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    • 11. 发明授权
    • Safety device for a winding apparatus
    • 卷绕装置的安全装置
    • US4458849A
    • 1984-07-10
    • US445720
    • 1982-11-30
    • Yuzuru MiyakeTakami SugiokaShoichi MurakamiHideaki Ibuki
    • Yuzuru MiyakeTakami SugiokaShoichi MurakamiHideaki Ibuki
    • B65H54/74B65H54/44B65H59/38B65H63/00B65H63/06B65H63/04
    • B65H54/44B65H59/385B65H2701/31
    • A safety device of a spindle drive type winding apparatus wherein the rotational speed of a spindle on which a yarn package is formed is controlled in accordance with a peripheral speed of a yarn package formed on the spindle or tension in yarn to be wound to form a yarn package in such a manner that the rotational speed is gradually decreased during a normal winding operation. The device comprises:a member for detecting the driving rotational speed of the spindle;a minimum value holding member for holding the minimum value of the driving rotational speed of the spindle from the start of the normal winding operation to the time just before the measurement of the rotational speed by means of the detecting member; anda member for comparing the rotational speed detected by the detecting member with the minimum value held in the minimum value holding member and for emitting a stop signal to the winding apparatus when the rotational speed is larger than the minimum value by at least a predetermined allowance.
    • 一种主轴驱动式卷绕装置的安全装置,其中,形成有纱线卷装的主轴的旋转速度根据主轴上形成的纱线卷装的圆周速度或待卷绕的纱线的张力进行控制,形成 纱线卷装的方式使得在正常卷绕操作期间转速逐渐降低。 该装置包括:用于检测主轴的驱动转速的构件; 最小值保持构件,其用于将所述主轴的驱动旋转速度的最小值从正常卷绕操作开始到通过所述检测构件测量所述旋转速度之前的时间; 以及用于将由检测构件检测的转速与保持在最小值保持构件中的最小值进行比较的构件,并且当转速大于最小值至少预定容许量时,向卷绕装置发出停止信号 。
    • 12. 发明申请
    • APPARATUS, METHOD AND PROGRAM FOR MANUFACTURING NITRIDE FILM
    • 装置,方法和程序制造氮化物膜
    • US20140220711A1
    • 2014-08-07
    • US14238289
    • 2012-05-22
    • Shoichi MurakamiMasayasu Hatashita
    • Shoichi MurakamiMasayasu Hatashita
    • H01L21/02H01L21/66
    • H01L21/0217C23C16/345C23C16/509H01L21/0214H01L21/02274H01L22/12
    • A nitride film manufacturing apparatus forms a nitride film on a substrate provided in a chamber by a plasma CVD technique. Specifically, the nitride film manufacturing apparatus includes a controller for calculating a first period for applying first high-frequency power having a relatively high frequency and a second period for applying second high-frequency power having a relatively low frequency in order to obtain desired compressive stress or tensile stress of the nitride film, based on distribution of a refractive index of the nitride film and/or distribution of a deposition rate of the nitride film, the distribution falling within a predetermined numerical range and being obtained using the first high-frequency power and/or the second high-frequency power applied independently for forming the nitride film.
    • 氮化膜制造装置通过等离子体CVD技术在设置在室中的基板上形成氮化膜。 具体而言,氮化膜制造装置包括:控制器,用于计算用于施加具有较高频率的第一高频电力的第一周期和用于施加具有相对较低频率的第二高频功率的第二周期,以获得期望的压缩应力 或氮化物膜的拉伸应力,基于氮化物膜的折射率的分布和/或氮化物膜的沉积速率的分布,该分布落在预定数值范围内并且使用第一高频功率获得 和/或独立地施加的用于形成氮化物膜的第二高频电力。
    • 13. 发明申请
    • Etching Method
    • 蚀刻方法
    • US20130115772A1
    • 2013-05-09
    • US13809624
    • 2011-07-11
    • Akimitsu OishiShoichi Murakami
    • Akimitsu OishiShoichi Murakami
    • H01L21/3065
    • H01L21/30655H01L29/1608
    • The present invention relates to an etching method of capable of etching a silicon carbide substrate with a higher accuracy. A first etching step in which a silicon carbide substrate K is heated to a temperature equal to or higher than 200° C., SF6 gas is supplied into a processing chamber and plasma is generated from the SF6 gas, and a bias potential is applied to a platen, thereby isotropically etching the silicon carbide substrate K, and a second etching step in which the silicon carbide substrate K is heated to a temperature equal to or higher than 200° C., SF6 gas and O2 gas are supplied into the processing chamber and plasma is generated from the SF6 gas and the O2 gas, and a bias potential is applied to the platen on which the silicon carbide substrate K is placed, thereby etching the silicon carbide substrate K while forming a silicon oxide film as passivation film on the silicon carbide substrate K are alternately repeated.
    • 本发明涉及能够以更高的精度蚀刻碳化硅衬底的蚀刻方法。 将碳化硅衬底K加热至等于或高于200℃的第一蚀刻步骤,将SF 6气体供应到处理室中,并从SF 6气体产生等离子体,并将偏置电位施加到 压板,从而各向同性蚀刻碳化硅衬底K;以及第二蚀刻步骤,其中将碳化硅衬底K加热到等于或高于200℃的温度,将SF 6气体和O 2气体供应到处理室 并且从SF 6气体和O 2气体产生等离子体,并且将偏置电位施加到其上放置碳化硅衬底K的压板上,从而蚀刻碳化硅衬底K,同时在其上形成氧化硅膜作为钝化膜 交替地重复碳化硅衬底K.
    • 15. 发明授权
    • Etching method and etching apparatus
    • 蚀刻方法和蚀刻装置
    • US07754613B2
    • 2010-07-13
    • US11459646
    • 2006-07-25
    • Shoichi MurakamiTakashi YamamotoTatsuo Hiramura
    • Shoichi MurakamiTakashi YamamotoTatsuo Hiramura
    • H01L21/311H01L21/461H01L21/302
    • H01L21/67069H01J37/32082H01J37/32449H01J37/32706H01J2237/334H01L21/30655
    • Etching and protective-film deposition operations E and D are in alternation repeatedly executed on a silicon substrate carried on a platform within a processing chamber. With gas inside the processing chamber having been exhausted to pump down the chamber interior, in the etching operation E, the substrate is etched by supplying etching gas into the chamber and converting it into plasma and applying a bias potential to the platform, and in the protective-film deposition operation D, a protective film is formed on the silicon substrate by supplying protective-film deposition gas into the processing chamber and converting it into plasma. When a predetermined time prior to the close of operations E and D (time intervals indicated by reference marks Ee and De) is reached, the supply of etching or protective-film deposition gas is halted, and the exhaust flow rate of gas exhausted from the chamber is made greater than that previously.
    • 蚀刻和保护膜沉积操作E和D在处理室内的平台上承载的硅衬底上重复执行。 由于处理室内的气体已被排出以抽空腔室内部,所以在蚀刻操作E中,通过向腔室中提供蚀刻气体并将其转换成等离子体并向平台施加偏置电位来蚀刻衬底,并且在 保护膜沉积操作D,通过向处理室中提供保护膜沉积气体并将其转换成等离子体,在硅衬底上形成保护膜。 当达到操作结束E和D(由参考标记Ee和De指示的时间间隔)之前的预定时间时,停止供应蚀刻或保护膜沉积气体,并且从 室比以前更大。
    • 17. 发明授权
    • Yarn winding apparatus
    • 纱线缠绕装置
    • US4494702A
    • 1985-01-22
    • US437523
    • 1982-10-29
    • Yuzuru MiyakeTakami SugiokaShoichi MurakamiHideaki Ibuki
    • Yuzuru MiyakeTakami SugiokaShoichi MurakamiHideaki Ibuki
    • B65H59/38B65H54/02B65H54/38
    • B65H59/385B65H2701/31
    • A spindle drive type winding apparatus wherein a spindle onto which a bobbin for winding a yarn thereonto to form a yarn package is inserted is driven so that a predetermined winding factor is controlled in accordance with a predetermined program. The spindle drive type winding apparatus is provided with a control device which comprises:a peripheral speed detector for detecting the peripheral speed of the yarn package and generating a peripheral speed signal;a control for controlling the rotational speed of the spindle and generating a control signal;a circuit for calculating the wound amount of the yarn package based on the peripheral speed signal emitted from the peripheral speed detector and the signal emitted from the control and for generating a radius signal; anda function generator for emitting a programmed winding signal obtained in accordance with a pattern based on theradius signal emitted from the calculating circuit.The winding factor may be a peripheral speed of the yarn package, and in this case the peripheral speed is detected by means of the peripheral speed detector.The winding factor may be tension in wound yarn, and in this case the tension in yarn is detected by means of a tension detector.The winding apparatus may be driven at a constant wind ratio or at a constant wind angle.
    • 一种主轴驱动式卷绕装置,其中插入有用于将纱线卷绕在其上以形成纱线卷装的筒管的主轴,以便根据预定程序来控制预定的卷绕系数。 主轴驱动式卷绕装置设有控制装置,该控制装置包括:圆周速度检测器,用于检测纱线卷装的圆周速度并产生圆周速度信号; 用于控制主轴的转速并产生控制信号的控制; 基于从所述圆周速度检测器发出的圆周速度信号和从所述控制发出的信号计算所述纱线卷绕量的电路,用于产生半径信号; 以及功能发生器,用于根据从计算电路发出的半径信号,发出根据模式获得的编程绕组信号。 卷绕系数可以是纱线卷装的圆周速度,在这种情况下,通过圆周速度检测器检测圆周速度。 绕线因素可能是缠绕纱线的张力,在这种情况下,通过张力检测器检测纱线中的张力。 卷绕装置可以以恒定的风量或恒定的风向被驱动。
    • 20. 发明授权
    • Apparatus, method and program for manufacturing nitride film
    • 用于制造氮化物膜的装置,方法和程序
    • US09117660B2
    • 2015-08-25
    • US14238289
    • 2012-05-22
    • Shoichi MurakamiMasayasu Hatashita
    • Shoichi MurakamiMasayasu Hatashita
    • H01L21/02C23C16/34C23C16/509H01L21/66
    • H01L21/0217C23C16/345C23C16/509H01L21/0214H01L21/02274H01L22/12
    • A nitride film manufacturing apparatus forms a nitride film on a substrate provided in a chamber by a plasma CVD technique. Specifically, the nitride film manufacturing apparatus includes a controller for calculating a first period for applying first high-frequency power having a relatively high frequency and a second period for applying second high-frequency power having a relatively low frequency in order to obtain desired compressive stress or tensile stress of the nitride film, based on distribution of a refractive index of the nitride film and/or distribution of a deposition rate of the nitride film, the distribution falling within a predetermined numerical range and being obtained using the first high-frequency power and/or the second high-frequency power applied independently for forming the nitride film.
    • 氮化膜制造装置通过等离子体CVD技术在设置在室中的基板上形成氮化膜。 具体而言,氮化膜制造装置包括:控制器,用于计算用于施加具有较高频率的第一高频电力的第一周期和用于施加具有相对较低频率的第二高频功率的第二周期,以获得期望的压缩应力 或氮化物膜的拉伸应力,基于氮化物膜的折射率的分布和/或氮化物膜的沉积速率的分布,该分布落在预定数值范围内并且使用第一高频功率获得 和/或独立地施加的用于形成氮化物膜的第二高频电力。