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11. 发明申请

US20090000774A1 INTEGRATED HEAT EXCHANGER AND DIFFUSER 审中-公开
标题翻译：集成热交换器和扩散器
公开(公告)号：US20090000774A1
公开(公告)日：2009-01-01
申请号：US11772055
申请日：2007-06-29
申请人： Mark MacDonald , Rajiv Mongia
发明人： Mark MacDonald , Rajiv Mongia
IPC分类号： F28F13/12 , F04D29/44
CPC分类号： F28F13/06 , F28F1/34 , F28F13/125 , G06F1/203
摘要： The present invention discloses an apparatus including: a blower fan, the blower fan having multiple blades; a diffuser attached to a housing of the blower fan; diffuser vanes located in the diffuser, wherein the diffuser vanes are also fins for a heat exchanger.
摘要翻译：本发明公开了一种装置，包括：鼓风机，具有多个叶片的鼓风机风扇; 附接到鼓风扇的壳体的扩散器; 扩散器叶片位于扩散器中，其中扩散器叶片也是用于热交换器的翅片。

12. 发明申请

US20070000269A1 Method and apparatus for cooling a heat source 有权
标题翻译：用于冷却热源的方法和装置
公开(公告)号：US20070000269A1
公开(公告)日：2007-01-04
申请号：US11171884
申请日：2005-06-29
申请人： Rajiv Mongia
发明人： Rajiv Mongia
IPC分类号： F24F3/16 , F25D23/12 , F25B1/00
CPC分类号： F25B31/006 , F25B40/06 , F25B2400/05 , H05K7/20354
摘要： An evaporator thermally coupled with a heat source is operated in manner with the coolant exiting the evaporator in a less than fully vaporous state. For an embodiment, the exiting coolant may be brought to at least a substantially vaporous state by being thermally coupled to a compressor.
摘要翻译：与热源热耦合的蒸发器以低于完全蒸发状态的冷却剂以冷却剂的形式运行。对于一个实施例，通过热耦合到压缩机，排出的冷却剂可以被带到至少基本上蒸发的状态。

13. 发明申请

US20060068251A1 Fuel cell device for computer systems 审中-公开
标题翻译：用于计算机系统的燃料电池装置
公开(公告)号：US20060068251A1
公开(公告)日：2006-03-30
申请号：US10955761
申请日：2004-09-29
申请人： Rajiv Mongia , Eric DiStefano
发明人： Rajiv Mongia , Eric DiStefano
IPC分类号： H01M8/04 , H01M2/02
CPC分类号： G06F1/1616 , G06F1/1635 , G06F1/1684 , G06F1/206 , G06F1/26 , H01M8/04007 , H01M8/04201 , H01M2250/30 , Y02B90/18
摘要： A fuel cell module for powering a computer system is described. Specifically, the fuel cell module may comprise a fuel cell stack, fuel storage unit, and a thermal management unit. Electricity to power the computer system is generated by the fuel cell stack. The fuel storage unit supplies the fuel for the fuel cell stack. The thermal management unit is used to monitor and remove heat and water byproducts generated by the fuel cell stack.
摘要翻译：描述了用于为计算机系统供电的燃料电池模块。具体地，燃料电池模块可以包括燃料电池堆，燃料存储单元和热管理单元。通过燃料电池堆产生用于为计算机系统供电的电力。燃料存储单元为燃料电池堆提供燃料。热管理单元用于监测和去除由燃料电池堆产生的热和水副产物。

14. 发明申请

US20060068245A1 Rechargeable fuel cell module 审中-公开
标题翻译：充电式燃料电池模块
公开(公告)号：US20060068245A1
公开(公告)日：2006-03-30
申请号：US10954383
申请日：2004-09-29
申请人： Rajiv Mongia
发明人： Rajiv Mongia
IPC分类号： H01M8/04 , H01M8/18
CPC分类号： H01M8/186 , H01M8/04164 , H01M8/04201 , H01M8/04291 , H01M2250/30 , Y02B90/18 , Y02E60/528
摘要： A method, system, and apparatus are disclosed. In one embodiment the method comprises capturing at least a portion of a reaction product of an operating fuel cell and converting at least a portion of the captured reaction product by utilizing an external source of electricity to create fuel that is stored back into the fuel cell's stored fuel supply.
摘要翻译：公开了一种方法，系统和装置。在一个实施方案中，该方法包括捕获操作的燃料电池的反应产物的至少一部分并且通过利用外部电源来转换所捕获的反应产物的至少一部分，以产生储存回燃料电池的储存的燃料燃料供应。

15. 发明申请

US20090168332A1 AIR MOVER FOR DEVICE SURFACE COOLING 有权
标题翻译：用于设备表面冷却的AIR MOVER
公开(公告)号：US20090168332A1
公开(公告)日：2009-07-02
申请号：US11967679
申请日：2007-12-31
申请人： Rajiv Mongia
发明人： Rajiv Mongia
IPC分类号： G06F1/20 , H05K7/20
CPC分类号： G06F1/203
摘要： Embodiments disclosed herein include an apparatus that includes an component capable of generating heat, an external wall with an interior surface, an air mover to be positioned to generate airflow between the interior surface of the external wall and the component. A vent may then be formed within the external wall to provide for a volume of air for the air mover to create airflow between the interior surface and the component. In some embodiments, the vent may be positioned in relation to the air mover to deflect at least a portion of the heat from the component from reaching the external wall. In some embodiments, a louvered portion may be included; and may be formed on the air mover or at the vent in the external wall. Other embodiments are described.
摘要翻译：本文公开的实施例包括包括能够产生热量的部件，具有内表面的外壁的设备，被定位成在外壁的内表面和部件之间产生气流的鼓风机。然后可以在外壁内形成通气口，以为空气推动器提供一定量的空气，以在内表面和部件之间产生气流。在一些实施例中，排气口可以相对于空气推动器定位，以使至少一部分热量从组件偏转到外壁。在一些实施例中，可以包括百叶窗部分; 并且可以形成在空气推动器上或在外壁的通风口处。描述其他实施例。

16. 发明申请

US20090127701A1 Thermal attach for electronic device cooling 审中-公开
标题翻译：热附件用于电子设备冷却
公开(公告)号：US20090127701A1
公开(公告)日：2009-05-21
申请号：US11985583
申请日：2007-11-15
申请人： Nitin Goel , Anandaroop Bhattacharya , Rajiv Mongia
发明人： Nitin Goel , Anandaroop Bhattacharya , Rajiv Mongia
IPC分类号： H01L23/36
CPC分类号： H01L23/42 , H01L2924/0002 , H01L2924/00
摘要： Embodiments of thermal cooling devices and systems including dies and thermal attaches having surface features are described in this application. The thermal attach may have a surface feature, such as a pattern, to limit movement of a thermal interface material, such as thermal grease, from between the die and the thermal attachment. The restriction of movement of the thermal interface material may improve the thermal performance of cooling systems for electronic devices over many cycles as opposed to known cooling systems. Other embodiments are described.
摘要翻译：在本申请中描述了具有表面特征的热冷却装置和包括管芯和热连接件的系统的实施例。热连接件可以具有诸如图案的表面特征，以限制模具和热附件之间的热界面材料（例如导热油脂）的移动。与已知的冷却系统相比，热界面材料的运动的限制可以改善电子设备在许多循环中的冷却系统的热性能。描述其他实施例。

17. 发明申请

US20070227707A1 Method, apparatus and system for providing for optimized heat exchanger fin spacing 审中-公开
标题翻译：用于提供优化的热交换器翅片间距的方法，装置和系统
公开(公告)号：US20070227707A1
公开(公告)日：2007-10-04
申请号：US11395352
申请日：2006-03-31
申请人： Sridhar Machiroutu , Himanshu Pokharna , Rajiv Mongia , Eric Baugh
发明人： Sridhar Machiroutu , Himanshu Pokharna , Rajiv Mongia , Eric Baugh
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28F3/02 , F28F2215/04 , H01L23/467 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A method, apparatus and system are described for providing for optimized heat exchanger fin spacing. The system may include a chassis and an apparatus. The apparatus may include a heat exchanger, and a cold plate. In some embodiments, a pump may provide for the flow of the fluid between the heat exchanger and the cold plate. In some embodiments, the heat exchanger may include a tube to transport a cooling fluid, and a plurality of fins coupled to the tube and having a spacing that facilitates optimizing the airflow from a blower; and a cold plate coupled to the tube and coupled to an electronic component from which thermal energy is transferred. Other embodiments may be described.
摘要翻译：描述了用于提供优化的热交换器翅片间距的方法，装置和系统。该系统可以包括底盘和装置。该装置可以包括热交换器和冷板。在一些实施例中，泵可以提供热交换器和冷板之间的流体流。在一些实施例中，热交换器可以包括用于输送冷却流体的管和耦合到管的多个鳍，并且具有有利于优化来自鼓风机的气流的间隔; 以及耦合到管并耦合到电子部件的冷板，从该热电转换热能。可以描述其他实施例。

18. 发明申请

US20070217147A1 INTEGRATED CIRCUIT COOLANT MICROCHANNEL ASSEMBLY WITH TARGETED CHANNEL CONFIGURATION 审中-公开
标题翻译：集成电路冷凝器微通道组件与目标通道配置
公开(公告)号：US20070217147A1
公开(公告)日：2007-09-20
申请号：US11749444
申请日：2007-05-16
申请人： Je-Young Chang , Ioan Sauciuc , Chuan Hu , Chia-Pin Chiu , Gregory Chrysler , Ravi Prasher , Rajiv Mongia , Himanshu Pokharna , Eric DiStefano
发明人： Je-Young Chang , Ioan Sauciuc , Chuan Hu , Chia-Pin Chiu , Gregory Chrysler , Ravi Prasher , Rajiv Mongia , Himanshu Pokharna , Eric DiStefano
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , F28F3/12 , F28F2260/02 , H01L2924/0002 , H01L2924/00
摘要： A microchannel structure has microchannels formed therein. The microchannels are to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. At least one of the microchannels has a length extent and has a first section at a first location along the length extent and a second section at a second location along the length extent. The first section of the microchannel has a first aspect ratio and the second section is divided into at least two sub-channels. Each sub-channel has a respective second aspect ratio that is greater than the first aspect ratio.
摘要翻译：微通道结构中形成有微通道。微通道将输送冷却剂并靠近集成电路以将热量从集成电路传递到冷却剂。微通道中的至少一个具有长度范围，并且具有沿着长度范围的第一位置处的第一部分和沿着长度范围的第二位置处的第二部分。微通道的第一部分具有第一宽高比，第二部分被划分为至少两个子通道。每个子通道具有大于第一宽高比的相应的第二宽高比。

19. 发明申请

US20070076375A1 Synthetic jet-based heat dissipation device 有权
标题翻译：合成喷射式散热装置
公开(公告)号：US20070076375A1
公开(公告)日：2007-04-05
申请号：US11244498
申请日：2005-09-30
申请人： Rajiv Mongia
发明人： Rajiv Mongia
IPC分类号： H05K7/20
CPC分类号： H05K7/20172 , F04B43/046 , F04B45/047 , F04D29/582 , F04D33/00 , H01L23/467 , H01L2924/0002 , Y10S165/908 , H01L2924/00
摘要： A synthetic jet array in a computing device, such as a mobile computing device, to dissipate heat generated by a heat generating component of the mobile computer is described. In one embodiment, a microscale synthetic jet array is integrated within a heat generating component, either on the backside of the heat generating component itself or on a heat spreader coupled to the heat generating component. A method of fabricating a synthetic jet array as an integrated part of a computing device or as a heat spreader is described, as well as a method of use of the synthetic jet array, are described.
摘要翻译：描述了诸如移动计算设备的计算设备中的散发由移动计算机的发热部件产生的热量的合成射流阵列。在一个实施例中，微型合成射流阵列集成在发热部件内，或者在发热部件本身的背面上，或者在耦合到发热部件的散热器上。描述了制造合成射流阵列作为计算装置或散热器的集成部分的方法以及合成射流阵列的使用方法。

20. 发明申请

US20070076374A1 IC coolant microchannel assembly with integrated attachment hardware 有权
标题翻译： IC冷却液微通道组件，集成附件硬件
公开(公告)号：US20070076374A1
公开(公告)日：2007-04-05
申请号：US11239957
申请日：2005-09-30
申请人： Rajiv Mongia , Himanshu Pokharna , Eric DiStefano , Shawn McEuen , Brian Wilk
发明人： Rajiv Mongia , Himanshu Pokharna , Eric DiStefano , Shawn McEuen , Brian Wilk
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , F28F3/12 , H01L23/4006 , H01L2924/0002 , H01L2924/00
摘要： An apparatus includes a microchannel structure that has microchannels formed therein. The microchannels are for transporting a coolant and are intended to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. The apparatus further includes a cover positioned on the microchannel structure. The cover has formed therein a right-angle passage to provide fluid communication between a first port on a lower horizontal surface of the cover and a second port on a vertical surface of the cover. The cover includes a plurality of tabs. Each tab extends from a respective corner of the cover. The tabs each have an aperture formed therein. The apertures are shaped and sized to receive a fastener.
摘要翻译：一种装置包括其中形成微通道的微通道结构。微通道用于运输冷却剂，并且旨在靠近集成电路以将热量从集成电路传递到冷却剂。该装置还包括位于微通道结构上的盖。盖上形成有直角通道，以在盖的下水平表面上的第一端口与盖的垂直表面上的第二端口之间提供流体连通。盖子包括多个翼片。每个突舌从盖的相应角延伸。翼片各自具有形成在其中的孔。孔的形状和尺寸适于接收紧固件。

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