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    • 17. 发明授权
    • Nonvolatile semiconductor memory device
    • 非易失性半导体存储器件
    • US08076709B2
    • 2011-12-13
    • US12873679
    • 2010-09-01
    • Tetsuya IshimaruDigh HisamotoKan YasuiShinichiro Kimura
    • Tetsuya IshimaruDigh HisamotoKan YasuiShinichiro Kimura
    • H01L29/792G11C16/04
    • G11C16/0466H01L21/28282H01L29/66833H01L29/792
    • In a situation where a memory cell includes an ONO film, which comprises a silicon nitride film for charge storage and oxide films positioned above and below the silicon nitride film; a memory gate above the ONO film; a select gate, which is adjacent to a lateral surface of the memory gate via the ONO film; a gate insulator positioned below the select gate; a source region; and a drain region, an erase operation is performed by injecting holes generated by BTBT into the silicon nitride film while applying a positive potential to the source region, applying a negative potential to the memory gate, applying a positive potential to the select gate, and flowing a current from the drain region to the source region, thus improving the characteristics of a nonvolatile semiconductor memory device.
    • 在存储单元包括ONO膜的情况下,其包括用于电荷存储的氮化硅膜和位于氮化硅膜上方和下方的氧化膜; 在ONO电影上方的记忆门; 选择栅极,其经由ONO膜与存储栅的侧表面相邻; 位于选择门下方的栅极绝缘体; 源区; 和漏极区域,通过将BTBT产生的空穴注入氮化硅膜,同时向源极区域施加正电位,向存储栅极施加负电位,向选择栅极施加正电位,进行擦除操作,以及 使电流从漏极区域流向源极区域,从而改善非易失性半导体存储器件的特性。
    • 19. 发明授权
    • Semiconductor device and manufacturing method for semiconductor device to reduce the lithography masks
    • 用于半导体器件的半导体器件和制造方法来减少光刻掩模
    • US07863131B2
    • 2011-01-04
    • US11189078
    • 2005-07-26
    • Kan YasuiDigh HisamotoTetsuya Ishimaru
    • Kan YasuiDigh HisamotoTetsuya Ishimaru
    • H01L21/336
    • H01L29/792G11C16/0466H01L27/115H01L27/11519H01L27/11568H01L29/42344
    • Semiconductor device and manufacturing method for reducing the number of required lithography masks added to the nonvolatile memory in the standard CMOS process to shorten the production period and reduce costs. In a split-gate memory cell with silicided gate electrodes utilizing a sidewall structure, a separate auxiliary pattern is formed adjoining the selected gate electrodes. A contact is set on a wiring layer self-aligned by filling side-wall gates of polysilicon in the gap between the electrodes and auxiliary pattern. The contact may overlap onto the auxiliary pattern and device isolation region, in an optimal design considering the size of the occupied surface area. If the distance to the selected gate electrode is x, the ONO film deposit thickness is t, and the polysilicon film deposit thickness is d, then the auxiliary pattern may be separated just by a distance x such that x
    • 用于减少在标准CMOS工艺中添加到非易失性存储器中的所需光刻掩模的数量的半导体器件和制造方法,以缩短生产周期并降低成本。 在具有利用侧壁结构的硅化栅电极的分裂栅极存储单元中,形成邻接所选择的栅电极的单独辅助图案。 通过填充电极和辅助图案之间的间隙中的多晶硅的侧壁栅极,将接触设置在自对准的布线层上。 考虑到占用的表面积的大小,接触可以以最佳设计重叠在辅助图案和设备隔离区域上。 如果与选定的栅电极的距离为x,则ONO膜沉积厚度为t,多晶硅膜沉积厚度为d,则辅助图案可以仅分开距离x,使得x <2×(t + d )。