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11. 发明申请

US20070024916A1 Method of displaying wallpaper and apparatus for displaying wallpaper 有权
标题翻译：显示墙纸的方法和显示壁纸的装置
公开(公告)号：US20070024916A1
公开(公告)日：2007-02-01
申请号：US11491230
申请日：2006-07-24
申请人： Sung-hwan Choi
发明人： Sung-hwan Choi
IPC分类号： G06K15/00
CPC分类号： G06F3/04845
摘要： A method of displaying wallpaper and an apparatus for displaying wallpaper includes displaying an input image to be displayed on wallpaper as a background image and a wallpaper displaying frame containing the entire image or a part of the input image on a wallpaper setting window, modifying a wallpaper displaying frame area according to a user's instruction, and displaying the modified frame area on the wallpaper. The apparatus for displaying wallpaper includes an application unit that displays an input image to be inputted as a background image for wallpaper and a wallpaper displaying frame containing the entire input image or a part of the input image on a wallpaper setting window, a modification unit that modifies a wallpaper displaying frame area specified by the application unit according to a user's instruction, and a wallpaper displaying unit that displays the frame area modified by the modification unit on the wallpaper.
摘要翻译：一种显示壁纸的方法和一种用于显示壁纸的装置，包括将在壁纸上显示的输入图像作为背景图像和在壁纸设置窗口上包含整个图像或输入图像的一部分的壁纸显示框，修改壁纸根据用户的指示显示帧区域，并在壁纸上显示修改的帧区域。用于显示壁纸的装置包括：应用单元，其将要输入的输入图像显示为用于壁纸的背景图像;以及壁纸显示框，其将包含整个输入图像或输入图像的一部分放置在壁纸设置窗口上;修改单元，根据用户的指示修改由应用单元指定的壁纸显示框区域;以及壁纸显示单元，其将由修改单元修改的框架区域显示在壁纸上。

12. 发明申请

US20090053034A1 Method of controlling pressure in a wafer transfer system 有权
标题翻译：控制晶片传送系统压力的方法
公开(公告)号：US20090053034A1
公开(公告)日：2009-02-26
申请号：US12285982
申请日：2008-10-17
申请人： Soo-woong Lee , Hyung-seok Choi , Jung-sung Hwang , Sung-hwan Choi
发明人： Soo-woong Lee , Hyung-seok Choi , Jung-sung Hwang , Sung-hwan Choi
IPC分类号： H01L21/677
CPC分类号： H01L21/67017 , H01L21/67772
摘要： A wafer transfer system, and method of controlling pressure in the system, includes a loadport for receiving a wafer container, a housing operably connected to the loadport, a wafer transfer mechanism for transferring a wafer between the wafer container and the housing, a wafer container sensor for detecting a presence of the wafer container on the loadport, a variable speed fan disposed in a first portion of the housing, a variable exhaust unit disposed in a second portion of the housing facing the first portion, the variable exhaust unit being capable of varying an exhaust rate of air from the housing, and a controller for variably operating the variable speed fan and the variable exhaust unit in response to a signal from the wafer container sensor.
摘要翻译：晶片传送系统和系统中的压力控制方法包括用于接收晶片容器的容纳端口，可操作地连接到负载端口的壳体，用于在晶片容器和壳体之间传送晶片的晶片传送机构，晶片容器传感器，用于检测装载口上的晶片容器的存在，设置在壳体的第一部分中的变速风扇，设置在面向第一部分的壳体的第二部分中的可变排气单元，该可变排气单元能够改变来自壳体的空气排出率，以及控制器，用于响应于来自晶片容器传感器的信号，可变地操作变速风扇和可变排气单元。

13. 发明授权

US07438514B2 Wafer transfer system 有权
标题翻译：晶圆转移系统
公开(公告)号：US07438514B2
公开(公告)日：2008-10-21
申请号：US10963541
申请日：2004-10-14
申请人： Soo-woong Lee , Hyung-seok Choi , Jung-sung Hwang , Sung-hwan Choi
发明人： Soo-woong Lee , Hyung-seok Choi , Jung-sung Hwang , Sung-hwan Choi
IPC分类号： B65G49/07
CPC分类号： H01L21/67017 , H01L21/67772
摘要： A wafer transfer system, and method of controlling pressure in the system, includes a loadport for receiving a wafer container, a housing operably connected to the loadport, a wafer transfer mechanism for transferring a wafer between the wafer container and the housing, a wafer container sensor for detecting a presence of the wafer container on the loadport, a variable speed fan disposed in a first portion of the housing, a variable exhaust unit disposed in a second portion of the housing facing the first portion, the variable exhaust unit being capable of varying an exhaust rate of air from the housing, and a controller for variably operating the variable speed fan and the variable exhaust unit in response to a signal from the wafer container sensor.
摘要翻译：晶片传送系统和系统中的压力控制方法包括用于接收晶片容器的容纳端口，可操作地连接到负载端口的壳体，用于在晶片容器和壳体之间传送晶片的晶片传送机构，晶片容器传感器，用于检测装载口上的晶片容器的存在，设置在壳体的第一部分中的变速风扇，设置在面向第一部分的壳体的第二部分中的可变排气单元，该可变排气单元能够改变来自壳体的空气排出率，以及控制器，用于响应于来自晶片容器传感器的信号，可变地操作变速风扇和可变排气单元。

14. 发明申请

US20060018736A1 Wafer transfer system and method of controlling pressure in the system 有权
标题翻译：晶圆转移系统和系统压力控制方法
公开(公告)号：US20060018736A1
公开(公告)日：2006-01-26
申请号：US10963541
申请日：2004-10-14
申请人： Soo-woong Lee , Hyung-seok Choi , Jung-sung Hwang , Sung-hwan Choi
发明人： Soo-woong Lee , Hyung-seok Choi , Jung-sung Hwang , Sung-hwan Choi
IPC分类号： H01L21/677
CPC分类号： H01L21/67017 , H01L21/67772
摘要： A wafer transfer system, and method of controlling pressure in the system, includes a loadport for receiving a wafer container, a housing operably connected to the loadport, a wafer transfer mechanism for transferring a wafer between the wafer container and the housing, a wafer container sensor for detecting a presence of the wafer container on the loadport, a variable speed fan disposed in a first portion of the housing, a variable exhaust unit disposed in a second portion of the housing facing the first portion, the variable exhaust unit being capable of varying an exhaust rate of air from the housing, and a controller for variably operating the variable speed fan and the variable exhaust unit in response to a signal from the wafer container sensor.
摘要翻译：晶片传送系统和系统中的压力控制方法包括用于接收晶片容器的容纳端口，可操作地连接到负载端口的壳体，用于在晶片容器和壳体之间传送晶片的晶片传送机构，晶片容器传感器，用于检测装载口上的晶片容器的存在，设置在壳体的第一部分中的变速风扇，设置在面向第一部分的壳体的第二部分中的可变排气单元，该可变排气单元能够改变来自壳体的空气排出率，以及控制器，用于响应于来自晶片容器传感器的信号，可变地操作变速风扇和可变排气单元。

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