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    • 19. 发明申请
    • SEMICONDUCTOR CLAMP SYSTEM
    • 半导体钳位系统
    • US20090108441A1
    • 2009-04-30
    • US11931664
    • 2007-10-31
    • Aaron BarrAllen RitterPaul Pate
    • Aaron BarrAllen RitterPaul Pate
    • H01L23/34
    • H02M7/003H01L2924/0002H01L2924/00
    • A system for clamping a plurality of semiconductors that includes: 1) a first endplate and a second endplate that are substantially parallel and oppose each other across a predetermine distance (the predetermined distance being fixed by one or more tension members that extend between the first endplate and the second endplate); and 2) a screw jack that includes a threaded cylinder that moves through a threaded opening in the first endplate upon being rotated such that the threaded cylinder moves toward the second endplate if rotated one direction and away from the second endplate if rotated the opposite direction.
    • 一种用于夹紧多个半导体的系统,包括:1)第一端板和第二端板,所述第一端板和第二端板在预定距离之间基本上平行且彼此相对(所述预定距离由在所述第一端板之间延伸的一个或多个张紧构件固定 和第二个终板); 以及2)螺旋千斤顶,其包括螺纹圆筒,所述螺纹圆筒在旋转时移动通过所述第一端板中的螺纹开口,使得如果旋转一个方向并且如果沿相反方向旋转,则所述螺纹圆柱体朝向所述第二端板移动。