the injector. The spreading device further includes means formed on the spreading tube for evenly distributing the material released through the outlet hole of the spreading tube over an entire area of the surface to be applied with the thermal medium material.
摘要翻译：扩散装置（10）包括与喷射器连接的喷射器（14）和扩散管（16）。喷射器中包含用于电子部件的冷却装置的表面上的粘性热介质材料。扩展管中限定有至少一个用于释放包含在喷射器中的热介质材料的出口孔（164）。扩展装置还包括形成在扩展管上的装置，用于将通过扩展管的出口孔释放的材料均匀地分布在待施加热介质材料的表面的整个区域上。

16. 发明申请

US20060196207A1 COOLING DEVICE FOR MULTIPLE HEAT-GENERATING COMPONENTS 失效
标题翻译：多个发热部件的冷却装置
公开(公告)号：US20060196207A1
公开(公告)日：2006-09-07
申请号：US11307009
申请日：2006-01-19
申请人： Chih-Peng Lee , Tay-Jian Liu
发明人： Chih-Peng Lee , Tay-Jian Liu
IPC分类号： F25D23/12 , F25B39/02
CPC分类号： H01L23/473 , F25B39/028 , F28D15/0266 , F28F3/12 , H01L2924/0002 , H01L2924/00
摘要： A cooling device for multiple heat generating components is disclosed, which includes an evaporator (1), a condenser (3), a vapor conduit (6), a liquid conduit (5) and a diffluent member (19). The evaporator includes at least two cooling members (15) for thermally contacting the multiple heat-generating components, respectively. Each of the cooling members defines therein a fluid flow channel (22) for passage of a refrigerant fluid. The vapor and liquid conduits each are connected between the cooling member and the condenser. The diffluent member is in fluid communication with the liquid conduit and the fluid flow channel of each of the cooling members. The diffluent member functions to evenly distribute the refrigerant fluid into the cooling members so as to maintain the same heat removal capacity for the cooling members.
摘要翻译：公开了一种用于多个发热部件的冷却装置，其包括蒸发器（1），冷凝器（3），蒸气导管（6），液体导管（5）和分流部件（19）。蒸发器包括分别用于热接触多个发热部件的至少两个冷却部件（15）。每个冷却构件中限定有用于制冷剂流体通过的流体流动通道（22）。蒸汽和液体导管各自连接在冷却构件和冷凝器之间。分流部件与液体管道和每个冷却部件的流体流动通道流体连通。分流部件用于将制冷剂流体均匀地分配到冷却部件中，以保持与冷却部件相同的散热能力。

17. 发明授权

US07472743B2 Liquid cooling system suitable for removing heat from electronic components 失效
标题翻译：液体冷却系统适用于从电子部件中除去热量
公开(公告)号：US07472743B2
公开(公告)日：2009-01-06
申请号：US11308375
申请日：2006-03-20
申请人： Tay-Jian Liu , Chih-Peng Lee
发明人： Tay-Jian Liu , Chih-Peng Lee
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A liquid cooling system (100) for removing heat from a heat-generating component is disclosed. The liquid cooling system includes a heat-absorbing member (20), a heat-dissipating member (30), a pump (50) and a mounting mechanism (10, 60). The heat-absorbing member defines therein a fluid flow channel (26) for passage of a coolant. The pump is in fluid communication with the heat-absorbing member and the heat-dissipating member for driving the coolant to circulate between the heat-absorbing member and the heat-dissipating member. The mounting mechanism includes a bottom portion (10) and a top portion (60) cooperating with the bottom portion to define therebetween a receiving space. The heat-absorbing member, heat-dissipating member and pump are received in the receiving space and are mounted to the mounting mechanism.
摘要翻译：公开了一种用于从发热部件除去热量的液体冷却系统（100）。液体冷却系统包括吸热构件（20），散热构件（30），泵（50）和安装机构（10,60）。吸热构件在其中限定有用于冷却剂通过的流体流动通道（26）。泵与吸热构件和散热构件流体连通，用于驱动冷却剂在吸热构件和散热构件之间循环。安装机构包括底部（10）和与底部部分配合以在其间限定容纳空间的顶部（60）。吸热构件，散热构件和泵容纳在容纳空间中并安装到安装机构。

18. 发明申请

US20060249278A1 LIQUID COOLING SYSTEM SUITABLE FOR REMOVING HEAT FROM ELECTRONIC COMPONENTS 失效
标题翻译：液体冷却系统适用于从电子元件中去除热量
公开(公告)号：US20060249278A1
公开(公告)日：2006-11-09
申请号：US11308375
申请日：2006-03-20
申请人： Tay-Jian Liu , Chih-Peng Lee
发明人： Tay-Jian Liu , Chih-Peng Lee
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A liquid cooling system (100) for removing heat from a heat-generating component is disclosed. The liquid cooling system includes a heat-absorbing member (20), a heat-dissipating member (30), a pump (50) and a mounting mechanism (10, 60). The heat-absorbing member defines therein a fluid flow channel (26) for passage of a coolant. The pump is in fluid communication with the heat-absorbing member and the heat-dissipating member for driving the coolant to circulate between the heat-absorbing member and the heat-dissipating member. The mounting mechanism includes a bottom portion (10) and a top portion (60) cooperating with the bottom portion to define therebetween a receiving space. The heat-absorbing member, heat-dissipating member and pump are received in the receiving space and are mounted to the mounting mechanism.
摘要翻译：公开了一种用于从发热部件除去热量的液体冷却系统（100）。液体冷却系统包括吸热构件（20），散热构件（30），泵（50）和安装机构（10,60）。吸热构件在其中限定有用于冷却剂通过的流体流动通道（26）。泵与吸热构件和散热构件流体连通，用于驱动冷却剂在吸热构件和散热构件之间循环。安装机构包括底部（10）和与底部部分配合以在其间限定容纳空间的顶部（60）。吸热构件，散热构件和泵容纳在容纳空间中并安装到安装机构。

19. 发明申请

US20060218955A1 Refrigeration system 失效
标题翻译：制冷系统
公开(公告)号：US20060218955A1
公开(公告)日：2006-10-05
申请号：US11094375
申请日：2005-03-30
申请人： Tay-Jian Liu , Chih-Peng Lee
发明人： Tay-Jian Liu , Chih-Peng Lee
IPC分类号： F25D17/02 , F25D23/12
CPC分类号： F25D19/006 , H01L23/4006 , H01L23/427 , H01L23/4338 , H01L2924/0002 , H01L2924/00
摘要： A mounting assembly (30) for mounting an evaporator (21) of a refrigeration system (20) to an electronic component (10) includes a housing member (31) and a clamping member (32). The housing member defines a through hole (33) with the electronic component located therein. The evaporator is received in the through hole and located in axial alignment with the electronic component. The evaporator defines therein a fluid flow channel (25) for passage of a refrigerant fluid. The refrigeration system is in fluid communication with the fluid flow channel of the evaporator to supply refrigerant fluid thereto. The clamping member is attached to the housing member and has an abutting portion (84) integrally formed therefrom for exerting an uniform force to the evaporator to maintain the evaporator in thermal contact with the electronic component.
摘要翻译：用于将制冷系统（20）的蒸发器（21）安装到电子部件（10）的安装组件（30）包括壳体构件（31）和夹紧构件（32）。壳体构件限定了电子部件位于其中的通孔（33）。蒸发器被容纳在通孔中并且与电子部件轴向对准。蒸发器在其中限定用于制冷剂流体通过的流体流动通道（25）。制冷系统与蒸发器的流体流动通道流体连通以向其供应制冷剂流体。夹紧构件附接到壳体构件并且具有由其一体地形成的邻接部分（84），用于向蒸发器施加均匀的力以保持蒸发器与电子部件热接触。

20. 发明授权

US08167466B2 LED illumination device and lamp unit thereof 失效
标题翻译： LED照明装置及其灯单元
公开(公告)号：US08167466B2
公开(公告)日：2012-05-01
申请号：US12478773
申请日：2009-06-05
申请人： Tay-Jian Liu
发明人： Tay-Jian Liu
IPC分类号： F21V29/00
CPC分类号： F21V29/004 , F21K9/20 , F21S8/02 , F21V29/506 , F21V29/507 , F21V29/51 , F21V29/77 , F21V29/777 , F21V29/83 , F21Y2103/10 , F21Y2107/10 , F21Y2113/00 , F21Y2115/10 , H01L2924/0002 , H01L2924/00
摘要： An LED illumination device includes a lampshade, and a plurality of lamp units mounted on the lampshade. Each lamp unit includes a light-emitting module having a plurality of light sources and a heat sink arranged above the light-emitting module. The heat sink includes an elongated base and a plurality of fins on the base. The base has an outer convex surface formed at a top side thereof and an opposite inner concave surface formed at a bottom side thereof. The fins extend outwardly from the convex surface of the base. The concave surface defines an elongated recess extending along an axial direction of the base. Two opposite free ends of the base are spaced from each other and cooperatively define a light emitting window below the concave surface. The light sources are received in the recess and thermally attached to the concave surface.
摘要翻译： LED照明装置包括灯罩和安装在灯罩上的多个灯单元。每个灯单元包括具有多个光源的发光模块和布置在发光模块上方的散热器。散热器包括细长基部和在基部上的多个翅片。基部具有形成在其顶侧的外凸面和形成在其底侧的相对的内凹面。翅片从底座的凸面向外延伸。凹形表面限定沿着基部的轴向方向延伸的细长凹部。基座的两个相对的自由端彼此间隔开，并协同地限定凹面下方的发光窗口。光源被容纳在凹部中并且热附着到凹面上。

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