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12. 发明申请

US20090146786A1 MEASURING DEVICE 审中-公开
标题翻译：测量工具
公开(公告)号：US20090146786A1
公开(公告)日：2009-06-11
申请号：US12089540
申请日：2006-10-04
申请人： Akinori Toma , Shuji Kurokawa , Yoshiaki Sugishita
发明人： Akinori Toma , Shuji Kurokawa , Yoshiaki Sugishita
IPC分类号： H04Q5/22 , G01B11/26
CPC分类号： H01L21/67294 , G01B11/14 , G01B11/272 , H01L21/67132
摘要： [Problem to be Solved] To provide a measuring device preferable to enhance capability of pickup processing when picking up each chip of a plate-shaped member individually separated into a form of chips.[Solution] A semiconductor wafer 4 as a plate-shaped member supported by a support member H which is consisted of an adhesive sheet 3 and a ring frame 2, the adhesive sheet is stuck to an opening of the ring frame 2, and individually separated into a form of chips by cutting is set as a measurement target; an image processing unit 5 measures a chip interval G and a misalignment angle θ, and measurement data D of them is sent from the image processing unit 5 to a host computer 6, and stored in storage means 12 of the host computer 6; and based on the chip interval G and the misalignment angle θ stored in the storage means 12, position recognition processing at the time of confirming the position of a chip with a recognition unit of a pickup device, for example, a camera, and correction processing of aligning the position of a collet for pickup with the recognized position can be carried out in the next step.
摘要翻译： [待解决的问题]提供一种测量装置，其优选地在拾取单独分离成芯片形式的板状构件的每个芯片时提高拾取处理能力。 [解决方案]作为由由粘合片3和环形框架2构成的支撑构件H支撑的板状构件的半导体晶片4，将粘合片粘贴到环形框架2的开口，并且分离通过切割成芯片的形式被设定为测量对象; 图像处理单元5测量码片间隔G和不对准角度θ，并且它们的测量数据D从图像处理单元5发送到主计算机6，并存储在主计算机6的存储装置12中; 并且基于存储在存储装置12中的芯片间隔G和不对准角度θ，在用拾取装置的识别单元（例如相机）确认芯片的位置时的位置识别处理和校正处理可以在下一步骤中执行用于拾取的夹头的位置与识别的位置的对准。

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