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    • 14. 发明授权
    • Semiconductor device with floating trap type nonvolatile memory cell and method for manufacturing the same
    • 具有浮动阱型非易失性存储单元的半导体器件及其制造方法
    • US07371640B2
    • 2008-05-13
    • US11378505
    • 2006-03-17
    • Sang-Su KimKwang-Wook KohGeum-Jong BaeKi-Chul KimSung-Ho KimJin-Hee KimIn-Wook Cho
    • Sang-Su KimKwang-Wook KohGeum-Jong BaeKi-Chul KimSung-Ho KimJin-Hee KimIn-Wook Cho
    • H01L21/336
    • H01L27/11568H01L21/823462H01L27/105H01L27/115H01L27/11526H01L27/11546
    • The present invention discloses a semiconductor device having a floating trap type nonvolatile memory cell and a method for manufacturing the same. The method includes providing a semiconductor substrate having a nonvolatile memory region, a first region, and a second region. A triple layer composed of a tunnel oxide layer, a charge storing layer and a first deposited oxide layer on the semiconductor substrate is formed sequentially. The triple layer on the semiconductor substrate except the nonvolatile memory region is then removed. A second deposited oxide layer is formed on an entire surface of the semiconductor substrate including the first and second regions from which the triple layer is removed. The second deposited oxide layer on the second region is removed, and a first thermal oxide layer is formed on the entire surface of the semiconductor substrate including the second region from which the second deposited oxide layer is removed. The semiconductor device can be manufactured according to the present invention to have a reduced processing time and a reduced change of impurity doping profile. The thickness of a blocking oxide layer and a high voltage gate oxide layer can be controlled.
    • 本发明公开了一种具有浮动阱式非易失性存储单元的半导体器件及其制造方法。 该方法包括提供具有非易失性存储区域,第一区域和第二区域的半导体衬底。 顺序地形成由半导体衬底上的隧道氧化物层,电荷存储层和第一沉积氧化物层组成的三层。 然后除去非易失性存储区域之外的半导体衬底上的三层。 第二沉积氧化物层形成在半导体衬底的包括去除三层的第一和第二区域的整个表面上。 去除第二区域上的第二沉积氧化物层,并且在包括除去第二沉积氧化物层的第二区域的半导体衬底的整个表面上形成第一热氧化物层。 可以根据本发明制造半导体器件以减少处理时间和降低杂质掺杂分布的变化。 可以控制阻挡氧化物层和高电压栅极氧化物层的厚度。
    • 15. 发明申请
    • Nonvolatile memory devices and methods of forming the same
    • 非易失存储器件及其形成方法
    • US20070194369A1
    • 2007-08-23
    • US11704003
    • 2007-02-08
    • Kwang-Wook KohHee-Seog Jeon
    • Kwang-Wook KohHee-Seog Jeon
    • H01L29/788H01L21/8238
    • H01L27/11524G11C16/0458H01L27/115H01L27/11521
    • In a nonvolatile memory device and a method of fabricating the same, a device isolation layer is formed defining an active region in a semiconductor substrate. A gate insulation layer and a first conductive layer are formed on the semiconductor substrate. A pair of stack patterns are formed, each having a intergate dielectric layer pattern and a second conductive layer pattern on the first conductive layer. A mask pattern is formed on the first conductive layer pattern between the stack patterns, the mask pattern being spaced apart from each of the stack patterns. The first conductive layer is patterned using the stack patterns and the mask patterns as an etching mask. Impurity ions are implanted into the active region to form a pair of nonvolatile memory transistors and a select transistor. The resulting nonvolatile memory device includes a memory cell unit that includes the pair of nonvolatile memory transistors and the select transistor.
    • 在非易失性存储器件及其制造方法中,形成在半导体衬底中限定有源区的器件隔离层。 在半导体衬底上形成栅绝缘层和第一导电层。 形成一对堆叠图案,每一个在第一导电层上具有隔间电介质层图案和第二导电层图案。 在堆叠图案之间的第一导电层图案上形成掩模图案,掩模图案与每个堆叠图案间隔开。 使用堆叠图案和掩模图案作为蚀刻掩模来图案化第一导电层。 将杂质离子注入到有源区中以形成一对非易失性存储晶体管和选择晶体管。 所得到的非易失性存储器件包括包括一对非易失性存储晶体管和选择晶体管的存储单元单元。
    • 17. 发明授权
    • Methods of forming nonvolatile memory devices
    • 形成非易失性存储器件的方法
    • US07799635B2
    • 2010-09-21
    • US12476698
    • 2009-06-02
    • Kwang-Wook KohHee-Seog Jeon
    • Kwang-Wook KohHee-Seog Jeon
    • H01L21/336H01L21/8239
    • H01L27/11524G11C16/0458H01L27/115H01L27/11521
    • In a nonvolatile memory device and a method of fabricating the same, a device isolation layer is formed defining an active region in a semiconductor substrate. A gate insulation layer and a first conductive layer are formed on the semiconductor substrate. A pair of stack patterns are formed, each having a intergate dielectric layer pattern and a second conductive layer pattern on the first conductive layer. A mask pattern is formed on the first conductive layer pattern between the stack patterns, the mask pattern being spaced apart from each of the stack patterns. The first conductive layer is patterned using the stack patterns and the mask patterns as an etching mask. Impurity ions are implanted into the active region to form a pair of nonvolatile memory transistors and a select transistor. The resulting nonvolatile memory device includes a memory cell unit that includes the pair of nonvolatile memory transistors and the select transistor.
    • 在非易失性存储器件及其制造方法中,形成在半导体衬底中限定有源区的器件隔离层。 在半导体衬底上形成栅绝缘层和第一导电层。 形成一对堆叠图案,每一个在第一导电层上具有隔间电介质层图案和第二导电层图案。 在堆叠图案之间的第一导电层图案上形成掩模图案,掩模图案与每个堆叠图案间隔开。 使用堆叠图案和掩模图案作为蚀刻掩模来图案化第一导电层。 将杂质离子注入到有源区中以形成一对非易失性存储晶体管和选择晶体管。 所得到的非易失性存储器件包括包括一对非易失性存储晶体管和选择晶体管的存储单元单元。
    • 19. 发明授权
    • Semiconductor device with floating trap type nonvolatile memory cell and method for manufacturing the same
    • 具有浮动阱式非易失性存储单元的半导体器件及其制造方法
    • US07045850B2
    • 2006-05-16
    • US10844783
    • 2004-05-13
    • Sang-Su KimKwang-Wook KohGeum-Jong BaeKi-Chul KimSung-Ho KimJin-Hee KimIn-Wook Cho
    • Sang-Su KimKwang-Wook KohGeum-Jong BaeKi-Chul KimSung-Ho KimJin-Hee KimIn-Wook Cho
    • H01L29/76
    • H01L27/11568H01L21/823462H01L27/105H01L27/115H01L27/11526H01L27/11546
    • The present invention discloses a semiconductor device having a floating trap type nonvolatile memory cell and a method for manufacturing the same. The method includes providing a semiconductor substrate having a nonvolatile memory region, a first region, and a second region. A triple layer composed of a tunnel oxide layer, a charge storing layer and a first deposited oxide layer on the semiconductor substrate is formed sequentially The triple layer on the semiconductor substrate except the nonvolatile memory region is then removed. A second deposited oxide layer is formed on an entire surface of the semiconductor substrate including the first and second regions from which the triple layer is removed. The second deposited oxide layer on the second region is removed, and a first thermal oxide layer is formed on the entire surface of the semiconductor substrate including the second region from which the second deposited oxide layer is removed. The semiconductor device can be manufactured according to the present invention to have a reduced processing time and a reduced change of impurity doping profile. The thickness of a blocking oxide layer and a high voltage gate oxide layer can be controlled.
    • 本发明公开了一种具有浮动阱式非易失性存储单元的半导体器件及其制造方法。 该方法包括提供具有非易失性存储区域,第一区域和第二区域的半导体衬底。 依次形成由半导体衬底上的隧道氧化物层,电荷存储层和第一沉积氧化物层构成的三层,然后除去非易失性存储区域之外的半导体衬底上的三层。 第二沉积氧化物层形成在半导体衬底的包括去除三层的第一和第二区域的整个表面上。 去除第二区域上的第二沉积氧化物层,并且在包括除去第二沉积氧化物层的第二区域的半导体衬底的整个表面上形成第一热氧化物层。 可以根据本发明制造半导体器件以减少处理时间和降低杂质掺杂分布的变化。 可以控制阻挡氧化物层和高电压栅极氧化物层的厚度。