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    • 13. 发明申请
    • Coupled Member Made of a Plurality of Sensor Chips and Manufacturing Method Thereof
    • 传感器芯片制造的耦合构件及其制造方法
    • US20080129280A1
    • 2008-06-05
    • US11795902
    • 2006-01-23
    • Shingo KaimoriToshifumi HosoyaMoriyasu IchinoHideaki NakamuraMasao GotohFumiyo KurusuTomoko IshikawaIsao Karube
    • Shingo KaimoriToshifumi HosoyaMoriyasu IchinoHideaki NakamuraMasao GotohFumiyo KurusuTomoko IshikawaIsao Karube
    • G01N27/327
    • B82Y5/00G01N33/4875Y10T29/49002
    • A coupled member made of a plurality of sensor chips is featured by that adjacent sensor chips are coupled to each other under cuttable condition; the respective sensor chips can be cut and piece-separated from the coupled member in a higher efficiency; and even after the sensor chips are piece-separated, these sensor chips can be readily and quickly stored in containers thereof; and furthermore, the sensor chips can be easily checked and failure chips can be readily removed. More specifically, a method for manufacturing a coupled member made of the plurality of sensor chips is provided in which such sensor chips are coupled to each other under cuttable conditions, while each of these sensor chips includes: a base plate; a cover layer; a hollow reaction portion provided between the base plate and the cover layer; a sensing member provided in the hollow reaction portion; an output terminal for outputting a signal sensed by the sensing member to the outside; and a sample introducing port for introducing a sample to the hollow reaction portion.
    • 由多个传感器芯片制成的耦合构件的特征在于相邻的传感器芯片在可切割的状态下彼此耦合; 相应的传感器芯片可以以更高的效率从耦合部件切割和分离; 并且即使在传感器芯片被分离之后,这些传感器芯片也可以容易且快速地存储在容器中; 此外,可以容易地检测传感器芯片,并且可以容易地去除故障芯片。 更具体地说,提供了一种用于制造由多个传感器芯片制成的耦合构件的方法,其中这些传感器芯片在可切割的条件下彼此耦合,而这些传感器芯片中的每一个包括:基板; 覆盖层; 设置在所述基板和所述覆盖层之间的中空反应部; 设置在所述中空反应部中的检测部件; 输出端子,用于将由感测构件感测的信号输出到外部; 以及用于将样品引入中空反应部的样品引入口。
    • 15. 发明申请
    • BIOSENSOR CHIP, BIOSENSOR SYSTEM AND MEASURING INSTRUMENT THEREOF
    • 生物传感器芯片,生物传感器系统及其测量仪器
    • US20090255810A1
    • 2009-10-15
    • US12280721
    • 2007-02-27
    • Moriyasu IchinoToshifumi HosoyaShingo KaimoriTakahiko Kitamura
    • Moriyasu IchinoToshifumi HosoyaShingo KaimoriTakahiko Kitamura
    • C25B11/06G01N33/50
    • G01N33/48785
    • In a biosensor system and its measuring instrument which determine that a biosensor chip has been inserted and measure biological information on a biological material supplied to the biosensor chip, the size of the biosensor chip is made small, the reliability of the measuring instrument is improved, and the product life becomes long. In addition, a measurement error of the biological information is suppressed in measuring the biological information by inserting a biosensor chip, which has a sensor electrode formed of an electrode member with an electric resistance value higher than a conductive metal, into the measuring instrument. An electrode portion provided in an insertion portion 5 of a measuring instrument 1 is configured such that a ground electrode 12 is used in both a sensor insertion determining circuit 14 and a blood sugar level measuring circuit 15. In addition, a first sensor electrode 21 of the biosensor chip 20 is configured to be shared by the sensor insertion determining circuit 14 and the blood sugar level measuring circuit 15. The biosensor chip includes: the first sensor electrode 21 provided to come in contact with an insertion determining circuit side connector electrode 13 when inserted into the insertion portion 5; a second sensor electrode 22 provided such that one end thereof comes in contact with a measuring circuit side connector electrode 13 and the other end is electrically connected to a reaction portion when inserted into the insertion portion 5; and a third sensor electrode 25 provided such that one end thereof comes in contact with the ground electrode 13 and the other end is electrically connected to the reaction portion 23 when inserted into the insertion portion 5. The first sensor electrode 21 is electrically connected to the reaction portion 23 through the third sensor electrode 25.
    • 在生物传感器系统及其测量仪器中,确定生物传感器芯片已被插入,并且测量生物传感器芯片上提供的生物材料上的生物信息,生物传感器芯片的尺寸变小,测量仪器的可靠性得到改善, 产品寿命长。 此外,通过将具有电阻值高于导电金属的电极部件形成的传感器电极的生物传感器芯片插入到测量仪器中来测量生物信息,抑制了生物信息的测量误差。 设置在测量仪器1的插入部分5中的电极部分构造成使得接地电极12用于传感器插入确定电路14和血糖水平测量电路15中。此外,第一传感器电极21 生物传感器芯片20被配置为由传感器插入确定电路14和血糖水平测量电路15共享。生物传感器芯片包括:第一传感器电极21,设置成与插入确定电路侧连接器电极13接触,当第 插入插入部5; 第二传感器电极22,其设置成使其一端与测量电路侧连接器电极13接触,另一端在插入插入部5时与反应部电连接; 以及第三传感器电极25,其设置成使其一端与接地电极13接触,另一端在插入插入部5时与反应部23电连接。第一传感器电极21电连接到 反应部23通过第三传感器电极25。
    • 16. 发明申请
    • Sensor Chip and Manufacturing Method Thereof
    • 传感器芯片及其制造方法
    • US20080248457A1
    • 2008-10-09
    • US11630475
    • 2005-06-21
    • Toshifumi HosoyaShingo KaimoriMoriyasu IchinoIsao KarubeMasao GotohHideaki NakamuraFumiyo KurusuTomoko Ishikawa
    • Toshifumi HosoyaShingo KaimoriMoriyasu IchinoIsao KarubeMasao GotohHideaki NakamuraFumiyo KurusuTomoko Ishikawa
    • C12Q1/00
    • G01N27/26
    • Provided are a sensor chip and a manufacturing method of this sensor chip, that includes a substrate, a cover layer, a spacer layer sandwiched between the substrate and the cover layer, and a hollow reaction section between the substrate and the cover layer, wherein warping due to changes in the environmental temperature and humidity does not occur.A sensor chip is provided including: a substrate; a cover layer; a spacer layer sandwiched between the substrate and the cover layer; a hollow reaction section provided between the substrate and the cover layer; and a detection section provided in the hollow reaction section, wherein the substrate and the cover layer are made of the same material and have the same thickness, and a material and a shape of the spacer layer are symmetrical with respect to a plane which is parallel to the substrate and located at equal distances from the substrate and from the cover layer, and a manufacturing method of the sensor chip is provided.
    • 提供了一种传感器芯片和该传感器芯片的制造方法,其包括基板,覆盖层,夹在基板和覆盖层之间的间隔层,以及基板和覆盖层之间的中空反应部,其中翘曲 由于环境温度和湿度的变化不会发生。 提供一种传感器芯片,包括:基板; 覆盖层; 夹在基板和覆盖层之间的间隔层; 设置在所述基板和所述覆盖层之间的中空反应部; 以及设置在所述中空反应部中的检测部,其中所述基板和所述覆盖层由相同的材料制成并且具有相同的厚度,并且所述间隔层的材料和形状相对于平行的平面对称 并且设置在距离基板和覆盖层相等的距离处,并且提供了传感器芯片的制造方法。
    • 20. 发明申请
    • Sensor Chip and Sensor Chip Production Method
    • 传感器芯片和传感器芯片生产方法
    • US20090257917A1
    • 2009-10-15
    • US12083694
    • 2006-10-16
    • Hideaki NakamuraMasao GotohTomoko IshikawaIsao KarubeToshifumi HosoyaShingo KaimoriMoriyasu Ichino
    • Hideaki NakamuraMasao GotohTomoko IshikawaIsao KarubeToshifumi HosoyaShingo KaimoriMoriyasu Ichino
    • B01J19/00B32B37/00
    • G01N27/3271Y10T156/1051
    • It is intended to provide a sensor chip which has a small size and is easily produced and capable of determining quantities of at least two components of multiple samples rapidly, conveniently, and correctly as well as to provide a production method capable of producing the sensor chip easily and with high productivity.A sensor chip includes a substrate, a cover layer, a spacer layer sandwiched between the substrate and the cover layer, multiple reaction portions disposed between the substrate and the cover layer, multiple detection units exposed in the hollow reaction portions, and a sample inlet communicated with the hollow reaction portions and a method for producing the sensor chip.A sensor chip includes two substrates opposed to each other, a spacer layer sandwiched between the substrates, and multiple measurement units disposed between the substrates and including two or more hollow reaction portions that share one sample inlet opened on outer surfaces of the substrates and detection electrode units respectively exposed in the hollow reaction portions and a method for producing the sensor chip.
    • 本发明旨在提供一种具有体积小且容易制造且能够快速,方便和正确地确定多个样品的至少两个组分的量的传感器芯片,以及提供能够生产传感器芯片的制造方法 容易和高生产力。 传感器芯片包括衬底,覆盖层,夹在衬底和覆盖层之间的间隔层,设置在衬底和覆盖层之间的多个反应部分,暴露在中空反应部分中的多个检测单元和连通的样品入口 中空反应部分和传感器芯片的制造方法。 传感器芯片包括彼此相对的两个基板,夹在基板之间的间隔层和设置在基板之间的多个测量单元,并且包括两个或更多个中空反应部分,其共享在基板的外表面上开放的一个样品入口和检测电极 分别暴露在中空反应部分中的单元和传感器芯片的制造方法。