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11. 发明申请

US20180042115A1 ELECTRONIC COMPONENT-EMBEDDED BOARD AND ELECTRONIC COMPONENT DEVICE 审中-公开
公开(公告)号：US20180042115A1
公开(公告)日：2018-02-08
申请号：US15658532
申请日：2017-07-25
申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
发明人： Junji Sato , Katsuya Fukase
IPC分类号： H05K1/18 , H01L21/48 , H01L21/683 , H01L23/13 , H01L23/498
CPC分类号： H05K1/186 , H01L21/4857 , H01L21/486 , H01L21/6836 , H01L23/13 , H01L23/145 , H01L23/15 , H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L24/16 , H01L2221/68345 , H01L2221/68359 , H01L2224/16227 , H01L2924/19041 , H01L2924/19102 , H05K2201/10015 , H05K2201/10515 , H05K2201/10522
摘要： An electronic component-embedded board includes: a core substrate; a cavity which penetrates the core substrate; a wiring layer formed on one face of the core substrate; a component mounting pattern formed of the same material as the wiring layer and laid across the cavity to partition the cavity into through holes in plan view; an electronic component mounted on the component mounting pattern and arranged inside the cavity; a first insulating layer formed on the one face of the core substrate to cover one face of the electronic component; and a second insulating layer formed on the other face of the core substrate to cover the other face of the electronic component. The cavity is filled with the first insulating layer and the second insulating layer.

12. 发明授权

US09313894B2 Wiring substrate and manufacturing method of wiring substrate 有权
标题翻译：布线基板的布线基板和制造方法
公开(公告)号：US09313894B2
公开(公告)日：2016-04-12
申请号：US14295721
申请日：2014-06-04
申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
发明人： Takayuki Kiwanami , Junji Sato , Katsuya Fukase
IPC分类号： H05K1/16 , H05K1/18 , H05K3/46 , H05K1/11
CPC分类号： H05K1/185 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2924/15311 , H05K1/113 , H05K1/18 , H05K1/182 , H05K3/4602 , H05K3/4644 , H05K3/4697 , H05K2201/10636 , Y02P70/611
摘要： A wiring substrate includes a core, a first wiring layer formed on a first surface of the core, a second wiring layer formed on a second surface of the core, and an electronic component partially accommodated in the cavity and including a projected portion projected from the first opening of the core. A first insulating layer covers a side surface of the electronic component and the first surface of the core and fills a portion of the cavity. A second insulating layer covers the first insulating layer. A third insulating layer covers the second surface of the core. The remainder of the cavity that is not filled with the first insulating layer is filled with the third insulating layer.
摘要翻译：布线基板包括芯，形成在芯的第一表面上的第一布线层，形成在芯的第二表面上的第二布线层和部分地容纳在空腔中的电子部件，并且包括从所述芯首先打开核心。第一绝缘层覆盖电子部件的侧表面和芯的第一表面并填充空腔的一部分。第二绝缘层覆盖第一绝缘层。第三绝缘层覆盖芯的第二表面。未填充有第一绝缘层的空腔的其余部分填充有第三绝缘层。

13. 发明授权

US09247646B2 Electronic component built-in substrate and method of manufacturing the same 有权
标题翻译：电子元件内置基板及其制造方法
公开(公告)号：US09247646B2
公开(公告)日：2016-01-26
申请号：US13904447
申请日：2013-05-29
申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
发明人： Junji Sato , Tomohiro Nomura , Kazuhiro Oshima
IPC分类号： H05K1/18 , H05K3/46
CPC分类号： H05K1/185 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2924/15313 , H05K3/4602 , H05K3/4652 , H05K2201/0195 , H05K2201/10636 , H05K2203/0191 , Y02P70/611
摘要： An electronic component built-in substrate comprises a substrate having a core member with an opening in which an electronic component is disposed, a first auxiliary insulating layer formed on a first surface of the core member; a second auxiliary insulating layer formed on a second surface of the core member, the second auxiliary insulating layer having a first via hole, a filling resin portion filling a gap between the electronic component and a side surface of the opening of the core member, and a first wiring layer formed on the second auxiliary insulating layer and connected to the connection terminal of the electronic component through the first via hole. The whole of the first surface and the whole of the second surface of the core member are in direct contact with the first auxiliary insulating layer and the second auxiliary insulating layer, respectively.
摘要翻译：电子部件内置基板包括具有芯部件的基板，所述芯部件具有设置有电子部件的开口，形成在所述芯部件的第一表面上的第一辅助绝缘层; 第二辅助绝缘层，形成在所述芯构件的第二表面上，所述第二辅助绝缘层具有第一通孔，填充所述电子部件之间的间隙和所述芯部件的开口的侧表面的填充树脂部分，以及第一布线层，形成在第二辅助绝缘层上，并通过第一通孔连接到电子部件的连接端子。芯构件的第一表面和整个第二表面的整体分别与第一辅助绝缘层和第二辅助绝缘层直接接触。

14. 发明授权

US10321574B2 Electronic component-embedded substrate and electronic component device 有权
公开(公告)号：US10321574B2
公开(公告)日：2019-06-11
申请号：US15718280
申请日：2017-09-28
申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
发明人： Junji Sato , Katsuya Fukase
IPC分类号： H05K1/18 , H01L21/48 , H01L23/31 , H01L23/498 , H01L23/00 , H05K1/11 , H05K3/00 , H05K3/30 , H05K3/46
摘要： An electronic component-embedded substrate includes a core substrate, a cavity penetrating the core substrate, a wiring layer formed on one surface of the core substrate, a support pattern extending over the cavity and configured to divide the cavity into a plurality of component embedding areas, an insulation wall portion arranged on a part of the support pattern in the cavity and formed of the same material as the core substrate, a plurality of electronic components each of which is mounted in each of the plurality of component embedding areas, and an insulating material filling an inside of the cavity.

15. 发明授权

US10080293B2 Electronic component-embedded board and electronic component device 有权
公开(公告)号：US10080293B2
公开(公告)日：2018-09-18
申请号：US15658532
申请日：2017-07-25
申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
发明人： Junji Sato , Katsuya Fukase
IPC分类号： H05K1/16 , H05K1/18 , H01L23/13 , H01L23/498 , H01L21/683 , H01L21/48 , H01L23/00
CPC分类号： H05K1/186 , H01L21/4857 , H01L21/486 , H01L21/6836 , H01L23/13 , H01L23/145 , H01L23/15 , H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/73 , H01L2221/68345 , H01L2221/68359 , H01L2224/13101 , H01L2224/16225 , H01L2224/16227 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/92125 , H01L2924/15311 , H01L2924/19041 , H01L2924/19102 , H05K1/181 , H05K3/4644 , H05K2201/10015 , H05K2201/10515 , H05K2201/10522 , H01L2924/014 , H01L2924/00014 , H01L2924/00012
摘要： An electronic component-embedded board includes: a core substrate; a cavity which penetrates the core substrate; a wiring layer formed on one face of the core substrate; a component mounting pattern formed of the same material as the wiring layer and laid across the cavity to partition the cavity into through holes in plan view; an electronic component mounted on the component mounting pattern and arranged inside the cavity; a first insulating layer formed on the one face of the core substrate to cover one face of the electronic component; and a second insulating layer formed on the other face of the core substrate to cover the other face of the electronic component. The cavity is filled with the first insulating layer and the second insulating layer.

16. 发明申请

US20160322289A1 WIRING SUBSTRATE 有权
标题翻译：接线基板
公开(公告)号：US20160322289A1
公开(公告)日：2016-11-03
申请号：US15138503
申请日：2016-04-26
申请人： Shinko Electric Industries Co., Ltd.
发明人： Kazuhiro KOBAYASHI , Junji Sato , Yasuhiko KUSAMA
IPC分类号： H01L23/498
CPC分类号： H01L23/49822 , H01L23/3128 , H01L23/50 , H01L24/16 , H01L24/32 , H01L24/73 , H01L25/105 , H01L2224/16227 , H01L2224/1703 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/73204 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2924/15311 , H01L2924/15331 , H01L2924/15333 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A wiring substrate includes a first wiring layer, a first insulation layer, and a second wiring layer. The first insulation layer covers an upper surface and a side surface of the first wiring layer and exposes a lower surface of the first wiring layer. The second wiring layer is stacked on at least one of a lower surface of the first insulation layer and the lower surface of the first wiring layer.
摘要翻译：布线基板包括第一布线层，第一绝缘层和第二布线层。第一绝缘层覆盖第一布线层的上表面和侧表面，并暴露第一布线层的下表面。第二布线层堆叠在第一绝缘层的下表面和第一布线层的下表面中的至少一个上。

17. 发明授权

US09331011B2 Electronic component built-in substrate and method of manufacturing the same 有权
标题翻译：电子元件内置基板及其制造方法
公开(公告)号：US09331011B2
公开(公告)日：2016-05-03
申请号：US14221567
申请日：2014-03-21
申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
发明人： Takayuki Kiwanami , Junji Sato
IPC分类号： H01L23/053 , H01L23/498 , H01L23/485 , H01L23/13 , H01L23/538
CPC分类号： H01L23/49894 , H01L23/13 , H01L23/485 , H01L23/49822 , H01L23/5389 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/1517 , H01L2924/15311 , H05K1/185 , H05K3/4602 , H05K2201/10636 , H05K2203/1469 , H01L2924/00012 , H01L2924/00
摘要： An electronic component built-in substrate, includes, a substrate having an opening portion, a first wiring layer formed in the substrate, an electronic component arranged in the opening portion, a first insulating layer formed on one face of the substrate and sealing the electronic component, a second insulating layer formed on other face of the substrate, a second wiring layer formed on the first insulating layer, and a third wiring layer formed on the second insulating layer. The first insulating layer is formed of an inner insulating layer covering the one face of the substrate and filling an inside of the opening portion, and an outer insulating layer formed on the inner insulating layer.
摘要翻译：电子部件内置基板包括：具有开口部的基板;形成在基板中的第一布线层;布置在开口部的电子部件;形成在基板的一个面上的第一绝缘层，形成在所述基板的另一面上的第二绝缘层，形成在所述第一绝缘层上的第二布线层和形成在所述第二绝缘层上的第三布线层。所述第一绝缘层由覆盖所述基板的一个面的内部绝缘层形成，并且填充所述开口部的内部，以及形成在所述内部绝缘层上的外部绝缘层。

18. 发明申请

US20150041053A1 Method of Manufacturing Wiring Substrate 有权
标题翻译：制造接线基板的方法
公开(公告)号：US20150041053A1
公开(公告)日：2015-02-12
申请号：US14446794
申请日：2014-07-30
申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
发明人： Takayuki Kiwanami , Junji Sato , Katsuya FUKASE
IPC分类号： H05K3/00 , H05K3/10 , H05K3/44
CPC分类号： H05K3/0097 , H01L2224/16227 , H01L2224/73204 , H01L2924/15311 , H01L2924/3511 , H05K1/0271 , H05K1/185 , H05K3/4602
摘要： A method of manufacturing a wiring substrate includes forming a pair of core substrates, each including a cavity; applying a film that covers the cavity to each core substrates; adhering an electronic component to the film in the cavity of each of the core substrates; arranging a support between the core substrates and a first insulator between the support and the core substrates; stacking the core substrates, the support, and the first insulators so that the first insulators form first insulation layers on the first surfaces of the core substrates, the cavities are filled with the first insulators, and the first insulators fix the corresponding electronic components to the corresponding core substrates; removing the film from the core substrates; and separating the core substrates from the support to separate the core substrates from each other.
摘要翻译：制造布线基板的方法包括形成一对芯基板，每个芯基板包括空腔; 将覆盖空腔的膜施加到每个芯基板上; 将电子部件粘附到每个芯基板的空腔中的膜上; 在所述芯基板之间布置支撑件，以及所述支撑件和所述芯基板之间的第一绝缘体; 堆叠芯基板，支撑件和第一绝缘体，使得第一绝缘体在芯基板的第一表面上形成第一绝缘层，空腔被第一绝缘体填充，并且第一绝缘体将相应的电子元件固定到相应的芯基板; 从芯基板上去除膜; 并且将芯基板与支撑件分离以将芯基板彼此分离。

19. 发明授权

US08867225B2 Wiring board 有权
标题翻译：接线板
公开(公告)号：US08867225B2
公开(公告)日：2014-10-21
申请号：US13973346
申请日：2013-08-22
申请人： Shinko Electric Industries Co., Ltd.
发明人： Junji Sato
IPC分类号： H05K1/18
CPC分类号： H05K1/184 , H01L2224/16227 , H01L2924/15311 , H05K1/185 , H05K3/4644 , H05K2201/10636 , H05K2203/1461 , Y02P70/611
摘要： A wiring board includes: a core layer having a through hole therethrough and comprising a first surface and a second surface opposite to the first surface; a first wiring layer formed on the first surface of the core layer and having a first opening which is communicated with the through hole, wherein an opening area of the first opening is larger than that of the through hole in a plan view; an electronic component disposed in the through hole and the first opening and having a first surface, and a second surface opposite to the first surface, the electronic component further having a pair of terminal on the first surface thereof; and a first resin layer filled in the through hole, the first opening and a gap between the pair of terminals so as to cover the second surface and the side surface of the electronic component.
摘要翻译：布线板包括：具有穿过其中的通孔的芯层，包括第一表面和与第一表面相对的第二表面; 第一布线层，其形成在所述芯层的所述第一表面上，并且具有与所述通孔连通的第一开口，其中在所述平面图中所述第一开口的开口面积大于所述通孔的开口面积; 设置在所述通孔和所述第一开口中并且具有第一表面的电子部件和与所述第一表面相对的第二表面，所述电子部件还在其第一表面上具有一对端子; 以及填充在通孔中的第一树脂层，第一开口和一对端子之间的间隙，以覆盖电子部件的第二表面和侧表面。

20. 发明申请

US20140063763A1 WIRING BOARD 有权
标题翻译：接线板
公开(公告)号：US20140063763A1
公开(公告)日：2014-03-06
申请号：US13973346
申请日：2013-08-22
申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
发明人： Junji Sato
IPC分类号： H05K1/18
CPC分类号： H05K1/184 , H01L2224/16227 , H01L2924/15311 , H05K1/185 , H05K3/4644 , H05K2201/10636 , H05K2203/1461 , Y02P70/611
摘要： A wiring board includes: a core layer having a through hole therethrough and comprising a first surface and a second surface opposite to the first surface; a first wiring layer formed on the first surface of the core layer and having a first opening which is communicated with the through hole, wherein an opening area of the first opening is larger than that of the through hole in a plan view; an electronic component disposed in the through hole and the first opening and having a first surface, and a second surface opposite to the first surface, the electronic component further having a pair of terminal on the first surface thereof; and a first resin layer filled in the through hole, the first opening and a gap between the pair of terminals so as to cover the second surface and the side surface of the electronic component.
摘要翻译：布线板包括：具有穿过其中的通孔的芯层，包括第一表面和与第一表面相对的第二表面; 第一布线层，其形成在所述芯层的所述第一表面上，并且具有与所述通孔连通的第一开口，其中在所述平面图中所述第一开口的开口面积大于所述通孔的开口面积; 设置在所述通孔和所述第一开口中并且具有第一表面的电子部件和与所述第一表面相对的第二表面，所述电子部件还在其第一表面上具有一对端子; 以及填充在通孔中的第一树脂层，第一开口和一对端子之间的间隙，以覆盖电子部件的第二表面和侧表面。

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