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    • 19. 发明授权
    • Ink jet heater chip module
    • 喷墨加热器芯片模块
    • US6039439A
    • 2000-03-21
    • US100544
    • 1998-06-19
    • Steven Robert KomplinAshok MurthyCarl Edmond Sullivan
    • Steven Robert KomplinAshok MurthyCarl Edmond Sullivan
    • B41J2/14B41J2/05
    • B41J2/14072B41J2/14024B41J2/1404B41J2002/14387
    • A heater chip module is provided comprising a carrier adapted to be secured to an ink-filled container, at least one heater chip having a base coupled to the carrier, and at least one nozzle plate coupled to the heater chip. The carrier includes a support substrate having at least one passage which defines a path for ink to travel from the container to the heater chip. The heater chip is secured at its base to a portion of the support substrate. At least the portion of the support substrate is formed from a material having substantially the same coefficient of thermal expansion as the heater chip base. A flexible circuit is coupled to the heater chip module such as by TAB bonding or wire bonding.
    • 提供一种加热器芯片模块,其包括适于固定到填充墨水的容器的载体,至少一个加热器芯片,其具有联接到所述载体的底座,以及耦合到所述加热器芯片的至少一个喷嘴板。 载体包括具有至少一个通道的支撑基板,该通道限定油墨从容器行进到加热器芯片的路径。 加热器芯片在其底部固定到支撑基板的一部分。 至少所述支撑基板的所述部分由具有与所述加热器芯片基座基本上相同的热膨胀系数的材料形成。 柔性电路例如通过TAB键合或引线键合耦合到加热器芯片模块。