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    • 11. 发明申请
    • Organosilicon compound
    • 有机硅化合物
    • US20050101791A1
    • 2005-05-12
    • US11015024
    • 2004-12-20
    • Toshiyuki OzaiHiroyasu HaraYoshifumi InoueTomoyuki Goto
    • Toshiyuki OzaiHiroyasu HaraYoshifumi InoueTomoyuki Goto
    • C07F7/08C07F7/18
    • C07F7/1804
    • An organosilicon compound represented by the following general formula (1): wherein R1 is a hydrogen atom, a phenyl group or a halogenated phenyl group; R2 is a hydrogen atom or a methyl group; R3's are each a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms; X is a hydrolyzable group; Z1 is —R4—, —R4O— or —R4(CH3)2SiO—, where R4 is a substituted or unsubstituted divalent hydrocarbon group having 1 to 10 carbon atoms; Z2 is an oxygen atom or a substituted or unsubstituted divalent hydrocarbon group having 1 to 10 carbon atoms; and m is 0, 1 or 2 and n is 0, 1 or 2. When incorporated in silicone compositions, the organosilicon compound acts as a cross-linking agent having well-balanced photopolymerizability and condensation curability.
    • 由以下通式(1)表示的有机硅化合物:其中R 1是氢原子,苯基或卤代苯基; R 2是氢原子或甲基; R 3各自为取代或未取代的碳原子数为1〜10的一价烃基; X是可水解基团; Z 1是-R 4 - , - R 4 O-或-R 4(CH 3) 3 SiO 2,其中R 4是取代或未取代的具有1至10个碳原子的二价烃基; Z 2是氧原子或取代或未取代的碳原子数为1〜10的二价烃基; 并且m为0,1或2,n为0,1或2.当掺入有机硅组合物中时,有机硅化合物用作具有良好平衡光聚合性和缩合固化性的交联剂。
    • 14. 发明授权
    • Organosilicon compound
    • 有机硅化合物
    • US07045572B2
    • 2006-05-16
    • US11015024
    • 2004-12-20
    • Toshiyuki OzaiHiroyasu HaraYoshifumi InoueTomoyuki Goto
    • Toshiyuki OzaiHiroyasu HaraYoshifumi InoueTomoyuki Goto
    • C08G77/06
    • C07F7/1804
    • An organosilicon compound represented by the following general formula (1): wherein R1 is a hydrogen atom, a phenyl group or a halogenated phenyl group; R2 is a hydrogen atom or a methyl group; R3's are each a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms; X is a hydrolyzable group; Z1 is —R4—, —R4O— or —R4(CH3)2SiO—, where R4 is a substituted or unsubstituted divalent hydrocarbon group having 1 to 10 carbon atoms; Z2 is an oxygen atom or a substituted or unsubstituted divalent hydrocarbon group having 1 to 10 carbon atoms; and m is 0, 1 or 2 and n is 0, 1 or 2. When incorporated in silicone compositions, the organosilicon compound acts as a cross-linking agent having well-balanced photopolymerizability and condensation curability.
    • 由以下通式(1)表示的有机硅化合物:其中R 1是氢原子,苯基或卤代苯基; R 2是氢原子或甲基; R 3各自为取代或未取代的碳原子数为1〜10的一价烃基; X是可水解基团; Z 1是-R 4 - , - R 4 O-或-R 4(CH 3) 3 SiO 2,其中R 4是取代或未取代的具有1至10个碳原子的二价烃基; Z 2是氧原子或取代或未取代的碳原子数为1〜10的二价烃基; 并且m为0,1或2,n为0,1或2.当掺入有机硅组合物中时,有机硅化合物用作具有良好平衡光聚合性和缩合固化性的交联剂。
    • 18. 发明授权
    • Organosilicon compound
    • 有机硅化合物
    • US06849755B2
    • 2005-02-01
    • US09983933
    • 2001-10-26
    • Toshiyuki OzaiHiroyasu HaraYoshifumi InoueTomoyuki Goto
    • Toshiyuki OzaiHiroyasu HaraYoshifumi InoueTomoyuki Goto
    • C07F7/08C07F7/18C07F7/04
    • C07F7/1804
    • An organosilicon compound represented by the following general formula (1): wherein R1 is a hydrogen atom, a phenyl group or a halogenated phenyl group; R2 is a hydrogen atom or a methyl group; R3's are each a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms; X is a hydrolyzable group; Z1 is —R4—, —R4O— or —R4(CH3)2SiO—, where R4 is a substituted or unsubstituted divalent hydrocarbon group having 1 to 10 carbon atoms; Z2 is an oxygen atom or a substituted or unsubstituted divalent hydrocarbon group having 1 to 10 carbon atoms; and m is 0, 1 or 2 and n is 0, 1 or 2. When incorporated in silicone compositions, the organosilicon compound acts as a cross-linking agent having well-balanced photopolymerizability and condensation curability.
    • 由以下通式(1)表示的有机硅化合物:其中R 1是氢原子,苯基或卤代苯基; R 2是氢原子或甲基; R 3各自为取代或未取代的碳原子数为1〜10的一价烃基; X是可水解基团; Z 1是-R 4 - ,-R 4 O-或-R 4(CH 3)2 SiO - ,其中R 4是具有1至10个碳原子的取代或未取代的二价烃基 ; Z 2是氧原子或具有1〜10个碳原子的取代或未取代的二价烃基; 并且m为0,1或2,n为0,1或2.当掺入有机硅组合物中时,有机硅化合物充当具有良好平衡的光聚合性和冷凝固化性的交联剂。
    • 19. 发明授权
    • Method for reducing a surface glossiness of an organopolysiloxane-cured article
    • 降低有机聚硅氧烷固化物的表面光泽度的方法
    • US08142698B2
    • 2012-03-27
    • US12956989
    • 2010-11-30
    • Toshiyuki OzaiMitsuhiro Iwata
    • Toshiyuki OzaiMitsuhiro Iwata
    • B29C47/00B28B1/14
    • C08L83/04C08G77/12C08G77/20C08K7/22Y10T428/24372Y10T428/24421Y10T428/31663C08L83/00
    • A method of reducing a surface glossiness of an organopolysiloxane-cured article is provided. The method comprises preparing the liquid organopolysiloxane composition for matting comprising: (A) 100 parts by weight of a thermosetting liquid organopolysiloxane composition having a specific gravity larger than the component (B), and (B) 0.1 to 100 parts by weight of a hollow filler having a melting point of at least 150° C., and a particle size of up to 200 μm, casting the liquid organopolysiloxane composition as a potting material or coating material; and curing the liquid organopolysiloxane composition at a temperature of 10 to 160 C for 30 to 180 minutes, whereby the hollow filler floats to the surface of the organopolysiloxane and forms surface irregularities on the surface of the cured article during curing to provide a surface glossiness of up to 40 in a cured article having a matted surface.
    • 提供了降低有机聚硅氧烷固化物的表面光泽度的方法。 该方法包括制备用于消光的液体有机基聚硅氧烷组合物,其包括:(A)100重量份比重大于组分(B)的热固性液体有机基聚硅氧烷组合物,和(B)0.1至100重量份的中空 填料的熔点至少为150℃,粒径可达200​​μm,将液体有机基聚硅氧烷组合物浇铸成灌封材料或涂料; 并在10至160℃的温度下固化液体有机基聚硅氧烷组合物30至180分钟,由此中空填料漂浮到有机聚硅氧烷的表面,并在固化期间在固化物的表面上形成表面凹凸,以提供表面光泽度 在具有无光表面的固化制品中至多40个。