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    • 12. 发明授权
    • Switching power-supply module
    • 开关电源模块
    • US07403397B2
    • 2008-07-22
    • US10746660
    • 2003-12-26
    • Tadahiko MatsumotoSyuichi HondaYasuo OhashiNaoto Sano
    • Tadahiko MatsumotoSyuichi HondaYasuo OhashiNaoto Sano
    • H05K1/14
    • H02M7/003H02M3/33538H02M2001/0074H05K1/144H05K3/3405H05K3/3421H05K3/368H05K2201/10386
    • A switching power-supply module includes circuit boards, power conversion circuit sections provided on the respective circuit boards, conductor land patterns provided with spacing therebetween along edges of the circuit boards, conductor terminals for interconnecting the conductor land patterns. The circuit boards are stacked with spacing therebetween with the corresponding conductor land patterns being aligned, and the aligned conductor land patterns are interconnected by the corresponding conductor terminals. At least one of the conductor terminals includes an interboard-connection portion for interconnecting the conductor land patterns of the circuit boards and a leg portion that extends from the interboard-connection portion in the stacking direction of the circuit boards and that defines an external-connection portion, and the other conductor terminals each function as an interboard-connection dedicated terminal for providing connection between the circuit boards.
    • 开关电源模块包括电路板,设置在各个电路板上的功率转换电路部分,沿着电路板的边缘设置有间隔的导体焊盘图案,用于互连导体焊盘图案的导体端子。 电路板之间具有间隔地堆叠,相应的导体焊盘图案对准,并且对准的导体焊盘图案通过相应的导体端子互连。 至少一个导体端子包括用于互连电路板的导体焊盘图案的板间连接部分和从电路板的堆叠方向上从板间连接部分延伸的脚部分,并且限定外部连接 部分,其他导体端子各自用作板间连接专用端子,用于提供电路板之间的连接。
    • 15. 发明授权
    • Exposure apparatus and device manufacturing method
    • 曝光装置和装置制造方法
    • US5846678A
    • 1998-12-08
    • US576694
    • 1995-12-21
    • Hidetoshi NishigoriNaoto Sano
    • Hidetoshi NishigoriNaoto Sano
    • G03F7/20H01L21/027G03B27/72
    • G03F7/70058G03F7/70358G03F7/70558
    • An exposure apparatus for transferring, by exposure, a pattern of a mask onto a wafer, includes a pulse light source and a scanning system for relatively and scanningly moving the mask and the wafer relative to an illumination region to be defined by pulses of light to be sequentially provided by the pulse light source, wherein the number of pulses for exposure of the wafer is determined on the basis of information representing a relation between the pulse number and exposure non-uniformness, and wherein the pulse number is expressed by L/.DELTA.X where L is the width of the illumination region in a scan direction and .DELTA.X is the amount of relative displacement of the illumination region moving in the light emission interval of one pulse.
    • 用于通过曝光将掩模图案曝光于晶片上的曝光装置包括脉冲光源和扫描系统,用于相对于扫描和扫描地移动掩模和晶片相对于由光脉冲定义的照明区域的扫描系统 由脉冲光源依次提供,其中基于表示脉冲数和曝光不均匀性之间的关系的信息确定用于晶片曝光的脉冲数,并且其中脉冲数由L / DELTA X,其中L是扫描方向上的照明区域的宽度,DELTA X是在一个脉冲的发光间隔中移动的照明区域的相对位移量。
    • 20. 发明授权
    • Exposure apparatus with a pulsed laser
    • 带脉冲激光的曝光装置
    • US06348357B2
    • 2002-02-19
    • US09285672
    • 1999-04-05
    • Naoto Sano
    • Naoto Sano
    • H01L2166
    • G03F7/70575G03F7/70241Y10S438/942
    • A semiconductor device manufacturing method includes the steps of providing a projection exposure apparatus, exposing a wafer by using the projection exposure apparatus, the exposing step including projecting a circuit pattern onto the wafer through the projection optical system using light from a first laser, and developing the exposed wafer. Before the providing step, an optical performance of the projection optical system is measured by producing an interference fringe, bearing information related to aberration of the projection optical system, by use of a harmonic of a second laser having a coherency higher than that of the first laser, and then by analyzing the interference fringe. A wavelength of the light from the first laser is registered with that of the harmonic of the second laser.
    • 半导体器件制造方法包括以下步骤:提供投影曝光装置,通过使用投影曝光装置曝光晶片;曝光步骤包括使用来自第一激光的光通过投影光学系统将电路图案投影到晶片上,并且显影 暴露的晶圆。 在提供步骤之前,投影光学系统的光学性能通过使用具有高于第一像素的相干性的第二激光器的谐波产生干涉条纹,与投影光学系统的像差相关的轴承信息来测量 激光,然后通过分析干涉条纹。 来自第一激光器的光的波长与第二激光器的谐波的波长对应。