专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

11. 发明授权

US08101441B2 Method of manufacturing light-emitting device 有权
标题翻译：制造发光装置的方法
公开(公告)号：US08101441B2
公开(公告)日：2012-01-24
申请号：US12656670
申请日：2010-02-12
申请人： Kazuya Aida , Hiroki Watanabe , Seiji Yamaguchi , Yoshinobu Suehiro
发明人： Kazuya Aida , Hiroki Watanabe , Seiji Yamaguchi , Yoshinobu Suehiro
IPC分类号： H01L21/00
CPC分类号： H01L33/52 , H01L33/56 , H01L2224/05001 , H01L2224/05023 , H01L2224/05144 , H01L2224/05155 , H01L2224/05568 , H01L2224/05573 , H01L2224/05644 , H01L2224/16225 , H01L2924/00014
摘要： A method of manufacturing a light-emitting device includes, when sealing a light-emitting element on a mounting portion by a glass material softened by heating or when processing the glass material after the sealing, producing a concave portion partially on the glass material by partially contacting and pressing a die against an upper surface of the glass material such that a part of the upper surface being not in contact with the die is deformed and forms a curved surface.
摘要翻译：制造发光器件的方法包括：当通过加热软化的玻璃材料或在密封后加工玻璃材料将安装部分上的发光元件密封时，通过部分地在玻璃材料上部分地形成凹部将模具接触并压靠玻璃材料的上表面，使得与模具不接触的上表面的一部分变形并形成弯曲表面。

12. 发明授权

US07989236B2 Method of making phosphor containing glass plate, method of making light emitting device 有权
标题翻译：制造含有玻璃板的荧光体的方法，制造发光器件的方法
公开(公告)号：US07989236B2
公开(公告)日：2011-08-02
申请号：US12318150
申请日：2008-12-22
申请人： Seiji Yamaguchi , Takashi Nonogawa , Yoshinobu Suehiro , Hiroki Watanabe , Kazuya Aida
发明人： Seiji Yamaguchi , Takashi Nonogawa , Yoshinobu Suehiro , Hiroki Watanabe , Kazuya Aida
IPC分类号： H01L21/00
CPC分类号： C03B19/063 , C03C8/24 , C03C14/004 , C03C14/006 , C03C27/00 , C09K11/7734 , C09K11/7741 , H01L24/97 , H01L33/501 , H01L2224/05023 , H01L2224/0508 , H01L2224/05124 , H01L2224/05568 , H01L2224/05573 , H01L2224/05644 , H01L2224/13 , H01L2924/12041 , H01L2924/15787 , H01L2924/181 , H01L2933/0041 , Y02P40/57 , H01L2924/00 , H01L2924/00014
摘要： A method of making a light emitting device includes mixing a glass powder with a phosphor powder including at least one of a sulfide phosphor, an aluminate phosphor and a silicate phosphor to produce a mixed powder in which the phosphor powder is dispersed in the glass powder, heating and softening the mixed powder to provide an integrated material, and subsequently solidifying the integrated material to provide a phosphor-dispersed glass, and fusion-bonding the phosphor-dispersed glass onto a mounting portion on which a light emitting element is mounted by hot pressing, and simultaneously sealing the light emitting element with the phosphor-dispersed glass on the mounting portion.
摘要翻译：制造发光器件的方法包括：将玻璃粉末与包含硫化物荧光体，铝酸盐荧光体和硅酸盐荧光体中的至少一种的荧光体粉末混合，制成荧光体粉末分散在玻璃粉末中的混合粉末，加热和软化混合粉末以提供一体化材料，随后固化一体化材料以提供荧光体分散玻璃，并将磷光体分散玻璃熔融粘合到通过热压安装有发光元件的安装部分并且将发光元件与分散有荧光体的玻璃同时密封在安装部上。

13. 发明申请

US20100203658A1 Method of manufacturing light-emitting device 有权
标题翻译：制造发光装置的方法
公开(公告)号：US20100203658A1
公开(公告)日：2010-08-12
申请号：US12656670
申请日：2010-02-12
申请人： Kazuya Aida , Hiroki Watanabe , Seiji Yamaguchi , Yoshinobu Suehiro
发明人： Kazuya Aida , Hiroki Watanabe , Seiji Yamaguchi , Yoshinobu Suehiro
IPC分类号： H01L33/00
CPC分类号： H01L33/52 , H01L33/56 , H01L2224/05001 , H01L2224/05023 , H01L2224/05144 , H01L2224/05155 , H01L2224/05568 , H01L2224/05573 , H01L2224/05644 , H01L2224/16225 , H01L2924/00014
摘要： A method of manufacturing a light-emitting device includes, when sealing a light-emitting element on a mounting portion by a glass material softened by heating or when processing the glass material after the sealing, producing a concave portion partially on the glass material by partially contacting and pressing a die against an upper surface of the glass material such that a part of the upper surface being not in contact with the die is deformed and forms a curved surface.
摘要翻译：制造发光器件的方法包括：当通过加热软化的玻璃材料或在密封后加工玻璃材料将安装部分上的发光元件密封时，通过部分地在玻璃材料上部分地形成凹部将模具接触并压靠玻璃材料的上表面，使得与模具不接触的上表面的一部分变形并形成弯曲表面。

14. 发明申请

US20090186433A1 Method of making phosphor containing glass plate, method of making light emitting device 有权
标题翻译：制造含有玻璃板的荧光体的方法，制造发光器件的方法
公开(公告)号：US20090186433A1
公开(公告)日：2009-07-23
申请号：US12318150
申请日：2008-12-22
申请人： Seiji Yamaguchi , Takashi Nonogawa , Yoshinobu Suehiro , Hiroki Watanabe , Kazuya Aida
发明人： Seiji Yamaguchi , Takashi Nonogawa , Yoshinobu Suehiro , Hiroki Watanabe , Kazuya Aida
IPC分类号： H01L21/00 , C03B19/00
CPC分类号： C03B19/063 , C03C8/24 , C03C14/004 , C03C14/006 , C03C27/00 , C09K11/7734 , C09K11/7741 , H01L24/97 , H01L33/501 , H01L2224/05023 , H01L2224/0508 , H01L2224/05124 , H01L2224/05568 , H01L2224/05573 , H01L2224/05644 , H01L2224/13 , H01L2924/12041 , H01L2924/15787 , H01L2924/181 , H01L2933/0041 , Y02P40/57 , H01L2924/00 , H01L2924/00014
摘要： A method of making a light emitting device includes mixing a glass powder with a phosphor powder including at least one of a sulfide phosphor, an aluminate phosphor and a silicate phosphor to produce a mixed powder in which the phosphor powder is dispersed in the glass powder, heating and softening the mixed powder to provide an integrated material, and subsequently solidifying the integrated material to provide a phosphor-dispersed glass, and fusion-bonding the phosphor-dispersed glass onto a mounting portion on which a light emitting element is mounted by hot pressing, and simultaneously sealing the light emitting element with the phosphor-dispersed glass on the mounting portion.
摘要翻译：制造发光器件的方法包括：将玻璃粉末与包含硫化物荧光体，铝酸盐荧光体和硅酸盐荧光体中的至少一种的荧光体粉末混合，制成荧光体粉末分散在玻璃粉末中的混合粉末，加热和软化混合粉末以提供一体化材料，随后固化一体化材料以提供荧光体分散玻璃，并将磷光体分散玻璃熔融粘合到通过热压安装有发光元件的安装部分并且将发光元件与分散有荧光体的玻璃同时密封在安装部上。

15. 发明申请

US20110114989A1 Light-emitting device, method of manufacturing the same, method of mounting the same and lighting device 有权
标题翻译：发光装置及其制造方法，其安装方法和照明装置
公开(公告)号：US20110114989A1
公开(公告)日：2011-05-19
申请号：US12926253
申请日：2010-11-04
申请人： Yoshinobu Suehiro , Seiji Yamaguchi , Katsunori Arakane , Koji Tasumi
发明人： Yoshinobu Suehiro , Seiji Yamaguchi , Katsunori Arakane , Koji Tasumi
IPC分类号： H01L33/56 , H01L21/603
CPC分类号： H01L33/56 , H01L24/97 , H01L25/0753 , H01L33/486 , H01L33/54 , H01L2224/16225 , H01L2924/01322 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2933/005 , H01L2924/00
摘要： A method of manufacturing a light-emitting device includes a hole forming process for forming a through-hole that continues from a front surface to a back surface of a mounting substrate, a pattern forming process for continuously forming a circuit pattern on an inner surface of the through-hole in the mounting substrate, from an end portion of the through-hole on the front surface of the mounting substrate to a mounting portion of a light-emitting element, and on a periphery of the through-hole on the back surface of the mounting substrate, a mounting process for mounting the light-emitting element on the mounting portion, and a hot pressing process in that an inorganic material softened by heating is placed on the surface of the mounting substrate and is advanced into the through-hole while sealing the light-emitting element by pressing and bonding the inorganic material to the surface of the mounting substrate.
摘要翻译：一种制造发光器件的方法包括用于形成从安装基板的前表面延伸到后表面的通孔的孔形成工艺，用于在内表面上连续形成电路图案的图案形成工艺安装基板中的通孔，从安装基板的前表面上的通孔的端部到发光元件的安装部，并且在后表面上的通孔的周边的安装基板，将发光元件安装在安装部上的安装工序以及通过加热软化的无机材料配置在安装基板的表面上并进入通孔的热压工序同时通过将无机材料压入和粘合到安装基板的表面来密封发光元件。

16. 发明申请

US20080032142A1 Light emitting device, method of making the same, and light source device comprising the same 审中-公开
标题翻译：发光装置及其制造方法以及包含该发光装置的光源装置
公开(公告)号：US20080032142A1
公开(公告)日：2008-02-07
申请号：US11882599
申请日：2007-08-02
申请人： Koji Tasumi , Yoshinobu Suehiro , Seiji Yamaguchi
发明人： Koji Tasumi , Yoshinobu Suehiro , Seiji Yamaguchi
IPC分类号： B32B9/04 , C09K11/70
CPC分类号： H01L33/56 , H01L33/507 , H01L33/54 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/13 , H01L2924/00014 , Y10T428/31663 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A light emitting device has a light emitting element mounted on a substrate, a glass member sealing the light emitting element, a transparent member to transmit light emitted from the light emitting device, the transparent member being positioned outside the glass member, and a powdery phosphor attached to an inner surface, an outer surface or both of the inner surface and outer surface of the transparent member.
摘要翻译：发光装置具有安装在基板上的发光元件，密封发光元件的玻璃构件，透明构件，用于透射从发光装置发射的光，透明构件位于玻璃构件外部，以及粉末状荧光体连接到透明构件的内表面，外表面或内表面和外表面两者。

17. 发明授权

US09653661B2 Light-emitting device, method of manufacturing the same, method of mounting the same and lighting device 有权
公开(公告)号：US09653661B2
公开(公告)日：2017-05-16
申请号：US12926253
申请日：2010-11-04
申请人： Yoshinobu Suehiro , Seiji Yamaguchi , Katsunori Arakane , Koji Tasumi
发明人： Yoshinobu Suehiro , Seiji Yamaguchi , Katsunori Arakane , Koji Tasumi
IPC分类号： H01L21/603 , H01L33/56 , H01L33/54 , H01L23/00 , H01L25/075 , H01L33/48
CPC分类号： H01L33/56 , H01L24/97 , H01L25/0753 , H01L33/486 , H01L33/54 , H01L2224/16225 , H01L2924/01322 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2933/005 , H01L2924/00
摘要： A method of manufacturing a light-emitting device includes a hole forming process for forming a through-hole that continues from a front surface to a back surface of a mounting substrate, a pattern forming process for continuously forming a circuit pattern on an inner surface of the through-hole in the mounting substrate, from an end portion of the through-hole on the front surface of the mounting substrate to a mounting portion of a light-emitting element, and on a periphery of the through-hole on the back surface of the mounting substrate, a mounting process for mounting the light-emitting element on the mounting portion, and a hot pressing process in that an inorganic material softened by heating is placed on the surface of the mounting substrate and is advanced into the through-hole while sealing the light-emitting element by pressing and bonding the inorganic material to the surface of the mounting substrate.

18. 发明授权

US07872410B2 Light emitting device and light emitter 有权
标题翻译：发光装置和发光二极管
公开(公告)号：US07872410B2
公开(公告)日：2011-01-18
申请号：US12081392
申请日：2008-04-15
申请人： Koji Tasumi , Yoshinobu Suehiro , Seiji Yamaguchi
发明人： Koji Tasumi , Yoshinobu Suehiro , Seiji Yamaguchi
IPC分类号： H01J63/04
CPC分类号： H01L33/501 , F21K9/00 , G02B6/0023 , G02B6/003 , G02B6/0031 , G02B6/0068 , G02B6/0073 , G02B6/0083 , H01L25/0753 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2924/00014 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A light emitting device includes a light emitting element, a substrate with a flat mounting surface for mounting the light emitting element thereon, a sealing part for the light emitting element on the mounting surface of the substrate. The sealing part is formed of glass including a phosphor to be excited by light emitted from the light emitting element to radiate a wavelength conversion light. The sealing part is shaped like a rectangular solid wherein a lateral length is defined as a distance between a center of a bottom surface of the sealing part bonded to the mounting surface and a side face perpendicular to the mounting surface, a vertical length is defined as a distance between the mounting surface and a top surface of the sealing part, and at least one of the lateral length is longer than the vertical length. The device further includes a transparent member formed on the top surface of the sealing part. The transparent member includes the phosphor at a concentration higher than the sealing part.
摘要翻译：发光装置包括发光元件，具有用于将发光元件安装在其上的平坦安装表面的基板，在基板的安装表面上的发光元件的密封部。密封部由包含荧光体的玻璃构成，该荧光体被从发光元件发射的光激发，以发射波长转换光。密封部分的形状类似于矩形固体，其中横向长度被定义为接合到安装表面的密封部分的底面的中心与垂直于安装表面的侧面之间的距离，垂直长度被定义为所述安装表面与所述密封部分的顶表面之间的距离，并且所述横向长度中的至少一个长于所述垂直长度。该装置还包括形成在密封部分的顶表面上的透明构件。透明构件包括浓度高于密封部分的荧光体。

19. 发明授权

US08860057B2 Light emitting device and manufacturing method of the same 有权
标题翻译：发光器件及其制造方法相同
公开(公告)号：US08860057B2
公开(公告)日：2014-10-14
申请号：US13550529
申请日：2012-07-16
申请人： Seiji Yamaguchi , Koji Tasumi
发明人： Seiji Yamaguchi , Koji Tasumi
IPC分类号： H01L33/00 , H01L33/50 , H01L33/54 , C03B19/06 , H01L25/075 , H01L33/56
CPC分类号： H01L25/0753 , C03B19/063 , H01L33/50 , H01L33/54 , H01L33/56 , H01L2224/16225 , Y02P40/57
摘要： The light emitting device 10 comprises a mounting substrate 11, LED chips 20 flip-chip bonded on the mounting substrate 11, and a glass sealing member 30 made of a plate-shaped glass material that seals the LED chips 20 formed on the mounting substrate 11. Here, the glass sealing member 30 is in a state in which fine voids are almost evenly dispersed and distributed between the powder grains of the glass material, and the powder grains are connected with each other, and the fine bumps/dips 30a are almost evenly dispersed and distributed on the surface of the glass sealing member 30.
摘要翻译：发光装置10包括安装基板11，贴合在安装基板11上的LED芯片20以及由形成在安装基板11上的LED芯片20的板状玻璃材料制成的玻璃密封部件30 这里，玻璃密封构件30处于微小的空隙几乎均匀地分散并分布在玻璃材料的粉末颗粒之间并且粉末颗粒彼此连接的状态，并且微小的凸起/凹陷30a几乎均匀分散并分布在玻璃密封件30的表面上。

20. 发明申请

US20130075767A1 LIGHT EMITTING DEVICE AND MANUFACTURING METHOD OF THE SAME 有权
标题翻译：发光装置及其制造方法
公开(公告)号：US20130075767A1
公开(公告)日：2013-03-28
申请号：US13550529
申请日：2012-07-16
申请人： Seiji Yamaguchi , Koji Tasumi
发明人： Seiji Yamaguchi , Koji Tasumi
IPC分类号： H01L33/48 , C03B23/203 , C03B19/06
CPC分类号： H01L25/0753 , C03B19/063 , H01L33/50 , H01L33/54 , H01L33/56 , H01L2224/16225 , Y02P40/57
摘要： The light emitting device 10 comprises a mounting substrate 11, LED chips 20 flip-chip bonded on the mounting substrate 11, and a glass sealing member 30 made of a plate-shaped glass material that seals the LED chips 20 formed on the mounting substrate 11. Here, the glass sealing member 30 is in a state in which fine voids are almost evenly dispersed and distributed between the powder grains of the glass material, and the powder grains are connected with each other, and the fine bumps/dips 30a are almost evenly dispersed and distributed on the surface of the glass sealing member 30.
摘要翻译：发光装置10包括安装基板11，贴合在安装基板11上的LED芯片20以及由形成在安装基板11上的LED芯片20的板状玻璃材料制成的玻璃密封部件30 这里，玻璃密封构件30处于微小的空隙几乎均匀地分散并分布在玻璃材料的粉末颗粒之间并且粉末颗粒彼此连接的状态，并且微小的凸起/凹陷30a几乎均匀分散并分布在玻璃密封件30的表面上。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式