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    • 11. 发明申请
    • SPATIALLY DISTRIBUTED VENTILATION BOUNDARY USING ELECTROHYDRODYNAMIC FLUID ACCELERATORS
    • 使用电动液态加速器的空间分布式通风边界
    • US20100116460A1
    • 2010-05-13
    • US12615905
    • 2009-11-10
    • Nels Jewell-LarsenKenneth A. HonerMatt SchwiebertHongyu RanPiyush SavaliaYan Zhang
    • Nels Jewell-LarsenKenneth A. HonerMatt SchwiebertHongyu RanPiyush SavaliaYan Zhang
    • F24H9/02H02K44/02F28D15/00
    • H02N11/006F04B19/006F28F2250/08G06F1/203
    • In thermal management systems that employ EHD devices to motivate flow of air through an enclosure, spatial distribution of a ventilation boundary may facilitate reductions in flow resistance by reducing average transit distance for cooling air from an inlet portion of the ventilation boundary to an outlet portion. Some thermal management systems described herein distribute a ventilation boundary over opposing surfaces, adjacent surfaces or even a single surface of an enclosure while providing a short, “U” shaped, “L” shaped or generally straight through flow path. In some cases, spatial distributions of the ventilation boundary facilitate or enable enclosure geometries for which conventional fan or blower ventilation would be impractical. In some cases, provision of multiple portions of the ventilation boundary may allow the thermal management system to tolerate blockage or occlusion of a subset of the inlet and/or outlet portions and, when at least some of such portions are non-contiguous spatially-distributed, tolerance to a single cause of blockage or occlusion is enhanced.
    • 在采用EHD装置来激励空气流过外壳的热管理系统中,通风边界的空间分布可以通过减少从通风边界的入口部分到出口部分的冷却空气的平均运输距离来促进流动阻力的降低。 本文所述的一些热管理系统在相对表面,相邻表面或甚至单个外壳的表面上分配通气边界,同时提供短的“U”形“L”形或大致直的流动路径。 在某些情况下,通风边界的空间分布有助于或实现常规风扇或鼓风机通风不切实际的外壳几何形状。 在一些情况下,提供通风边界的多个部分可以允许热管理系统容忍入口和/或出口部分的子集的阻塞或闭塞,并且当这些部分中的至少一些是不连续的空间分布 对单一阻塞或闭塞原因的耐受性得到提高。
    • 12. 发明申请
    • ELECTROHYDRODYNAMIC FLUID ACCELERATOR WITH HEAT TRANSFER SURFACES OPERABLE AS COLLECTOR ELECTRODE
    • 具有传热表面的电动液体加速器作为收集器电极可操作
    • US20100116469A1
    • 2010-05-13
    • US12615900
    • 2009-11-10
    • Nels Jewell-LarsenKenneth A. HonerMatt SchwiebertHongyu RanPiyush SavaliaYan Zhang
    • Nels Jewell-LarsenKenneth A. HonerMatt SchwiebertHongyu RanPiyush SavaliaYan Zhang
    • F28D15/00
    • H02N11/006F04B19/006F28F2250/08G06F1/203
    • In thermal management systems that employ EHD devices to motivate flow of air between ventilated boundary portions of an enclosure, it can be desirable to have some heat transfer surfaces participate in electrohydrodynamic acceleration of fluid flow while providing additional heat transfer surfaces that may not. In some embodiments, both collector electrodes and additional heat transfer surfaces are thermally coupled into a heat transfer path. Collector electrodes then contribute both to flow of cooling air and to heat transfer to the air flow so motivated. The collector electrodes and additional heat transfer surfaces may be parts of a unitary, or thermally coupled, structure that is introduced into a flow path at multiple positions therealong. In some embodiments, the collector electrodes and additional heat transfer surfaces may be proximate each other along the flow path. In some embodiments, the collector electrodes and additional heat transfer surfaces may be separate structures.
    • 在使用EHD装置来激励外壳通气边界部分之间的空气流动的热管理系统中,可能希望具有一些传热表面参与流体流动的电流动力学加速,同时提供可能不会的额外的传热表面。 在一些实施例中,收集器电极和附加传热表面都热耦合到传热路径中。 然后,收集器电极对冷却空气的流动进行贡献,并将热量传递给如此积极的气流。 集电极和附加传热表面可以是整体或热耦合的结构的部分,其被引入到沿着多个位置的流动路径中。 在一些实施例中,集电极和附加传热表面可以沿着流动路径彼此靠近。 在一些实施例中,集电极和附加传热表面可以是分离的结构。
    • 15. 发明授权
    • Sputtered silicon for microstructures and microcavities
    • 用于微结构和微腔的溅射硅
    • US06822304B1
    • 2004-11-23
    • US09710489
    • 2000-11-10
    • Kenneth A. Honer
    • Kenneth A. Honer
    • H01L2982
    • B81C1/00246B81C2203/0735
    • A sputtered silicon layer and a low temperature fabrication method thereof, is introduced. The sputtered silicon layer is sputtered with predetermined sputtering criteria resulting in a predetermined pre-annealing configuration. The sputtering criteria include sputtering power, ambient sputtering pressure, choice of sacrificial layer and etchant. The initially sputtered layer is transformed during a low temperature annealing process into a post-annealing state. A released structure is micro-machined from the sputtered layer in its post-annealed state. The low temperature annealing leaves pre-fabricated integrated aluminum-metalized circuitry unaffected. Optional conductive sputtered co-layers reduce resistivity and may be used to further tune strain and strain gradient.
    • 引入了溅射硅层及其低温制造方法。 用预定的溅射标准溅射溅射的硅层,得到预定的预退火构型。 溅射标准包括溅射功率,环境溅射压力,牺牲层和蚀刻剂的选择。 初始溅射层在低温退火过程中转变成后退火状态。 释放的结构在其后退火状态下从溅射层微加工。 低温退火使预制的集成铝金属化电路不受影响。 可选的导电溅射共层降低了电阻率,可用于进一步调整应变和应变梯度。
    • 16. 发明授权
    • Stress isolating die attach structure and method
    • 应力隔离模附着结构及方法
    • US06822318B2
    • 2004-11-23
    • US10146454
    • 2002-05-14
    • Kenneth A. HonerDaniel Parker
    • Kenneth A. HonerDaniel Parker
    • H01L2144
    • H01L24/83H01L21/50H01L23/3733H01L24/26H01L2224/8319H01L2224/8385H01L2924/01033H01L2924/01078H01L2924/014H01L2924/07802H01L2924/10253H01L2924/351H01L2924/00
    • A method and structure for isolating a die from thermally induced or pressure induced differential stresses between a die and a package includes providing an intermediate layer having therein a plurality of relief channels arranged to provide a flexure for absorbing such differential stresses. The relief channels define interior and peripheral portions of the intermediate layer, and the die is typically mounted on the interior portion. The peripheral portion of the intermediate layer is then bonded to the package. The channels may be disposed along both the upper and lower surfaces of the intermediate layer, or may be disposed on only one surface. Likewise, the channels may be disposed along one or both of the length and width of the upper or lower surfaces. Reservoir channels may also be provided to prevent adhesive from flowing and bridging the relief channels. Other relief channel patterns may be implemented for other designs, including a checkboard pattern of relief channels on one side of an intermediate layer, to provide vertical stiffness and horizontal compliance.
    • 用于将管芯与管芯和封装之间的热诱导或压力诱导的差分应力隔离的方法和结构包括提供其中具有多个释放通道的中间层,其布置成提供用于吸收该差分应力的挠曲。 排泄通道限定中间层的内部和外围部分,并且模具通常安装在内部部分上。 然后将中间层的周边部分结合到包装上。 通道可以沿着中间层的上表面和下表面布置,或者可以仅设置在一个表面上。 类似地,通道可以沿着上表面或下表面的长度和宽度中的一个或两个来布置。 还可以设置储存通道以防止粘合剂流动并桥接释放通道。 可以对其他设计实现其它的排泄通道图案,包括在中间层的一侧上的浮雕通道的棋盘图案,以提供垂直刚度和水平顺从性。