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11. 发明授权

US5356512A Method of stacking ceramic green sheets 失效
标题翻译：堆叠陶瓷生片的方法
公开(公告)号：US5356512A
公开(公告)日：1994-10-18
申请号：US988222
申请日：1992-12-09
申请人： Takao Hosokawa
发明人： Takao Hosokawa
IPC分类号： H01G4/12 , B28B11/00 , B32B18/00 , H01G4/30 , H05K3/46 , B32B31/04
CPC分类号： H05K3/4611
摘要： To improve transferability for stacking ceramic green sheets through a transfer technique, a ceramic green sheet formed on a first back film is heated and pressurized by rolls so as to be transferred to a second back film. Thereafter, the transferred ceramic green sheet is compression bonded through a contact surface defined by a surface exposed by separation of the first back film to at least one other ceramic green sheet which has been already stacked.
摘要翻译：为了提高通过转印技术堆叠陶瓷生片的转印性，将形成在第一背面薄膜上的陶瓷生片通过辊加热并加压，从而转印到第二背面薄膜。此后，转移的陶瓷生片通过由通过分离第一后膜暴露的表面限定的接触表面压贴到已经堆叠的至少一个其它陶瓷生片中。

12. 发明授权

US08411410B2 Flat Ni particle, laminated ceramic electronic component using flat Ni particle, and production method flat Ni particle 有权
标题翻译：平面Ni颗粒，使用平面Ni颗粒的层压陶瓷电子部件，以及平面Ni颗粒的生产方法
公开(公告)号：US08411410B2
公开(公告)日：2013-04-02
申请号：US13403136
申请日：2012-02-23
申请人： Takao Hosokawa
发明人： Takao Hosokawa
IPC分类号： H01G4/00
CPC分类号： C25C5/02 , B22F1/0055 , B22F9/04 , H01G4/0085 , H01G4/30 , H01G9/042 , Y10T428/12014 , Y10T428/256 , Y10T428/2982
摘要： Provided is a flat Ni particle which has a large specific surface area, permitting efficient binder removal when the flat Ni particle is used for internal electrodes of a laminated ceramic electronic component. The flat Ni particle has a thickness t (m), a specific gravity ρ (g/m3), and a radius r (m), and a specific surface area S1 (m2/g), such that the specific surface area S1 is adapted to have a relationship of 1.5×S0
摘要翻译：提供一种具有大比表面积的扁平Ni颗粒，当平面Ni颗粒用于层压陶瓷电子部件的内部电极时，可以有效地除去粘合剂。平坦的Ni颗粒具有厚度t（m），比重＆rgr; （g / m3），半径r（m）和比表面积S1（m2 / g），使得比表面积S1适合于具有1.5×S0

13. 发明授权

US4708885A Manufacturing method for an electronic component 失效
标题翻译：电子部件的制造方法
公开(公告)号：US4708885A
公开(公告)日：1987-11-24
申请号：US932567
申请日：1986-11-20
申请人： Shigeki Saito , Takao Hosokawa , Masataka Mae
发明人： Shigeki Saito , Takao Hosokawa , Masataka Mae
IPC分类号： H01G4/12 , H01C1/144 , H01G2/10 , H01G2/12 , H01G4/224 , H01G13/00 , B05D5/12
CPC分类号： H01G2/12 , H01C1/144 , Y10T428/3154
摘要： A manufacturing method for an electronic component connected at a lead terminal thereof to electrodes at an element so that the element is coated at the surface with an over-coat resin, which prevents the lead terminal from being unnecessarily coated with the over-coat resin, thereby improving the automatic insertion efficiency of the electronic component with respect to a printed circuit board.An intermediate portion of the lead terminal positioned at the outer peripheral edge of the element is previously applied with a repellent against the over-coat resin, the lead terminal being mounted on the element and thereafter the element being dipped into the over-coat resin, so that the over-coat resin, when coated on the element, is prevented from adhering to the portion of lead terminal applied with the repellent, thereby avoiding creation of running of the over-coat resin at the lead terminal.
摘要翻译：一种电子元件的制造方法，其在引线端子处连接到元件上的电极，使得元件在表面被覆盖树脂涂覆，防止引线端子被不必要地涂覆过涂层树脂，从而提高电子部件相对于印刷电路板的自动插入效率。预先将位于元件的外周边缘处的引线端子的中间部分施加防止外涂层树脂的驱避剂，引线端子安装在元件上，然后元件浸入外涂层树脂中，使得当涂覆在元件上时，外涂层树脂被防止粘附到施加有驱避剂的引线端子部分，从而避免了在引线端子处产生外涂层树脂的运行。

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