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    • 12. 发明授权
    • Semiconductor memory device having hierarchy control circuit
architecture of master/local control circuits permitting high speed
accessing
    • 具有允许高速存取的主/局部控制电路的层级控制电路结构的半导体存储器件
    • US5894448A
    • 1999-04-13
    • US944642
    • 1997-10-06
    • Teruhiko AmanoMasaki Tsukude
    • Teruhiko AmanoMasaki Tsukude
    • G11C11/41G11C5/02G11C5/06G11C11/401H01L21/8242H01L27/108G11C8/00
    • G11C5/063G11C5/025
    • Memory mats provided in four regions formed by dividing a semiconductor chip are each further divided into a plurality of memory arrays along the longer side direction of the chip, row related circuits are provided between the memory arrays along the shorter side direction of the chip, and column decoders are provided along the longer side direction of the chip. An internal control signal from a master control circuit in the central part of the chip is transmitted in the central region with respect to the shorter side direction of the chip, buffer circuits are provided to an internal control signal transmission bus, and an internal signal is transmitted to the row related circuit and the column decoder by the buffer circuit. The length of the signal line to drive is shortened, and therefore the signal can be transmitted at a high speed, thus enabling high speed accessing. Thus, signal propagation delay can be reduced even if the chip size increases.
    • 设置在通过划分半导体芯片形成的四个区域中的存储器垫每个被进一步沿着芯片的较长边方向分成多个存储器阵列,行相关电路沿着芯片的较短边方向设置在存储器阵列之间,并且 沿芯片的长边方向设置列解码器。 来自芯片中心的主控制电路的内部控制信号相对于芯片的短边方向在中央区域传输,缓冲电路被提供给内部控制信号传输总线,内部信号为 通过缓冲电路传输到行相关电路和列解码器。 要驱动的信号线的长度被缩短,因此可以高速传输信号,从而实现高速访问。 因此,即使芯片尺寸增加,也可以降低信号传播延迟。
    • 16. 发明授权
    • Semiconductor circuit device having triple-well structure in semiconductor substrate, method of fabricating the same, and mask device for fabrication of the same
    • 在半导体衬底中具有三重阱结构的半导体电路器件及其制造方法及其制造用掩模器件
    • US06194776B1
    • 2001-02-27
    • US08850111
    • 1997-05-01
    • Teruhiko AmanoMasaki Tsukude
    • Teruhiko AmanoMasaki Tsukude
    • H01L2900
    • H01L21/823493H01L21/761H01L29/1079H01L29/1087Y10S257/901
    • A semiconductor circuit device having a triple-well structure wherein a predetermined potential level is supplied to a top well without a contact region formed in the top well is disclosed. In an N-type ion implantation step for forming an N-type well region (1) in a P-type semiconductor substrate (5), a mask of a predetermined configuration is used so that ions are not implanted into a region of a portion which is to serve as a bottom portion (1B) of the well region (1). Then, the N-type well region (1) is formed which is shaped such that a portion (6) having P-type properties remains partially in the bottom portion (1B). The P-type portion (6) establishes electrical connection between a P-type well region (2) and the semiconductor substrate (5) to permit the potential applied to a contact region (4) to be supplied to the well region (2) therethrough. The portion (6) may include a plurality of portions (6) which allow uniform potential supply. This structure may be applied to basic cells of a memory cell array block.
    • 公开了一种具有三阱结构的半导体电路器件,其中将预定电位电平提供给顶部阱,而不形成在顶部阱中的接触区域。 在用于在P型半导体衬底(5)中形成N型阱区(1)的N型离子注入步骤中,使用预定构造的掩模,使得离子不被注入到部分的区域中 其用作井区(1)的底部(1B)。 然后,形成N型阱区域(1),其形状使得具有P型特性的部分(6)部分地保留在底部(1B)中。 P型部分(6)建立P型阱区(2)和半导体衬底(5)之间的电连接,以允许施加到接触区(4)的电势被提供给阱区(2) 通过。 部分(6)可以包括允许均匀电势供应的多个部分(6)。 该结构可以应用于存储单元阵列块的基本单元。