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11. 发明授权

US08345508B2 Large area modular sensor array assembly and method for making the same 有权
标题翻译：大面积模块化传感器阵列组件及其制作方法
公开(公告)号：US08345508B2
公开(公告)日：2013-01-01
申请号：US12714239
申请日：2010-02-26
申请人： Robert Gideon Wodnicki , Rayette Ann Fisher , Charles Gerard Woychik , Shubhra Bansal , Albert Taesung Byun
发明人： Robert Gideon Wodnicki , Rayette Ann Fisher , Charles Gerard Woychik , Shubhra Bansal , Albert Taesung Byun
IPC分类号： G03B42/06
CPC分类号： B23K1/0016 , B06B1/0629
摘要： A modular and tileable sensor array with routing in the interposer carrying the signals from the sensors to the integrated circuits. In one embodiment a large area modular sensor array assembly includes one or more tileable modules coupled together. The tileable modules have a plurality of transducer cells forming a sensor, an interposer coupled on a first side to the plurality of transducer cells by a plurality, one or more integrated circuits coupled to a second side of the interposer, wherein the interposer is configured to form the connection of at least some of the transducer cells to the integrated circuits, and one or more input/output connectors coupled to the interposer and providing an external interface.
摘要翻译：一种模块化且可分散的传感器阵列，其具有在插入器中的路由，其将来自传感器的信号传送到集成电路。在一个实施例中，大面积模块化传感器阵列组件包括耦合在一起的一个或多个可瓦片模块。可拼接模块具有形成传感器的多个换能器单元，通过耦合到中介层的第二侧的多个一个或多个集成电路在第一侧耦合到多个换能器单元的插入件，其中插入件配置成形成至少一些传感器单元与集成电路的连接，以及耦合到插入器并提供外部接口的一个或多个输入/输出连接器。

12. 发明申请

US20080134793A1 Modular sensor assembly and methods of fabricating the same 有权
标题翻译：模块化传感器组件及其制造方法
公开(公告)号：US20080134793A1
公开(公告)日：2008-06-12
申请号：US11636822
申请日：2006-12-11
申请人： Charles Gerard Woychik , Rayette Ann Fisher , David Martin Mills , Scott Cogan , David Richard Esler , Robert Gideon Wodnicki , Jeffrey Scott Erlbaum
发明人： Charles Gerard Woychik , Rayette Ann Fisher , David Martin Mills , Scott Cogan , David Richard Esler , Robert Gideon Wodnicki , Jeffrey Scott Erlbaum
IPC分类号： G01D5/12 , G01H11/00 , G01H11/08 , G01N29/22 , G01R3/00
CPC分类号： G01D11/245 , B06B1/0292 , B06B1/0629 , G01N29/2437 , G01N2291/106 , H01L2224/05001 , H01L2224/05009 , H01L2224/0557 , H01L2224/05571 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/16145 , H01L2224/48091 , H01L2224/73257 , H01L2924/00014 , H01L2924/01322 , Y10T29/49004 , Y10T29/49007 , H01L2924/00 , H01L2224/05099
摘要： A modular sensor assembly and methods of fabricating a modular sensor assembly are provided. The modular sensor assembly includes a sensor array coupled to an electronics array in a stacked configuration. The sensor array comprises a plurality of sensor modules, each comprising a plurality of sensor sub-arrays. The electronics array comprises a plurality of integrated circuit modules, each comprising a plurality of integrated circuit chips. The sensor modules may be coupled to the electronics modules via flip chip technology.
摘要翻译：提供了模块化传感器组件和制造模块化传感器组件的方法。模块化传感器组件包括以堆叠配置耦合到电子阵列的传感器阵列。传感器阵列包括多个传感器模块，每个传感器模块包括多个传感器子阵列。电子阵列包括多个集成电路模块，每个集成电路模块包括多个集成电路芯片。传感器模块可以通过倒装芯片技术耦合到电子模块。

13. 发明授权

US07443765B2 Reconfigurable linear sensor arrays for reduced channel count 有权
标题翻译：可重构线性传感器阵列，减少通道数
公开(公告)号：US07443765B2
公开(公告)日：2008-10-28
申请号：US11018238
申请日：2004-12-21
申请人： Kai Erik Thomenius , Rayette Ann Fisher , Robert Gideon Wodnicki , Christopher Robert Hazard , Lowell Scott Smith , Bruno Hans Haider , Kenneth Wayne Rigby
发明人： Kai Erik Thomenius , Rayette Ann Fisher , Robert Gideon Wodnicki , Christopher Robert Hazard , Lowell Scott Smith , Bruno Hans Haider , Kenneth Wayne Rigby
IPC分类号： G10K11/00 , H04R17/00
CPC分类号： B06B1/0292 , A61B2562/028 , G01N29/0609 , G01N29/069 , G01N29/245 , G01N2291/0423 , G01N2291/106
摘要： A reconfigurable linear array of sensors (e.g., optical, thermal, pressure, ultrasonic). The reconfigurability allows the size and spacing of the sensor elements to be a function of the distance from the beam center. This feature improves performance for imaging systems having a limited channel count. The improved performance, for applications in which multiple transmit focal zones are employed, arises from the ability to adjust the aperture for a particular depth.
摘要翻译：传感器的可重构线性阵列（例如光学，热学，压力，超声波）。可重新配置允许传感器元件的尺寸和间距是与梁中心距离的函数。该功能提高了具有有限通道数的成像系统的性能。对于使用多个透射聚焦区域的应用而言，改进的性能来自于为特定深度调整孔径的能力。

14. 发明授权

US07280435B2 Switching circuitry for reconfigurable arrays of sensor elements 有权
标题翻译：用于可重构阵列的传感器元件的开关电路
公开(公告)号：US07280435B2
公开(公告)日：2007-10-09
申请号：US10978196
申请日：2004-10-29
申请人： Kai Erik Thomenius , Rayette Ann Fisher , Robert Gideon Wodnicki , Christopher Robert Hazard , Lowell Scott Smith , David Martin Mills
发明人： Kai Erik Thomenius , Rayette Ann Fisher , Robert Gideon Wodnicki , Christopher Robert Hazard , Lowell Scott Smith , David Martin Mills
IPC分类号： H04R17/00 , A61B8/00
CPC分类号： H03M11/00 , B06B1/0207 , B06B1/0292 , G01N29/262 , G01N2291/044 , G01N2291/106
摘要： A device comprising an array of sensors that are reconfigurable by means of a switching network. The sensors may be optical, thermal or pressure sensors or ultrasonic transducers. More specifically, the device comprises: a multiplicity of sensor elements; a plurality of bus lines; a set of access switches for selectively connecting a set of the sensor elements in a row to a bus line, one of the access switches being connected to a first sensor element; a multiplicity of sets of matrix switches, each of the sets of matrix switches selectively connecting a respective sensor element of the multiplicity of sensor elements to a respective set of adjacent sensor elements, one of the matrix switches being connected to the first sensor element and to a second sensor element that is not a member of the set of sensor elements; and control circuitry that controls the access switches and the matrix switches in accordance with a selected switching configuration such that the first sensor element is connected to the bus line via said one access switch, while at the same time the second sensor element is connected to said one access switch via said one matrix switch.
摘要翻译：一种包括可通过交换网络重新配置的传感器阵列的设备。传感器可以是光学，热或压力传感器或超声换能器。更具体地，该装置包括：多个传感器元件; 多条总线; 一组接入开关，用于选择性地将一行中的传感器元件连接到总线，其中一个接入开关连接到第一传感器元件; 多个矩阵开关组，每组矩阵开关选择性地将多个传感器元件的相应传感器元件连接到相应的一组相邻传感器元件，矩阵开关中的一个连接到第一传感器元件，并且第二传感器元件，其不是该组传感器元件的构件; 以及控制电路，其根据选择的开关配置来控制接入开关和矩阵开关，使得第一传感器元件经由所述一个接入开关连接到总线，同时第二传感器元件连接到所述一个接入开关经由所述一个矩阵开关。

15. 发明授权

US07353056B2 Optimized switching configurations for reconfigurable arrays of sensor elements 失效
标题翻译：用于可重构阵列传感器元件的优化开关配置
公开(公告)号：US07353056B2
公开(公告)日：2008-04-01
申请号：US10978175
申请日：2004-10-29
申请人： Christopher Robert Hazard , Robert Gideon Wodnicki , Rayette Ann Fisher , Kai E. Thomenius , Lowell Scott Smith , David Martin Mills
发明人： Christopher Robert Hazard , Robert Gideon Wodnicki , Rayette Ann Fisher , Kai E. Thomenius , Lowell Scott Smith , David Martin Mills
IPC分类号： A61B5/05 , A61B8/00
CPC分类号： G10K11/34 , A61B2562/028 , B06B1/0292 , G01S7/52046 , G01S15/8925
摘要： The reconfigurable ultrasound array disclosed herein is one that allows groups of subelements to be connected together dynamically so that the shape of the resulting element can be made to match the shape of the wave front. This can lead to improved performance and/or reduced channel count. Reconfigurability can be achieved using a switching network. A methodology and an algorithm are disclosed that allows the performance of this switching network to be improved by properly choosing the configuration of the switching network.
摘要翻译：本文公开的可重构超声波阵列是允许一组子元件动态地连接在一起的结构，使得所得元件的形状可以与波前的形状相匹配。这可以导致改进的性能和/或减少的通道数。可以使用交换网络实现可重构性。公开了一种通过适当选择交换网络的配置来改善该交换网络的性能的方法和算法。

16. 发明授权

US07952260B2 Ultrasound imaging system 有权
标题翻译：超声成像系统
公开(公告)号：US07952260B2
公开(公告)日：2011-05-31
申请号：US12725536
申请日：2010-03-17
申请人： Bruno Hans Haider , Kjell Kristoffersen , Rayette Ann Fisher , Thomas Halvorsrod , Robert Gideon Wodnicki
发明人： Bruno Hans Haider , Kjell Kristoffersen , Rayette Ann Fisher , Thomas Halvorsrod , Robert Gideon Wodnicki
IPC分类号： H01L41/09 , G01N24/00 , A61B8/14
CPC分类号： A61B8/00 , A61B1/0005 , B06B1/0622 , G01S7/5208 , G01S15/8925 , G01S15/8927 , G03B42/06
摘要： An ultrasound imaging system (100). An exemplary system (100) includes a plurality of transducer elements (136) formed in subarrays (140) and a plurality of subarray circuit units (160′), with each circuit unit (160′) connected to a subarray (140) of the transducer elements (136). The circuitry in each unit (160′) comprises a plurality of integrated circuits (330, 340, 350), with at least a first (340) of the integrated circuits formed over a second (330) of the integrated circuits in a stacked configuration. In an example illustration the first integrated circuit (340) includes a first plurality of first bond pads (345) along a surface (342) thereof and the second integrated circuit (330) includes a second plurality of second bond pads (335) along a surface (331) thereof, with bond wires (344) extending between pairs of first and second bond pads to provide input/output signal connections therebetween.
摘要翻译：超声成像系统（100）。示例性系统（100）包括形成在子阵列（140）中的多个换能器元件（136）和多个子阵列电路单元（160'），每个电路单元（160'）连接到子阵列换能器元件（136）。每个单元（160'）中的电路包括多个集成电路（330,340,350），其中至少第一（340）个集成电路以堆叠配置形成在第二（330）集成电路上。在示例图中，第一集成电路（340）包括沿着其表面（342）的第一多个第一接合焊盘（345），并且第二集成电路（330）包括沿着第一多个第二接合焊盘其具有在成对的第一和第二接合焊盘之间延伸的接合线（344），以在它们之间提供输入/输出信号连接。

17. 发明授权

US07257051B2 Integrated interface electronics for reconfigurable sensor array 有权
标题翻译：用于可重构传感器阵列的集成接口电子设备
公开(公告)号：US07257051B2
公开(公告)日：2007-08-14
申请号：US10977930
申请日：2004-10-29
申请人： Kai E. Thomenius , Rayette Ann Fisher , Robert Gideon Wodnicki , William Edward Burdick, Jr.
发明人： Kai E. Thomenius , Rayette Ann Fisher , Robert Gideon Wodnicki , William Edward Burdick, Jr.
IPC分类号： H04R17/00 , A61B8/00
CPC分类号： B06B1/0292 , G01N29/06 , G01N29/262 , G01N2291/106 , H01L2924/0002 , H01L2924/00
摘要： An integrated switch matrix for reconfiguring subelements of a mosaic sensor array to form elements. The configuration of the switch matrix is fully programmable. The switch matrix includes access switches that connect subelements to bus lines and matrix switches that connect subelements to subelements. Each subelement has a unit switch cell comprising at least one access switch, at least one matrix switch, a respective memory element for storing the future state of each switch, and a respective control circuit for each switch. The access and matrix switches are of a type having the ability to memorize control data representing the current switch state of the switch, which control data includes a data bit input to turn-on/off circuits incorporated in the control circuit. The sensor array and the switching matrix may be built in different strata of a co-integrated structure or they may be built on separate wafers that are electrically connected. If the sensors are arranged on a hexagonal grid, the unit switch cells may be arranged on either a hexagonal or rectangular grid.
摘要翻译：一种用于重新配置马赛克传感器阵列的子元素以形成元素的集成开关矩阵。开关矩阵的配置是完全可编程的。开关矩阵包括将子元件连接到总线线路的接入开关和将子元件连接到子元件的矩阵开关。每个子元件具有包括至少一个存取开关，至少一个矩阵开关，用于存储每个开关的未来状态的相应存储元件以及每个开关的相应控制电路的单元开关单元。存取和矩阵开关是具有存储表示开关的当前开关状态的控制数据的能力的类型，该控制数据包括输入到控制电路中的导通/截止电路的数据位。传感器阵列和开关矩阵可以内置在共同一体化结构的不同层中，或者它们可以被构建在电连接的分开的晶片上。如果传感器布置在六边形网格上，则单元开关单元可以布置在六边形或矩形网格上。

18. 发明申请

US20130257224A1 ULTRASOUND ACOUSTIC ASSEMBLIES AND METHODS OF MANUFACTURE 有权
标题翻译：超声波组件及其制造方法
公开(公告)号：US20130257224A1
公开(公告)日：2013-10-03
申请号：US13433422
申请日：2012-03-29
申请人： Robert Gideon Wodnicki , Charles Edward Baumgartner , David Martin Mills , Kevin Matthew Durocher , William Hullinger Huber , George Charles Sogoian , Christopher James Kapusta
发明人： Robert Gideon Wodnicki , Charles Edward Baumgartner , David Martin Mills , Kevin Matthew Durocher , William Hullinger Huber , George Charles Sogoian , Christopher James Kapusta
IPC分类号： H01L41/04 , H01L41/113 , H01L41/22 , H01L41/047
CPC分类号： B06B1/0622 , H01L41/338 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/1433 , H01L2924/15321 , Y10T29/42 , H01L2924/00
摘要： An ultrasound acoustic assembly includes a number of ultrasound acoustic arrays, each array comprising an acoustic stack comprising a piezoelectric layer assembled with at least one acoustic impedance dematching layer and with a support layer. The acoustic stack defines a number of dicing kerfs and a number of acoustic elements, such that the dicing kerfs are formed between neighboring ones of the acoustic elements. The dicing kerfs extend through the piezoelectric layer and through the acoustic impedance dematching layer(s) but extend only partially through the support layer. The ultrasound acoustic assembly further includes a number of application specific integrated circuit (ASIC) die. Each ultrasound acoustic array is coupled to a respective ASIC die to form a respective acoustic-electric transducer module. Methods of manufacture are also provided.
摘要翻译：超声波声学组件包括多个超声波阵列，每个阵列包括声叠层，声堆叠包括与至少一个声阻抗分配层和支撑层组装的压电层。声学堆叠限定了多个切割切口和多个声学元件，使得切割切口形成在相邻的声学元件之间。切割切口延伸穿过压电层并通过声阻抗分层，但仅部分延伸穿过支撑层。超声波组件还包括许多专用集成电路（ASIC）芯片。每个超声波阵列耦合到相应的ASIC管芯，以形成相应的声电传感器模块。还提供了制造方法。

19. 发明授权

US08742646B2 Ultrasound acoustic assemblies and methods of manufacture 有权
标题翻译：超音波组件及其制造方法
公开(公告)号：US08742646B2
公开(公告)日：2014-06-03
申请号：US13433422
申请日：2012-03-29
申请人： Robert Gideon Wodnicki , Charles Edward Baumgartner , David Martin Mills , Kevin Matthew Durocher , William Hullinger Huber , George Charles Sogoian , Christopher James Kapusta
发明人： Robert Gideon Wodnicki , Charles Edward Baumgartner , David Martin Mills , Kevin Matthew Durocher , William Hullinger Huber , George Charles Sogoian , Christopher James Kapusta
IPC分类号： H01L41/08 , B06B1/06
CPC分类号： B06B1/0622 , H01L41/338 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/1433 , H01L2924/15321 , Y10T29/42 , H01L2924/00
摘要： An ultrasound acoustic assembly includes a number of ultrasound acoustic arrays, each array comprising an acoustic stack comprising a piezoelectric layer assembled with at least one acoustic impedance dematching layer and with a support layer. The acoustic stack defines a number of dicing kerfs and a number of acoustic elements, such that the dicing kerfs are formed between neighboring ones of the acoustic elements. The dicing kerfs extend through the piezoelectric layer and through the acoustic impedance dematching layer(s) but extend only partially through the support layer. The ultrasound acoustic assembly further includes a number of application specific integrated circuit (ASIC) die. Each ultrasound acoustic array is coupled to a respective ASIC die to form a respective acoustic-electric transducer module. Methods of manufacture are also provided.
摘要翻译：超声波声学组件包括多个超声波阵列，每个阵列包括声叠层，声堆叠包括与至少一个声阻抗分配层和支撑层组装的压电层。声学堆叠限定了多个切割切口和多个声学元件，使得切割切口形成在相邻的声学元件之间。切割切口延伸穿过压电层并通过声阻抗分层，但仅部分延伸穿过支撑层。超声波组件还包括许多专用集成电路（ASIC）芯片。每个超声波阵列耦合到相应的ASIC管芯，以形成相应的声电传感器模块。还提供了制造方法。

20. 发明授权

US08961421B2 Transmit/receive circuitry for ultrasound systems 有权
标题翻译：用于超声系统的发射/接收电路
公开(公告)号：US08961421B2
公开(公告)日：2015-02-24
申请号：US11737414
申请日：2007-04-19
申请人： Robert Gideon Wodnicki
发明人： Robert Gideon Wodnicki
IPC分类号： A61B8/14 , G01S7/52
CPC分类号： G01S7/52017 , Y10T307/74 , Y10T307/858
摘要： A transceiver for use in an ultrasound system is provided. The transceiver is configured to operate in a transmit mode and a receive mode. The transceiver comprises a high voltage switch, a low voltage switch and a resistor coupled to the high voltage switch and the low voltage switch.
摘要翻译：提供了一种用于超声系统的收发器。收发器被配置为在发送模式和接收模式下操作。收发器包括高压开关，低压开关和耦合到高压开关和低压开关的电阻器。

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