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    • 11. 发明申请
    • STORAGE DEVICE AND METHOD FOR CONTROLLING STORAGE DEVICE
    • 存储装置和用于控制存储装置的方法
    • US20120198293A1
    • 2012-08-02
    • US13446034
    • 2012-04-13
    • Minoru MukaiKenji HirohataTomoko Monda
    • Minoru MukaiKenji HirohataTomoko Monda
    • G11C29/08G06F11/26
    • H05K3/341H05K3/3436H05K2201/10151H05K2201/10159H05K2203/163Y02P70/613
    • A storage device includes: a printed circuit board; a semiconductor memory package mounted on the printed circuit board via solder joints, the semiconductor memory package incorporating semiconductor memories; a sensor configured to measure a physical quantity relating to a state of the storage device; a database including a damage estimation model base to be used for estimating damage of the solder joints from the physical quantity measured by the sensor; a damage estimating module configured to calculate a damage estimation value of the solder joints from the physical quantity using the damage estimation model base; and a controller configured to control writing, reading, and erasure of electronic data to or from the semiconductor memories based on the damage estimation values calculated by the damage estimating module.
    • 存储装置包括:印刷电路板; 半导体存储器封装,其通过焊点安装在所述印刷电路板上,所述半导体存储器封装结合有半导体存储器; 被配置为测量与所述存储装置的状态有关的物理量的传感器; 数据库,包括用于从传感器测量的物理量估计焊点的损坏的损伤估计模型库; 损伤估计模块,被配置为使用所述损伤估计模型基础从所述物理量计算所述焊点的损伤估计值; 以及控制器,其被配置为基于由所述损伤估计模块计算出的损伤估计值来控制对所述半导体存储器的电子数据的写入,读取和擦除。
    • 13. 发明授权
    • Storage device and method for controlling storage device
    • 用于控制存储设备的存储设备和方法
    • US08482998B2
    • 2013-07-09
    • US13446034
    • 2012-04-13
    • Minoru MukaiKenji HirohataTomoko Monda
    • Minoru MukaiKenji HirohataTomoko Monda
    • G11C7/00
    • H05K3/341H05K3/3436H05K2201/10151H05K2201/10159H05K2203/163Y02P70/613
    • A storage device includes: a printed circuit board; a semiconductor memory package mounted on the printed circuit board via solder joints, the semiconductor memory package incorporating semiconductor memories; a sensor configured to measure a physical quantity relating to a state of the storage device; a database including a damage estimation model base to be used for estimating damage of the solder joints from the physical quantity measured by the sensor; a damage estimating module configured to calculate a damage estimation value of the solder joints from the physical quantity using the damage estimation model base; and a controller configured to control writing, reading, and erasure of electronic data to or from the semiconductor memories based on the damage estimation values calculated by the damage estimating module.
    • 存储装置包括:印刷电路板; 半导体存储器封装,其通过焊点安装在所述印刷电路板上,所述半导体存储器封装结合有半导体存储器; 被配置为测量与所述存储装置的状态有关的物理量的传感器; 数据库,包括用于从传感器测量的物理量估计焊点的损坏的损伤估计模型库; 损伤估计模块,被配置为使用所述损伤估计模型基础从所述物理量计算所述焊点的损伤估计值; 以及控制器,其被配置为基于由所述损伤估计模块计算出的损伤估计值来控制对所述半导体存储器的电子数据的写入,读取和擦除。
    • 14. 发明授权
    • Storage device and method for controlling storage device
    • 用于控制存储设备的存储设备和方法
    • US08189412B2
    • 2012-05-29
    • US12509555
    • 2009-07-27
    • Minoru MukaiKenji HirohataTomoko Monda
    • Minoru MukaiKenji HirohataTomoko Monda
    • G11C29/00
    • H05K3/341H05K3/3436H05K2201/10151H05K2201/10159H05K2203/163Y02P70/613
    • A storage device includes: a printed circuit board; a semiconductor memory package mounted on the printed circuit board via solder joints, the semiconductor memory package incorporating semiconductor memories; a sensor configured to measure a physical quantity relating to a state of the storage device; a database including a damage estimation model base to be used for estimating damage of the solder joints from the physical quantity measured by the sensor; a damage estimating module configured to calculate a damage estimation value of the solder joints from the physical quantity using the damage estimation model base; and a controller configured to control writing, reading, and erasure of electronic data to or from the semiconductor memories based on the damage estimation values calculated by the damage estimating module.
    • 存储装置包括:印刷电路板; 半导体存储器封装,其通过焊点安装在所述印刷电路板上,所述半导体存储器封装结合有半导体存储器; 被配置为测量与所述存储装置的状态有关的物理量的传感器; 数据库,包括用于从传感器测量的物理量估计焊点的损坏的损伤估计模型库; 损伤估计模块,被配置为使用所述损伤估计模型基础从所述物理量计算所述焊点的损伤估计值; 以及控制器,其被配置为基于由所述损伤估计模块计算出的损伤估计值来控制对所述半导体存储器的电子数据的写入,读取和擦除。
    • 15. 发明申请
    • STORAGE DEVICE AND METHOD FOR CONTROLLING STORAGE DEVICE
    • 存储装置和用于控制存储装置的方法
    • US20100082913A1
    • 2010-04-01
    • US12509555
    • 2009-07-27
    • Minoru MukaiKenji HirohataTomoko Monda
    • Minoru MukaiKenji HirohataTomoko Monda
    • G06F12/00G06F19/00
    • H05K3/341H05K3/3436H05K2201/10151H05K2201/10159H05K2203/163Y02P70/613
    • A storage device includes: a printed circuit board; a semiconductor memory package mounted on the printed circuit board via solder joints, the semiconductor memory package incorporating semiconductor memories; a sensor configured to measure a physical quantity relating to a state of the storage device; a database including a damage estimation model base to be used for estimating damage of the solder joints from the physical quantity measured by the sensor; a damage estimating module configured to calculate a damage estimation value of the solder joints from the physical quantity using the damage estimation model base; and a controller configured to control writing, reading, and erasure of electronic data to or from the semiconductor memories based on the damage estimation values calculated by the damage estimating module.
    • 存储装置包括:印刷电路板; 半导体存储器封装,其通过焊点安装在所述印刷电路板上,所述半导体存储器封装结合有半导体存储器; 被配置为测量与所述存储装置的状态有关的物理量的传感器; 数据库,包括用于从传感器测量的物理量估计焊点的损坏的损伤估计模型库; 损伤估计模块,被配置为使用所述损伤估计模型基础从所述物理量计算所述焊点的损伤估计值; 以及控制器,其被配置为基于由所述损伤估计模块计算出的损伤估计值来控制对所述半导体存储器的电子数据的写入,读取和擦除。
    • 16. 发明申请
    • LOAD CALCULATING DEVICE AND LOAD CALCULATING METHOD
    • 负载计算装置和负载计算方法
    • US20080249743A1
    • 2008-10-09
    • US12056020
    • 2008-03-26
    • Kenji HirohataMinoru MukaiKatsumi HisanoTakashi Kawakami
    • Kenji HirohataMinoru MukaiKatsumi HisanoTakashi Kawakami
    • G06F17/18G06F15/00
    • G01R31/2803
    • There is provided with a load calculating device including: a variable acquiring unit configured to acquire, as monitoring variables, a detected value by a sensor monitoring a state of a circuit board and a performance characteristic obtained by a tool monitoring performance of the circuit board; a first storage configured to store a first statistical model that is one of a regression model, an occurrence frequency distribution and a probability distribution; a second storage configured to store a second statistical model that is one of a regression model, an occurrence frequency distribution and a probability distribution; and an arithmetic processor configured to calculate the intermediate variable from the monitoring variables acquired by the variable acquiring unit according to the first statistical model and calculate the physical quantity from calculated intermediate variable according to the second statistical model.
    • 提供了一种负载计算装置,包括:变量获取单元,被配置为通过监视电路板的状态的传感器和通过电路板的工具监视性能获得的性能特性来获取检测值作为监视变量; 第一存储器,被配置为存储作为回归模型,出现频率分布和概率分布之一的第一统计模型; 第二存储器,被配置为存储作为回归模型,发生频率分布和概率分布之一的第二统计模型; 以及运算处理器,被配置为根据第一统计模型从由变量获取单元获取的监视变量中计算中间变量,并根据第二统计模型从计算的中间变量计算物理量。
    • 18. 发明授权
    • Load calculating device and load calculating method
    • 负荷计算装置和负荷计算方法
    • US07653510B2
    • 2010-01-26
    • US12056020
    • 2008-03-26
    • Kenji HirohataMinoru MukaiKatsumi HisanoTakashi Kawakami
    • Kenji HirohataMinoru MukaiKatsumi HisanoTakashi Kawakami
    • G06F17/18
    • G01R31/2803
    • A device and method for providing a load calculating device is presented. In one embodiment, a load calculating device can include a variable acquiring unit configured to acquire monitoring variables. The monitoring variables can include in a detected value by a sensor monitoring a state of a circuit board and a performance characteristic obtained by a tool monitoring performance of the circuit board. The device can also store a first statistical model that is one of a regression model, an occurrence frequency distribution and a probability distribution; a second storage configured to store a second statistical model that is one of a regression model, an occurrence frequency distribution and a probability distribution. An arithmetic processor can then be used to calculate the intermediate variable from the monitoring variables according to the first statistical model and calculate the physical quantity from calculated intermediate variable according to the second statistical model.
    • 提出了一种用于提供负载计算装置的装置和方法。 在一个实施例中,负载计算装置可以包括被配置为获取监视变量的变量获取单元。 监视变量可以通过监视电路板的状态的传感器和通过电路板的工具监视性能获得的性能特性包括在检测值中。 该装置还可以存储作为回归模型,出现频率分布和概率分布之一的第一统计模型; 第二存储器,被配置为存储作为回归模型,出现频率分布和概率分布之一的第二统计模型。 然后可以使用算术处理器根据第一统计模型从监测变量计算中间变量,并根据第二统计模型从计算的中间变量计算物理量。
    • 19. 发明授权
    • Monitoring device and monitoring method
    • 监控装置及监控方法
    • US08321157B2
    • 2012-11-27
    • US12729306
    • 2010-03-23
    • Takahiro OmoriKenji HirohataMinoru Mukai
    • Takahiro OmoriKenji HirohataMinoru Mukai
    • G01B7/16G01B21/32
    • G01R31/2849
    • A dummy junction which will break earlier than a target junction is arranged on a board. A history of load applied to the dummy junction until the dummy junction actually breaks is recorded, and an estimated lifetime of the target junction is calibrated when a lifetime of the dummy junction estimated by the history of the load is largely different from an actual lifetime of the dummy junction. The calibration is performed by subtracting a value of an unmeasurable load from the estimated lifetime of the target junction based on load ever applied to the target junction, and the unmeasurable load is calculated based on the difference of the actual lifetime and estimated lifetime of the dummy junction.
    • 在一个电路板上布置一个比目标结点更早断裂的虚拟连接点。 记录施加到虚拟结直到虚连接实际断开的负载的历史,并且当由负载历史估计的虚拟结的寿命与实际寿命的实际寿命大不相同时,校准目标结的估计寿命 虚拟连接点。 基于目标结点的负荷从目标结的估计寿命中减去不可测量的负载的值进行校准,并且基于虚拟的实际寿命和估计寿命的差异来计算不可测量的负载 交界处
    • 20. 发明申请
    • MONITORING DEVICE AND MONITORING METHOD
    • 监控设备和监控方法
    • US20100250149A1
    • 2010-09-30
    • US12729306
    • 2010-03-23
    • Takahiro OmoriKenji HirohataMinoru Mukai
    • Takahiro OmoriKenji HirohataMinoru Mukai
    • G06F19/00G01N25/00G01L1/00
    • G01R31/2849
    • A dummy junction which will break earlier than a target junction is arranged on a board. A history of load applied to the dummy junction until the dummy junction actually breaks is recorded, and an estimated lifetime of the target junction is calibrated when a lifetime of the dummy junction estimated by the history of the load is largely different from an actual lifetime of the dummy junction. The calibration is performed by subtracting a value of an unmeasurable load from the estimated lifetime of the target junction based on load ever applied to the target junction, and the unmeasurable load is calculated based on the difference of the actual lifetime and estimated lifetime of the dummy junction.
    • 在一个电路板上布置一个比目标结点更早断裂的虚拟连接点。 记录施加到虚拟结直到虚连接实际断开的负载的历史,并且当由负载历史估计的虚拟结的寿命与实际寿命的实际寿命大不相同时,校准目标结的估计寿命 虚拟连接点。 基于目标结点的负荷从目标结的估计寿命中减去不可测量的负载的值进行校准,并且基于虚拟的实际寿命和估计寿命的差异来计算不可测量的负载 交界处