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11. 发明授权

US4625463A Wafer attracting and fixing device 失效
标题翻译：晶圆吸引和固定装置
公开(公告)号：US4625463A
公开(公告)日：1986-12-02
申请号：US708626
申请日：1985-03-06
申请人： Shinji Sekiya
发明人： Shinji Sekiya
IPC分类号： B24B41/06 , H01L21/302 , H01L21/683
CPC分类号： B24B41/068 , B24B37/30 , H01L21/302 , H01L21/6838
摘要： A work head for attracting and fixing an IC silicon wafer is comprised of an attracting disc and a base seat surrounding the periphery of the attracting disk. The attracting disc is of an inorganic substance shaped and sintered so that the upper layer of the attracting disc is composed of a porous body of porous grain and the lower layer the attracting body is formed with a slightly coarse body of porous grain.The base seat is made airtight being formed and sintered with the same substance as the attracting disc. The attracting disc and the base seat are coupled with glass having a low melting point. The attracting disc is connected to a connecting hole drilled through the base seat and further to a water injecting hole and air sucking hole of a lower base. Before the wafer is attracted, water is injected from the injection hole for soaking the attracting surface. The surface tension of water transfers the wafer to the center of the attracting surface. Hereafter, the wafer is attracted onto the attracting surface by sucking air out. After the working, water is injected again for floating the wafer.
摘要翻译：用于吸引和固定IC硅晶片的工作头包括吸引盘和围绕吸引盘周边的基座。吸引盘是无机物质成形和烧结的，使得吸引盘的上层由多孔颗粒的多孔体组成，而下层吸引体形成有稍微粗大的多孔颗粒体。基座被气密地形成并与吸引盘相同的物质烧结。吸引盘和基座与具有低熔点的玻璃结合。吸引盘连接到穿过基座的连接孔，并且进一步连接到下底座的注水孔和空气吸入孔。在晶片被吸引之前，从喷射孔注入水以浸泡吸引表面。水的表面张力将晶片转移到吸引表面的中心。此后，通过吸出空气将晶片吸引到吸引表面上。工作后，再次注入水以漂浮晶片。

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